Abstract: The present disclosure relates to semiconductor packages and methods of manufacturing the same. In an embodiment, the semiconductor package includes a substrate, a semiconductor element, at least one connecting element, and an encapsulant. The semiconductor element is mounted to the substrate. The connecting element is disposed on the substrate and adjacent to the semiconductor element. The encapsulant covers at least a portion of the semiconductor element and at least a portion of the connecting element and defines at least one first groove surrounding the connecting element.

Abstract: The present disclosure relates to a semiconductor package. In an embodiment, the semiconductor package includes a substrate having a lateral surface and an upper surface, a semiconductor device mounted to the substrate, and a molding compound covering the lateral surface and the upper surface of the substrate and at least a portion of the semiconductor device. A surface of the semiconductor device is substantially coplanar with a surface of the molding compound.

Abstract: The present disclosure relates to a semiconductor package. In an embodiment, the semiconductor package includes a substrate having a lateral surface and an upper surface, a semiconductor device mounted to the substrate, and a molding compound covering the lateral surface and the upper surface of the substrate and at least a portion of the semiconductor device. A surface of the semiconductor device is substantially coplanar with a surface of the molding compound.

Abstract: The present disclosure relates to a semiconductor package. In an embodiment, the semiconductor package includes a substrate, a semiconductor device, a thermal conductive element and a molding compound. The semiconductor device is mounted to the substrate. The thermal conductive element is disposed above the semiconductor device. The molding compound covers a side surface of the substrate and at least a part of a side surface of the semiconductor device.

Abstract: The present disclosure relates to a semiconductor package. In an embodiment, the semiconductor package includes a substrate, a semiconductor device, a thermal conductive element and a molding compound. The semiconductor device is mounted to the substrate. The thermal conductive element is disposed above the semiconductor device. The molding compound covers a side surface of the substrate and at least a part of a side surface of the semiconductor device.

Abstract: The present disclosure relates to semiconductor packages and methods of manufacturing the same. In an embodiment, the semiconductor package includes a substrate, a semiconductor element, at least one connecting element, and an encapsulant. The semiconductor element is mounted to the substrate. The connecting element is disposed on the substrate and adjacent to the semiconductor element. The encapsulant covers at least a portion of the semiconductor element and at least a portion of the connecting element and defines at least one first groove surrounding the connecting element.

Abstract: A boosting adaptor for a jack is comprised of a housing, a power input member received in the housing for rotation driven by an external input power, a boosting gear assembly connected with the power input member and having a plurality of gears and rotary shafts for running driven by the power input member and for boosting the input power, and a power output member connected with the boosting gear assembly for connection with the jack and for outputting the boosted input power to the jack. Accordingly, while in cooperative operation with a jack, the boosting adaptor not only enables the laborsaving operation of the jack but also can be connected with an electric tool to enable the convenient operation of the jack.

Abstract: The present invention is related to an air-permeable buffering structure for protecting the body from being hurt while rubbing with a coarse surface. The buffering structure according to the present invention includes a plurality of buffering pads arranged in a stratified way, and a plurality of through holes, each of which is located among several buffering pads for permeating therethrough the air. According to the present invention, the number of the through holes can be up to a great quantity for ensuring sufficient air to permeate therethrough without weakening the buffering structure. In addition, the plurality of buffering pads are arranged in such a particular way so that little things such as gravel will not get into the chink between the body and the buffering structure from the through holes.