Abstract: A substrate structure of a semiconductor package is proposed. The structure includes a substrate with at least one opening; a grounding ring formed on the substrate and around the opening; and a plurality of plating through holes (PTH) formed in the substrate and corresponding to the grounding ring. The grounding area is increased by the grounding ring, so that the grounding quality of the substrate in package is improved. Meanwhile, it also simplifies the process, increases process yield and reduces cost of the process.

Abstract: A circuit board structure and a method for fabricating the same are proposed in the present invention. Firstly, a core layer covered with a first metal layer on a surface thereof is provided. Also, the core layer is formed with at least one through hole penetrating therethrough. A second metal layer is formed on a surface of the core layer and a wall of the through hole, such that a plated through hole can be formed penetrating through the core layer. Then, a filling material is filled in the plated through hole. A surface of the second metal layer is thinned to expose the first metal layer. A resist layer is formed on the first metal layer on the surface of the core layer by a circuit patterning process, such that a patterned circuit layer can be subsequently formed by an electrical plating process. Moreover, the circuit layer formed on the surface of the core layer can be electrically connected by the means of the plated through hole.