Patents by Inventor Wen-Shuo TSAI

Wen-Shuo TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10811756
    Abstract: A method to design and assemble a connector for the transition between a coaxial cable and a microstrip line involves in connecting a coaxial connector in series with a metallic ring to form a new coaxial connector, wherein the thickness of the metallic ring and the diameter of its through hole are important design parameters to determine the frequency response of the transition. By properly selecting their values and connecting the new coaxial connector to the microstrip line, a resonant response caused by the excitation of the first higher-order mode of the original coaxial connector is attenuated or eliminated from the frequency response.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: October 20, 2020
    Assignee: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY
    Inventors: Eric S. Li, Hung-Yi Wu, Wen-Shuo Tsai
  • Publication number: 20170352937
    Abstract: A method to design and assemble a connector for the transition between a coaxial cable and a microstrip line involves in connecting a coaxial connector in series with a metallic ring to form a new coaxial connector, wherein the thickness of the metallic ring and the diameter of its through hole are important design parameters to determine the frequency response of the transition. By properly selecting their values and connecting the new coaxial connector to the microstrip line, a resonant response caused by the excitation of the first higher-order mode of the original coaxial connector can be attenuated or even eliminated from the frequency response. Thus, the method improves the insertion loss of the transition at high frequencies, and increases its 1-dB passband. Note that the signal line of the microstrip line is not inserted into the through hole of the metallic ring in the final assembly of the transition.
    Type: Application
    Filed: May 10, 2017
    Publication date: December 7, 2017
    Applicant: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY
    Inventors: Eric S. LI, Hung-Yi WU, Wen-Shuo TSAI