Abstract: An improved structure of a dual-color electroplated article includes a base material, which has an outside surface, on which a metallic plating layer is electroplated to have the metallic plating layer tightly wrap around and enclose the outside surface and which includes at least one recess formed therein to be alternate with non-recessed portions of the outside surface and each receiving therein a black chrome plating layer electroplated therein to have the black chrome plating layer tightly attached in the recess; and a protection layer, which is formed, through electrophoretic deposition, to tightly wrap around and enclose the metallic plating layer and the black chrome plating layer of the base material. The metallic plating layer formed on the outside surface of the base material and the black chrome plating layer formed in the recess provide the base material with two different metallic colors and a dual-color article is provided.

Abstract: The present disclosure is directed to a regulator, a pharmaceutical composition encompassing the regulator and the application thereof. The regulator modulates the expression integrins and/or EMP2, and is employed for treating integrins-associated and/or EMP2-associated diseases.

Abstract: An RNA molecule for inhibiting expression of a gene of a virus. Also disclosed are a DNA vector encoding the RNA molecule and a pharmaceutical composition containing the RNA molecule or vector and a pharmaceutically acceptable carrier, as well as methods for inhibiting expression of a gene of a virus, replication of the virus, and infection with the virus.

Abstract: A method of forming a bond pad structure reinforced with insulator spacers located on the sides of the bond pad structure has been developed. The method features formation of an aluminum based bond pad structure located overlying and contacting a top portion of a metal interconnect structure exposed in an opening in an intermetal dielectric layer. After deposition of an insulator layer such as silicon nitride or silicon oxide, an anisotropic dry etch procedure is employed to define the insulator spacers on the sides of the bond pad structure. The presence of insulator spacers on the sides of the bond pad structure reduces the risk of bond pad damage which can occur during subsequent pre-wire bonding dicing and transportation procedures.