Patents by Inventor Wen-Shyong Kuo

Wen-Shyong Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation structures
    Publication number: 20080171194
    Abstract: A heat dissipation structure is provided. The heat dissipation structure comprises a carbon substrate and a metal layer which at least partially covers the sidewall of the carbon substrate. The metal layer covering the carbon substrate can not only increase the heat dissipation efficiency of the carbon substrate but can also eliminate the short circuiting of the elements when dust accumulates on them.
    Type: Application
    Filed: May 30, 2007
    Publication date: July 17, 2008
    Applicant: FENG CHIA UNIVERSITY
    Inventors: Tse-Hao Ko, Wen-Shyong Kuo, Hsin-Fang Lu, Su-Ching Yen, Yi-Lung Chiang