Patents by Inventor WEN-TSUNG SUNG

WEN-TSUNG SUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240369599
    Abstract: A probe card device comprises a testing circuit board, at least one probe and an image capture module. The testing circuit board has a first surface and a second surface in opposite. The at least one probe is disposed on the first surface of the testing circuit board and electrically connected to the testing circuit board. The at least one probe has a probe head and the probe head has a first height to the first surface. The image capture module is disposed on the first surface of the testing circuit board, and is located adjacent to the probe. The image capture module has a head portion and the head portion has a second height to the first surface. Wherein, the second height is smaller than the first height, and the image capture module is aligned to the probe head to capture a visible light image from the probe head.
    Type: Application
    Filed: April 30, 2024
    Publication date: November 7, 2024
    Applicant: Silicon Future Manufacturing Company Ltd.
    Inventors: TIEN-CHIA LEE, HENG-RUI CHANG, YOU-CHEN LIN, MING-CHANG LIAO, WEN-TSUNG SUNG
  • Publication number: 20230393172
    Abstract: The present invention provides a probe head, comprising: an upper guide plate with a first through hole; a lower guide plate with a second through hole; and a probe structure body with a first end portion, a second end portion and a needle body. The upper guide plate and the lower guide plate jointly define an inner accommodation space. The first end portion is disposed in the first through hole, and the second end portion is disposed in the second through hole. The needle body is located between the first end portion and the second end portion, and is accommodated in the inner accommodation space. The second end portion has a fixed portion positioned on the lower guide plate, and the fixed portion has no degree of freedom to move along the penetrating direction of the second through hole. The upper section of the probe structure body relative to the fixed portion has a first spring constant, and the lower section of the probe structure body relative to the fixed portion has a second spring constant.
    Type: Application
    Filed: May 31, 2023
    Publication date: December 7, 2023
    Applicant: Silicon Future Manufacturing Company Ltd.
    Inventors: WEN-TSUNG SUNG, TIEN-CHIA LEE, CHIA-HSIANG YU
  • Publication number: 20230266364
    Abstract: The disclosure provides a probe card comprising a circuit substrate, a space transformer, and a first coaxial cable. The circuit substrate has a first surface and a second surface, wherein a through hole penetrates the circuit substrate from the first surface to the second surface. The space transformer is arranged on the second surface corresponding to the through hole and has a probe setting surface opposite to the second surface. The first coaxial cable has a first conducting part and a first insulating part, wherein the first coaxial cable is inserted into the through hole, and a first end surface of the first conducting part is flush with the probe setting surface.
    Type: Application
    Filed: February 22, 2023
    Publication date: August 24, 2023
    Applicant: Silicon Future Manufacturing Company Ltd.
    Inventors: CHIA-HSIANG YU, YOU-CHEN LIN, NENG-KAN CHU, HENG-RUI CHANG, TIEN-CHIA LEE, WEN-TSUNG SUNG