Abstract: The present invention relates to a mounting method of passive component, and particularly relates to a mounting method of a small-size passive component. A passive component partially covered by an adhesive material is provided. Before the adhesive layer is melted, the adhesive material is melted and then solidified to form a fixing structure between the passive component and a substrate for fixing the passive component on the substrate. Therefore, the tombstone problem caused by uneven pulling force that the melted solder applies to the two ends of the passive component is effectively solved. The yield rate is increased, and the product loss is reduced.

Abstract: An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.

Abstract: An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.

Abstract: The present invention relates to a mounting method of passive component, and particularly relates to a mounting method of a small-size passive component. A passive component partially covered by an adhesive material is provided. Before the adhesive layer is melted, the adhesive material is melted and then solidified to form a fixing structure between the passive component and a substrate for fixing the passive component on the substrate. Therefore, the tombstone problem caused by uneven pulling force that the melted solder applies to the two ends of the passive component is effectively solved. The yield rate is increased, and the product loss is reduced.