Patents by Inventor WEN-TSUNG SUNG

WEN-TSUNG SUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230393172
    Abstract: The present invention provides a probe head, comprising: an upper guide plate with a first through hole; a lower guide plate with a second through hole; and a probe structure body with a first end portion, a second end portion and a needle body. The upper guide plate and the lower guide plate jointly define an inner accommodation space. The first end portion is disposed in the first through hole, and the second end portion is disposed in the second through hole. The needle body is located between the first end portion and the second end portion, and is accommodated in the inner accommodation space. The second end portion has a fixed portion positioned on the lower guide plate, and the fixed portion has no degree of freedom to move along the penetrating direction of the second through hole. The upper section of the probe structure body relative to the fixed portion has a first spring constant, and the lower section of the probe structure body relative to the fixed portion has a second spring constant.
    Type: Application
    Filed: May 31, 2023
    Publication date: December 7, 2023
    Applicant: Silicon Future Manufacturing Company Ltd.
    Inventors: WEN-TSUNG SUNG, TIEN-CHIA LEE, CHIA-HSIANG YU
  • Publication number: 20230266364
    Abstract: The disclosure provides a probe card comprising a circuit substrate, a space transformer, and a first coaxial cable. The circuit substrate has a first surface and a second surface, wherein a through hole penetrates the circuit substrate from the first surface to the second surface. The space transformer is arranged on the second surface corresponding to the through hole and has a probe setting surface opposite to the second surface. The first coaxial cable has a first conducting part and a first insulating part, wherein the first coaxial cable is inserted into the through hole, and a first end surface of the first conducting part is flush with the probe setting surface.
    Type: Application
    Filed: February 22, 2023
    Publication date: August 24, 2023
    Applicant: Silicon Future Manufacturing Company Ltd.
    Inventors: CHIA-HSIANG YU, YOU-CHEN LIN, NENG-KAN CHU, HENG-RUI CHANG, TIEN-CHIA LEE, WEN-TSUNG SUNG