Patents by Inventor Wen Te (Hank) Hsu

Wen Te (Hank) Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250062565
    Abstract: Reliable connector assembly and housing thereof. The housing may include a first portion having first spaces for receiving first connectors and a second portion having second spaces connected to the first spaces for receiving second connectors configured to mate with the first connectors. The first portion comprises a platform comprising a surface in a plane perpendicular to the mating direction at an interface of the first portion and the second portion. Such a configuration reduces the risk of exerting excessive force onto the connectors and increase the reliability of the connector assembly.
    Type: Application
    Filed: August 13, 2024
    Publication date: February 20, 2025
    Applicant: Amphenol East Asia Limited (Hong Kong)
    Inventors: Mei-Chien Wu, Lo-Wen Lu, Wen Te Hsu
  • Publication number: 20250023296
    Abstract: A reliable socket connector. The connector includes an insulative body having a slot recessed from a mating face and terminals disposed in the insulative body having mating ends curving into the slot and tail ends extend thereout. A shell is disposed outside the insulative body. The shell has a mating portion extend beyond the mating face of the insulative body. The shell has a side wall comprising a docking portion and a guiding portion. The docking portion has holes configured for receiving a latch of a mating plug connector. The guiding portion extends beyond the docking portion in a mating direction and is configured for guiding the mating plug connector into the shell where a mating portion of the plug connector may then be guided into the slot of the insulative body.
    Type: Application
    Filed: July 12, 2024
    Publication date: January 16, 2025
    Applicant: Amphenol East Asia Limited (Hong Kong)
    Inventors: Mei-Chien Wu, Lo-Wen Lu, Wen Te Hsu
  • Publication number: 20240380162
    Abstract: Reliable connectors configured for easy locking/unlocking. A connector can include a first end configured to mate with a first mating component in a first direction, and a second end configured to mate with a second mating component in a second direction perpendicular to the first direction. The connector can include a locking member configured to move between locked and unlocked positions by a force applied in a third direction perpendicular to both the first and second directions. Such a configuration reduces the risk of interfering with connections between the mated components when applying the force and therefore provide more reliable connectors. The connectors can include a shell with a guiding structure to reduce the risk of damage to lightweight connectors that might otherwise be damaged due to misalignment during mating/unmating. Such a shell can be used with locking members configured for using within electronic systems with densely packed components.
    Type: Application
    Filed: May 9, 2024
    Publication date: November 14, 2024
    Applicant: Amphenol East Asia Limited (Hong Kong)
    Inventors: Mei-Chien Wu, Lo-Wen Lu, Wen-Te Hsu
  • Publication number: 20230404474
    Abstract: An evaluation method of sleep quality and a computing apparatus related to sleep quality are provided. In the evaluation method, sensing data is obtained. The sensing data is generated based on a radar echo. The sensing data is transformed into feature data. The feature data includes a statistic of a plurality of feature points on a waveform of the radar echo. Sleep quality information is determined according to the feature data. Accordingly, sleep quality may be evaluated through non-touch sensing.
    Type: Application
    Filed: March 27, 2023
    Publication date: December 21, 2023
    Applicants: Wistron Corporation, Taipei Medical University
    Inventors: Yu-Hsuan Ho, Yu-Wen Huang, Wen-Te Liu
  • Publication number: 20230396005
    Abstract: A connector configured to connect densely disposed cables to a board. The connector may include two or more rows of terminals held by a housing such that the two or more rows of terminals are at a same height with respect to a board that the connector would be mounted to. Such a configuration enables the connector to fit into a space limited by, for example, another component mounted to the board. The terminals may include first contact portions configured to be mounted onto a surface of the board when pressure is applied to the terminals so as to avoid the use of materials that may cause undesired shorting such as soldering materials. The terminals may include second contact portions configured to receive the cables. The second contact portions of ground terminals of a same row may be connected by a strip configured to contact shields of cables attached to the row.
    Type: Application
    Filed: October 22, 2021
    Publication date: December 7, 2023
    Applicants: Amphenol East Asia Ltd., Amphenol Commercial Products (Chengdu) Co., Ltd.
    Inventors: Yunxiang Liu, Jianke Zeng, Wen Te (a.k.a. Hank) Hsu
  • Patent number: 11764522
    Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: September 19, 2023
    Assignee: Amphenol East Asia Ltd.
    Inventors: Wen Te (Hank) Hsu, Sheng-Fen Sang
  • Patent number: 11264755
    Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: March 1, 2022
    Assignee: Amphenol East Asia Ltd.
    Inventor: Wen Te
  • Patent number: 11128092
    Abstract: A connector assembly configured for compact, high speed electronic systems. The assembly includes a board connector and a cable connector that may be mated by moving the cable connector in a mating direction perpendicular to a printed circuit board to which the board connector is mounted. The cable and board connectors may latch when mated and may be unlatched and unmated by pulling on a tab at a top of the cable connector in a direction opposite the mating direction. As a result, little clearance is required around the board connector to access the latching components. Such a connector may enable an electronic device with high signal integrity because the connector can be mounted close to an electronic component that processes high speed signals, providing a short, and high integrity signal paths for high speed signals.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: September 21, 2021
    Assignees: Amphenol AssembleTech (Xiamen) Co., Ltd, Amphenol East Asia Ltd.
    Inventors: Wen Chu Yang, Hui Tang, Zhenxing Liu, Lo-Wen Lu, Wen Te Hsu
  • Publication number: 20210218195
    Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.
    Type: Application
    Filed: March 29, 2021
    Publication date: July 15, 2021
    Applicant: Amphenol East Asia Ltd.
    Inventors: Wen Te (a.k.a. Hank) Hsu, Sheng-Fen Sang
  • Patent number: 10965064
    Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: March 30, 2021
    Assignee: Amphenol East Asia Ltd.
    Inventors: Wen Te Hsu, Sheng-Fen Sang
  • Patent number: 10938157
    Abstract: A connector assembly with latching provided by a rotating latch bar. The connector has a low height, with the rotating latch bar providing secure engagement between mated connectors of the connector assembly. The latch bar may be shaped to provide spring force that urges the mated connectors together. The connector assembly may be formed with a cable connector and a board connector. The low height of the board connector enables the connector to be mounted close to high speed electronic components, such as a processor, even if covered by a heat sink, as the connector may fit under the heat sink. The cable connector may be coupled, via a cable, to an I/O connector or other component remote from the high speed electronic component.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: March 2, 2021
    Assignees: Amphenol AssembleTech (Xiamen) Co., Ltd, Amphenol East Asia Ltd.
    Inventors: Wen Chu Yang, Hang Li, Shujian Wang, Hui Tang, Zhenxing Liu, Xiyin Zhou, Lo-Wen Lu, Wen Te Hsu
  • Publication number: 20200403350
    Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.
    Type: Application
    Filed: June 18, 2020
    Publication date: December 24, 2020
    Applicant: Amphenol East Asia Ltd.
    Inventor: Wen Te a.k.a. Hank Hsu
  • Publication number: 20200335914
    Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.
    Type: Application
    Filed: November 25, 2019
    Publication date: October 22, 2020
    Applicant: Amphenol East Asia Ltd.
    Inventors: Wen Te (a.k.a. Hank) Hsu, Sheng-Fen Sang
  • Patent number: 10785890
    Abstract: A handheld electronic device includes a case, an electronic unit and a cooling fan. The case includes at least one rib, an air inlet and a heat outlet. The at least one rib delimits a heat chamber. The air inlet and the heat outlet intercommunicate with an outside of the case. The electronic unit includes a heat source located in the heat chamber. The cooling fan is located in the heat chamber and includes an air entrance and an air exit. The air entrance intercommunicates with the air inlet of the case, and the air exit intercommunicates with the heat outlet of the case.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: September 22, 2020
    Assignee: Sunonwealth Electric Machine Industry Co., Ltd.
    Inventors: Alex Horng, Wen-Te Chang-Chien, Ching-Ting Pien
  • Publication number: 20200146178
    Abstract: A handheld electronic device includes a case, an electronic unit and a cooling fan. The case includes at least one rib, an air inlet and a heat outlet. The at least one rib delimits a heat chamber. The air inlet and the heat outlet intercommunicate with an outside of the case. The electronic unit includes a heat source located in the heat chamber. The cooling fan is located in the heat chamber and includes an air entrance and an air exit. The air entrance intercommunicates with the air inlet of the case, and the air exit intercommunicates with the heat outlet of the case.
    Type: Application
    Filed: January 30, 2019
    Publication date: May 7, 2020
    Inventors: Alex Horng, Wen-Te Chang-Chien, Ching-Ting Pien
  • Patent number: 10116152
    Abstract: A battery cartridge, a battery carrier module, and a battery charging system are provided. The battery cartridge includes a carrier case and a dismantable assembly. The battery cartridge has an accommodating space for accommodating a rechargeable battery. The accommodating space has a maximum width and a maximum depth, the rechargeable battery has a predetermined width and a predetermined depth. The dismantable assembly is disposed in the accommodating space of the carrier case. The dismantable assembly includes a width adjustment part and a depth adjustment part. The maximum width and the maximum depth of the accommodating space are respectively greater than the predetermined width and the predetermined depth of the rechargeable battery, and one of the width adjustment part and the depth adjustment part is disposed between the carrier case and the rechargeable battery so as to maintain the relative position between the rechargeable battery and the carrier case.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: October 30, 2018
    Inventor: Wen-Te Lin
  • Patent number: D825578
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: August 14, 2018
    Assignee: Silicon Power Computer & Communications Inc.
    Inventors: Mei-Ling Chiu, Wen-Te Shen
  • Patent number: D825579
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: August 14, 2018
    Assignee: Silicon Power Computer & Communications, Inc.
    Inventors: Mei-Ling Chiu, Wen-Te Shen
  • Patent number: D849000
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: May 21, 2019
    Assignee: Silicon Power Computer & Communications Inc.
    Inventors: Hui-Jou Tsai, Wen-Te Shen
  • Bag
    Patent number: D1085697
    Type: Grant
    Filed: November 8, 2023
    Date of Patent: July 29, 2025
    Assignee: LULULEMON ATHLETICA CANADA INC.
    Inventor: Wen-Te Lee