Abstract: A method includes forming a first package component, which formation process includes forming a first plurality of openings in a first dielectric layer, depositing a first metallic material into the first plurality of openings, performing a planarization process on the first metallic material and the first dielectric layer to form a plurality of metal pads in the first dielectric layer, and selectively depositing a second metallic material on the plurality of metal pads to form a plurality of bond pads. The first plurality of bond pads comprise the plurality of metal pads and corresponding parts of the second metallic material. The first package component is bonded to a second package component.

Abstract: Highly purified polyvinyl alcohol (PVA) which meets the standard of pharmaceutical grade is provided. The PVA has of less than 0.1 wt % of residual methanol, less than 0.1 wt % of residual methyl acetate, and less than 0.3 wt % of residual sodium acetate. A method for obtaining highly purified PVA is further provided.