Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first electrode layer over a substrate. The method includes forming a capacitor dielectric layer over the first electrode layer and the substrate. The method includes depositing a second electrode layer over the capacitor dielectric layer. The method includes bombarding the second electrode layer with ions of an inert gas to sputter first atoms from the second electrode layer. The treated second electrode layer has a treated first top portion, a treated first sidewall portion, and a treated first bottom portion. The treated first sidewall portion is over the sidewall of the first electrode layer and connected between the treated first top portion and the treated first bottom portion, and the treated first sidewall portion is thicker than the first sidewall portion.

Abstract: A semiconductor device includes a transistor structure disposed over a substrate, a first interlayer dielectric (ILD) layer disposed over the transistor structure, a second ILD layer disposed over the first ILD layer, and a first resistor wire disposed on the second ILD layer, and a second resistor wire disposed on the second ILD layer. A sheet resistance of the first resistor wire is different from a sheet resistance of the second resistor wire.

Abstract: A semiconductor device includes a transistor structure disposed over a substrate, a first interlayer dielectric (ILD) layer disposed over the transistor structure, a second ILD layer disposed over the first ILD layer, and a first resistor wire disposed on the second ILD layer, and a second resistor wire disposed on the second ILD layer. A sheet resistance of the first resistor wire is different from a sheet resistance of the second resistor wire.

Abstract: Semiconductor devices and methods of forming the same are provided. In some embodiments, a method includes receiving a workpiece having a redistribution layer disposed over and electrically coupled to an interconnect structure. In some embodiments, the method further includes patterning the redistribution layer to form a recess between and separating a first conductive feature and a second conductive feature of the redistribution layer, where corners of the first conductive feature and the second conductive feature are defined adjacent to and on either side of the recess. The method further includes depositing a first dielectric layer over the first conductive feature, the second conductive feature, and within the recess. The method further includes depositing a nitride layer over the first dielectric layer. In some examples, the method further includes removing portions of the nitride layer disposed over the corners of the first conductive feature and the second conductive feature.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming an interconnect structure over a substrate. The method includes forming a first conductive pad and a mask layer over the interconnect structure. The mask layer covers a top surface of the first conductive pad. The method includes forming a metal oxide layer over a sidewall of the first conductive pad. The method includes forming a second conductive pad over the first conductive pad and passing through the mask layer. The first conductive pad and the second conductive pad are made of different materials.

Abstract: A semiconductor device includes a transistor structure disposed over a substrate, a first interlayer dielectric (ILD) layer disposed over the transistor structure, a second ILD layer disposed over the first ILD layer, and a first resistor wire disposed on the second ILD layer, and a second resistor wire disposed on the second ILD layer. A sheet resistance of the first resistor wire is different from a sheet resistance of the second resistor wire.

Abstract: A mounting apparatus is configured for securing an expansion card with a support portion, and includes a chassis with a plate, and a securing member pivotably secured on the plate. The plate defines an opening for the support portion of the expansion card inserting therethrough. A positioning portion is formed on the plate to locate the support portion of the expansion card. The positioning portion defines a locking hole therein. The securing member includes a bent portion and a locking portion to sandwich the support portion of the expansion card and the positioning portion of the plate therebetween. A locking block protrudes from the locking portion to engage in the locking hole of the positioning portion. The locking portion is resiliently deformable to disengage the locking block from the locking hole of the positioning portion.

Abstract: A computer enclosure includes a rear plate defining a through opening therein, a mounting bracket secured on the rear plate to cover the through opening of the rear plate, and an interchangeable I/O plate. The mounting bracket includes a top wall perpendicular to the rear plate and, a front wall parallel to the rear plate. The top wall forms an engaging tab thereon. The front wall defines a through opening therein corresponding to the through opening of the rear plate. The I/O plate is configured for covering the through opening of the front wall of the mounting bracket, and defines a securing hole therein for receiving the engaging tab of the mounting bracket. A locking piece is formed on the I/O plate and together with the I/O plate sandwiches an edge of the through opening of the mounting bracket therebetween.

Abstract: A mounting apparatus is configured for securing an expansion card with a support portion, and includes a chassis with a plate, and a securing member pivotably secured on the plate. The plate defines an opening for the support portion of the expansion card inserting therethrough. A positioning portion is formed on the plate to locate the support portion of the expansion card. The positioning portion defines a locking hole therein. The securing member includes a bent portion and a locking portion to sandwich the support portion of the expansion card and the positioning portion of the plate therebetween. A locking block protrudes from the locking portion to engage in the locking hole of the positioning portion. The locking portion is resiliently deformable to disengage the locking block from the locking hole of the positioning portion.

Abstract: A disk drive cage includes a bracket (20) and a shielding member (10). The bracket includes two parallel side plates (21, 22). A positioning flange (212) is bent from one of the side plates (21). The shielding member includes a front wall (13), a top wall (15), a bottom wall (16), a first side wall (12), and a second side wall (14). A resilient lip piece (141) is formed on the second side wall and having at least one locking tab (142) engaging with the positioning flange when the shielding member inserts into the bracket. The top wall and the bottom wall has arc-shaped edges (152, 162) to allow resilient deformation of the first side wall towards the arc-shaped edges by the other one of the side plates (22), and the shielding member rotating out from the bracket.

Abstract: A computer system includes a chassis (10), a securing panel (30), a motherboard (20), and a heat sink (40). The chassis includes a plate (12) having at least one positioning post (14) extending upwardly therefrom. The securing panel defines a plurality of screw holes (38) and at least one positioning hole (34) for the at least one positioning post extending therethrough. The motherboard is placed on the securing panel and secured with the chassis. The motherboard includes a plurality of through holes (22) corresponding to the plurality of screw holes of the securing panel and an electronic component (50) located among the through holes. The heat sink with a plurality of fastening bolts (42) placed on the electronic component. The fastening bolts of the heat sink are screwed into the through holes of the motherboard and the screw holes of the securing panel to fasten the securing panel and the heat sink at opposite sides of the motherboard.

Abstract: A computer system includes a chassis (10), a securing panel (30), a motherboard (20), and a heat sink (40). The chassis includes a plate (12) having at least one positioning post (14) extending upwardly therefrom. The securing panel defines a plurality of screw holes (38) and at least one positioning hole (34) for the at least one positioning post extending therethrough. The motherboard is placed on the securing panel and secured with the chassis. The motherboard includes a plurality of through holes (22) corresponding to the plurality of screw holes of the securing panel and an electronic component (50) located among the through holes. The heat sink with a plurality of fastening bolts (42) placed on the electronic component. The fastening bolts of the heat sink are screwed into the through holes of the motherboard and the screw holes of the securing panel to fasten the securing panel and the heat sink at opposite sides of the motherboard.

Abstract: A computer enclosure includes a rear plate (20) defining a through opening (22) therein, a mounting bracket (30) secured on the rear plate to cover the through opening of the rear plate, and an interchangeable I/O plate (50). The mounting bracket includes a top wall (32) perpendicular to the rear plate and, a front wall (36) parallel to the rear plate. The top wall forms an engaging tab (322) thereon. The front wall defines a through opening (362) therein corresponding to the through opening of the rear plate. The I/O plate is configured for covering the through opening of the front wall of the mounting bracket, and defines a securing hole (532) therein for receiving the engaging tab of the mounting bracket. A locking piece (57) is formed on the I/O plate and together with the I/O plate sandwiches an edge of the through opening of the mounting bracket therebetween.

Abstract: A disk drive cage includes a bracket (20) and a shielding member (10). The bracket includes two parallel side plates (21, 22). A positioning flange (212) is bent from one of the side plates (21). The shielding member includes a front wall (13), a top wall (15), a bottom wall (16), a first side wall (12), and a second side wall (14). A resilient lip piece (141) is formed on the second side wall and having at least one locking tab (142) engaging with the positioning flange when the shielding member inserts into the bracket. The top wall and the bottom wall has arc-shaped edges (152, 162) to allow resilient deformation of the first side wall towards the arc-shaped edges by the other one of the side plates (22), and the shielding member rotating out from the bracket.

Abstract: A sliding rail mounting structure is disclosed to connect a sliding rail to a vertical column inside a server rack by securing a magnetic locating member to the vertical column by magnetic attraction and then inserting the locating pin of a U-clip at one end of the sliding rail into a locating hole in the locating member and one horizontal through hole in the vertical column and then inserting two screws through respective horizontal through holes in the vertical column and threading the screws into respective threaded nuts of the U-clip.

Abstract: A sliding rail mounting arrangement for connecting a sliding rail to a column inside a server rack is disclosed to include a spring clip for clamping on an angled end flange of the sliding rail and securing the angled end flange to one mounting hole of the column, the spring clip having two protruded portions and a retaining spring block for engaging into respective mounting holes and a locating hole at the angled end flange of sliding rail upon clamping of the spring clip on the angled end flange, and a locating pin protruded from one side thereof on the middle for engaging into one mounting hole of the column for enabling the spring clip and the angled end flange of the sliding rail to be affixed to the column with screws to complete the installation by one person.

Abstract: A sliding rail mounting structure is disclosed to connect a sliding rail to a vertical column inside a server rack by securing a magnetic locating member to the vertical column by magnetic attraction and then inserting the locating pin of a U-clip at one end of the sliding rail into a locating hole in the locating member and one horizontal through hole in the vertical column and then inserting two screws through respective horizontal through holes in the vertical column and threading the screws into respective screwed nuts of the U-clip.