Abstract: A process for purifying medical grade hyaluronic acid from a biological source under continual changed pH value is disclosed.

Abstract: Method of emulsifying phytosterol by natural saponin is disclosed including mixing an oil phase having phytosterol dissolved therein and an aqueous phase having a natural hydrophilic surfactant (saponin) therein to obtain an emulsion of phytosterol. A water dispersible phytosterol powder product can be formed by drying the emulsion, which is able to be dispersed in an aqueous solution or beverage. The phytosterol emulsion, the phytosterol powder product and the aqueous dispersion thereof may be used in the cosmetic products and foodstuffs, thereby enhancing the value of the phytosterol.

Abstract: The invention discloses a method for cultivation of filamentous fungi using a suspended nutritionally solid substrate, the method including the steps of: (a) preparing a medium comprising a nutritionally solid substrate; and (b) inoculating an inoculum into the medium comprising the nutritionally solid substrate in a bioreactor to carry out fermentation. The present invention combines the properties of solid-state culture and submerged culture. In addition, the present invention may employ an air-lift bioreactor with a net draft tube and the fed-batch process to elevate the yields of filamentous fungi and metabolites thereof.

Abstract: The present invention relates to a technique for enhancing the activity of an immobilized lipase, and a technique for regenerating a deactivated immobilized lipase, in which an alcohol with a carbon atom number not less than three is used to swell and/or clean said immobilized lipase. Said immobilized lipase is particularly useful in a method of preparing biodiesel by transesterification of triglycerides and a lower alcohol.

Abstract: A method for forming a semiconductor test carrier including an insulating substrate having a top surface, a bottom surface, periphery; with a rectangular cavity centrally located on the top surface and extending through to the bottom surface. A conductive ground trace formed on the top surface at the periphery of the cavity with conductive corner power traces formed adjacent each corner of the ground trace, with a ruled pattern of conductive wire bond pads encircling the corner power traces. Wire bond pads are formed in a linear array on each of the four sides encircling the power traces. A first interstitial ball pad array encircles the conductive wire bond pads and connects with the bottom surface by way of conductive vias communicating with a second interstitial ball pad array at the bottom surface. A glass plate is attached to the underside of the insulated substrate to form a bottom supporting surface in the rectangular cavity.

Abstract: A bond pad structure and method of forming the bond pad structure which provides for reliable interconnections between the bond pad structure and the next level of circuit integration. The bond pad structure uses three metal pads separated by layers of dielectric. Via plugs are formed between the first and second metal pads and between the second and third metal pads. The via plugs are formed in a diamond shape with respect to the metal pads. The metal pads are squares with the same orientation. The periphery of the via plugs forms a square rotated 45.degree. with respect to the square metal pads.

Abstract: A bond pad structure and method of forming the bond pad structure which provides for reliable interconnections between the bond pad structure and the next level of circuit integration. The bond pad structure uses three metal pads separated by layers of dielectric. Via plugs are formed between the first and second metal pads and between the second and third metal pads. The via plugs are formed in a diamond shape with respect to the metal pads. The metal pads are squares with the same orientation. The periphery of the via plugs forms a square rotated 45.degree. with respect to the square metal pads.