Abstract: An assembling type sports instrument comprises a hollow column and a plurality of assembly parts. The hollow column includes an outer surface on the outer circumference thereof, an inner surface on the inner circumference thereof, and a plurality of column through-holes each penetrating the outer surface and the inner surface. Each assembly part includes a massage member and a connection member connected with the massage member. Each massage member comprises a construction at one end, which is far away from the connection member. Each connection member can be detachably connected with one of the column through-holes. While one assembly part is connected with the column through-hole, the construction thereof protrudes from the outer surface.

Abstract: A method for fabricating a slip-proof pattern on a sport instrument comprises steps: providing a sport instrument with at least one slip-proof surface; preparing a coating material comprising a paint and a foaming agent evenly mixed thereinside; using the coating material to draw a slip-proof pattern on the slip-proof surface, and keeping the sport instrument still until the slip-proof pattern is dried and fixed; and heating the slip-proof pattern to make the foaming agent of the coating material generate gas and make the slip-proof pattern expand and protrude from the slip-proof surface. The conventional technology fabricates slip-proof strips and a sport instrument into a one-piece component. The present invention replaces the conventional technology with a method of directly forming a slip-proof pattern in a drawing or spraying way to simplify the complicated process and reduce the cost.

Abstract: A packaging process of a light emitting diode (LED) is provided. First, an LED chip is bonded with a carrier to electrically connect to each other. After that, the carrier is heated to raise the temperature thereof. Next, an encapsulant is formed on the heated carrier by a dispensing process to encapsulate the LED chip, wherein the viscosity of the encapsulant before contacting the carrier is lower than that of the encapsulant after contacting the carrier. Thereafter, the encapsulant is cured.

Abstract: A packaging process of a light emitting diode (LED) is provided. First, an LED chip is bonded with a carrier to electrically connect to each other. After that, the carrier is heated to raise the temperature thereof. Next, an encapsulant is formed on the heated carrier by a dispensing process to encapsulate the LED chip, wherein the viscosity of the encapsulant before contacting the carrier is lower than that of the encapsulant after contacting the carrier. Thereafter, the encapsulant is cured.

Abstract: A packaging substrate having capacitors embedded therein, comprising: two capacitor disposition layers, each respectively consisting of a high dielectric layer and two first circuit layers disposed on two opposite surfaces of the high dielectric layer, wherein each of the first circuit layers has a plurality of electrode plates and a plurality of circuits; an adhesive layer disposed between the capacitor disposition layers to adhere the capacitor disposition layers to form a core board structure, wherein spaces between the circuits of every first circuit layer are filled with the adhesive layer; and a plurality of conductive through holes penetrating the capacitor disposition layers and the adhesive layer, and electrically connecting the circuits of the capacitor disposition layers respectively; wherein, pairs of the electrode plates on the opposite surfaces of each of the capacitor disposition layers are parallel and correspond to each other to form capacitors.