Abstract: A method for chemically-and-mechanically polishing a semiconductor wafer surface is disclosed. It includes the steps of: (a) providing a mechanical polishing pad; (b) placing a pressure-sensitive film on top of a wafer surface to be polished by the mechanical polishing pad, the pressure-sensitive film contains materials that will show pressure-dependent colors when subject to an external pressure; (c) commencing a chemically-and-mechanically polishing process so that the mechanical polishing pad exerts a pressure on the pressure-sensitive film; (d) scanning the pressure-dependent color pattern on the pressure-sensitive film; (e) converting the pressure-dependent color pattern into a pressure distribution; and (f) adjusting the mechanical polishing pad, or a leveling of the wafer mounting, or both, according to the pressure distribution obtained in step (e).