Patents by Inventor Wen-Te Hsu

Wen-Te Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11128092
    Abstract: A connector assembly configured for compact, high speed electronic systems. The assembly includes a board connector and a cable connector that may be mated by moving the cable connector in a mating direction perpendicular to a printed circuit board to which the board connector is mounted. The cable and board connectors may latch when mated and may be unlatched and unmated by pulling on a tab at a top of the cable connector in a direction opposite the mating direction. As a result, little clearance is required around the board connector to access the latching components. Such a connector may enable an electronic device with high signal integrity because the connector can be mounted close to an electronic component that processes high speed signals, providing a short, and high integrity signal paths for high speed signals.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: September 21, 2021
    Assignees: Amphenol AssembleTech (Xiamen) Co., Ltd, Amphenol East Asia Ltd.
    Inventors: Wen Chu Yang, Hui Tang, Zhenxing Liu, Lo-Wen Lu, Wen Te Hsu
  • Patent number: 10965064
    Abstract: A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: March 30, 2021
    Assignee: Amphenol East Asia Ltd.
    Inventors: Wen Te Hsu, Sheng-Fen Sang
  • Patent number: 10938157
    Abstract: A connector assembly with latching provided by a rotating latch bar. The connector has a low height, with the rotating latch bar providing secure engagement between mated connectors of the connector assembly. The latch bar may be shaped to provide spring force that urges the mated connectors together. The connector assembly may be formed with a cable connector and a board connector. The low height of the board connector enables the connector to be mounted close to high speed electronic components, such as a processor, even if covered by a heat sink, as the connector may fit under the heat sink. The cable connector may be coupled, via a cable, to an I/O connector or other component remote from the high speed electronic component.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: March 2, 2021
    Assignees: Amphenol AssembleTech (Xiamen) Co., Ltd, Amphenol East Asia Ltd.
    Inventors: Wen Chu Yang, Hang Li, Shujian Wang, Hui Tang, Zhenxing Liu, Xiyin Zhou, Lo-Wen Lu, Wen Te Hsu
  • Patent number: 9263811
    Abstract: The present invention is to provide a connector having support portions like steps for improving yield rate of soldering, which includes an isolation base provided therein with signal terminals each having two ends respectively exposed out of front and back side surfaces of the isolation base. Support portions each is formed by a protruded part and a recessed part like steps on the back side surface. An end of a positioning terminal can be inserted into a positioning groove on the recessed part and then be exposed out of the back side surface with a length larger than the length of the protruded part that is approximately equal to the length of the signal terminal extended out the back side surface, whereby the end of the positioning terminal can be inserted into a positioning hole on a circuit board when the back side surface is positioned on the circuit board.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: February 16, 2016
    Assignee: AMPHENOL EAST ASIA LIMITED TAIWAN BRANCH (H.K.)
    Inventor: Wen-Te Hsu
  • Publication number: 20150200472
    Abstract: The present invention is to provide a connector having support portions like steps for improving yield rate of soldering, which includes an isolation base provided therein with signal terminals each having two ends respectively exposed out of front and back side surfaces of the isolation base. Support portions each is formed by a protruded part and a recessed part like steps on the back side surface. An end of a positioning terminal can be inserted into a positioning groove on the recessed part and then be exposed out of the back side surface with a length larger than the length of the protruded part that is approximately equal to the length of the signal terminal extended out the back side surface, whereby the end of the positioning terminal can be inserted into a positioning hole on a circuit board when the back side surface is positioned on the circuit board.
    Type: Application
    Filed: December 2, 2014
    Publication date: July 16, 2015
    Applicant: AMPHENOL EAST ASIA LIMITED TAIWAN BRANCH (H.K.)
    Inventor: Wen-Te HSU
  • Publication number: 20060035484
    Abstract: A land grid array terminal is provided. The terminal includes a side plate, and two elastic arms respectively formed on the upper and lower portions of the side plate. At the central portion of the each elastic arm, a bend portion is formed protrusively facing towards each other. The terminal has a larger circuitry when it is not pressed. However, when the terminal is pressed, the bend portions of the elastic arms contact each other to form a shorter circuitry. This renders a shorter conducting circuitry and a better supporting strength.
    Type: Application
    Filed: October 6, 2004
    Publication date: February 16, 2006
    Applicant: Starlink Electronics Corp.
    Inventor: Wen-Te Hsu