Abstract: An electromagnetic wave absorber including a substrate and a plurality of magnetic material bodies is provided. The plurality of magnetic material bodies are disposed on the substrate in an array, so that the electromagnetic wave absorber has a plurality of electromagnetic wave absorption frequencies in addition to an electromagnetic wave characteristic frequency of the plurality of magnetic material bodies. A ratio of one of the plurality of electromagnetic wave absorption frequencies to the electromagnetic wave characteristic frequency is greater than 1 and is less than or equal to 6.

Abstract: The present disclosure provides an electromagnetic wave absorbing material, including a core containing iron oxide having a first thermal expansion coefficient; and a shell layer covering the core, which has a second thermal expansion coefficient less than the first thermal expansion coefficient, and the shell layer contains an inorganic compound selected from a group consisting of oxides, nitrides or any combination thereof. The present disclosure further provides a composite structure for suppressing electromagnetic interference including the electromagnetic wave absorbing material as claimed.

Abstract: A magnetic material is provided. The magnetic material includes a core portion consisting of above 99 wt % of Fe, based on the total weight of the core portion. An alloy layer including a FeM alloy is disposed on the surface of the core portion, wherein M is Cr, Si, Al, Ti, Zr, or a combination thereof. An oxide layer including M and an oxide of M is disposed on the surface of the alloy layer. A magnetic component is also provided. The magnetic component includes a sintered product of the magnetic material and a metal.

Abstract: An electromagnetic interference (EMI) shielding device and manufacturing method thereof are provided. The EMI shielding device includes at least one ferrite material outer layer, a first and a second electrodes within the ferrite material outer layer, and a positive temperature coefficient resistor (PTCR) core layer sandwiched between the first and the second electrodes in the ferrite material outer layer. The first and the second electrodes extend to two ends of the ferrite material outer layer respectively.

Abstract: An electromagnetic interference (EMI) shielding device and manufacturing method thereof are provided. The EMI shielding device includes at least one ferrite material outer layer, a first and a second electrodes within the ferrite material outer layer, and a positive temperature coefficient resistor (PTCR) core layer sandwiched between the first and the second electrodes in the ferrite material outer layer. The first and the second electrodes extend to two ends of the ferrite material outer layer respectively.

Abstract: This invention discloses a monolithic inductor including a body made by compressing a magnetic powder, a coil positioned in the body, and a permanent magnet positioned in the body and in a magnetic circuit formed by applying current to the coil. The monolithic inductor of this invention includes the magnetic body containing the permanent magnet and the coil. The permanent magnet in the magnetic circuit (path of magnetic flux lines) formed by applying current to the coil generates a reverse-bias magnetic field, thereby increasing the operating range of the magnetic body, the saturation current of the magnetic body, and the rated current of the inductor.

Abstract: A flexible sheet with high magnetic permeability is disclosed, including a magnetic ferrite sintering sheet including a plurality of pieces separated by micro gaps and a first flexible layer attached to a first side of the magnetic ferrite sintering sheet, wherein the pieces of the magnetic ferrite sintering sheet include a first protruding and recessing structure and a second protruding and recessing structure at opposite sides of one of the micro gaps, and the first protruding and recessing structure and the second protruding and recessing structure are matched with each other.

Abstract: The present invention relates to a power inductor having a heat dissipating structure formed on the surface thereof, which comprises: at least a conducting wire; and a cladding, made of a magnetic material for wrapping the conductive wire, having the heat dissipating structure of embossed patterns formed on the surface thereof. Preferably, the embossed pattern can be a cone, a cuboid, a column, or the combination thereof. Moreover, the length of any edge or the diameter of any one of the embossed patterns is about 1%˜50% of that of the power inductor, and the height of any one of the embossed patterns is about 1%˜50% of the thickness of the power inductor.

Abstract: This invention discloses a monolithic inductor including a body made by compressing a magnetic powder, a coil positioned in the body, and a permanent magnet positioned in the body and in a magnetic circuit formed by applying current to the coil. The monolithic inductor of this invention includes the magnetic body containing the permanent magnet and the coil. The permanent magnet in the magnetic circuit (path of magnetic flux lines) formed by applying current to the coil generates a reverse-bias magnetic field, thereby increasing the operating range of the magnetic body, the saturation current of the magnetic body, and the rated current of the inductor.

Abstract: The present invention relates to a power inductor having a heat dissipating structure formed on the surface thereof, which comprises: at least a conducting wire; and a cladding, made of a magnetic material for wrapping the conductive wire, having the heat dissipating structure of embossed patterns formed on the surface thereof. Preferably, the embossed pattern can be a cone, a cuboid, a column, or the combination thereof. Moreover, the length of any edge or the diameter of any one of the embossed patterns is about 1%˜50% of that of the power inductor, and the height of any one of the embossed patterns is about 1%˜50% of the thickness of the power inductor.

Abstract: A miniaturized common mode EMI filter with a greatly simplified design so that it can be manufactured very economically. The common mode filter includes: (a) a magnetic main body; (b) a pair of substantially identical electrically conductive planar coils embedded in the magnetic main body; and (c) an insulative planar coil sandwiched between the pair of electrically conductive planar coils, wherein the insulative planar coil has a pattern that is substantially identical to and inclusive of the pattern of the electrically conductive planar coils so as to insulate the pair of electrically conductive planar coil from each other. The common mode filter retains low normal mode impedance and high common mode impedance, with a substantially reduced physical size, so that it can cost-effectively maintain a high fidelity of the normal mode waveform of signals for electronic devices that utilize differential transmission technology and keep the common mode EMI noise to a minimum.