Patents by Inventor Wen-Tane LIAO

Wen-Tane LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor fabrication tool having gas manifold assembled by jig
    Patent number: 11587802
    Abstract: A method of processing a semiconductor wafer is provided. The method includes installing upper lid. The installation of the upper lid includes placing an inlet manifold on a water box; inserting a jig into a lower gas channel in the water box and inserting into an upper gas channel in the inlet manifold; fastening the water box to the inlet manifold; and removing the jig after the water box engaging with the inlet manifold. The method also includes connecting a shower head on a lower side of the water box; and connecting the upper lid to a housing. The method further includes placing a semiconductor wafer into the housing. In addition, the method includes supplying a process gas over the semiconductor wafer through the upper gas channel, the lower gas channel and the shower head.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: February 21, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Che Chen, Wen-Tane Liao, Ming-Hsien Lin, Wei-Chen Liao, Hai-Lin Lee, Chun-Yu Chen
  • SEMICONDUCTOR FABRICATION TOOL HAVING GAS MANIFOLD ASSEMBLED BY JIG
    Publication number: 20210134616
    Abstract: A method of processing a semiconductor wafer is provided. The method includes installing upper lid. The installation of the upper lid includes placing an inlet manifold on a water box; inserting a jig into a lower gas channel in the water box and inserting into an upper gas channel in the inlet manifold; fastening the water box to the inlet manifold; and removing the jig after the water box engaging with the inlet manifold. The method also includes connecting a shower head on a lower side of the water box; and connecting the upper lid to a housing. The method further includes placing a semiconductor wafer into the housing. In addition, the method includes supplying a process gas over the semiconductor wafer through the upper gas channel, the lower gas channel and the shower head.
    Type: Application
    Filed: January 22, 2020
    Publication date: May 6, 2021
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Che CHEN, Wen-Tane LIAO, Ming-Hsien LIN, Wei-Chen LIAO, Hai-Lin LEE, Chun-Yu CHEN