Patents by Inventor Wen-Wei Fan

Wen-Wei Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240134167
    Abstract: An optical path folding element includes a main body, a light absorption film layer and a matte structure. The main body has optical surface including an incident surface, a reflective surface and an emitting surface. A light enters into the optical folding element through the incident surface. The reflective surface reflects the light so as to change a traveling direction thereof. The light exits the optical folding element through the emitting surface. The light absorbing film layer is configured to reduce reflectance and provided adjacent to at least part of the optical surface, and the light absorbing film layer is in physical contact with the main body. The matte structure is disposed adjacent to at least part of the optical surface. The matte structure provides an undulating profile on a surface of the optical path folding element, and the matte structure is formed in one-piece with the main body.
    Type: Application
    Filed: September 24, 2023
    Publication date: April 25, 2024
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Ssu-Hsin LIU, Chen Wei FAN, Chien-Hsun WU, Wen-Yu TSAI, Ming-Ta CHOU
  • Patent number: 11854768
    Abstract: The present disclosure is directed to an in situ closed-loop radio frequency (RF) power management on RF processes such as a plasma etch process, a plasma chemical vapor deposition process, a plasma physical vapor deposition process, a plasma clean process, or the like. An RF power measurement device according to one or more embodiments of the present disclosure assists the in situ closed-loop RF power management on RF processes. In some embodiments, the RF power measurement device includes a coil-shaped current sensor that is wound around the path between an RF generator and a chamber. The coil-shaped current sensor senses the current flowing through this path so that the power of the RF generator may be calibrated without having to separate the RF generator for separate analysis and calibration. The RF power measurement device allows management of RF power in an in situ closed-loop manner.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei Ting Liu, Wen-Wei Fan
  • Publication number: 20230067745
    Abstract: The present disclosure is directed to an in situ closed-loop radio frequency (RF) power management on RF processes such as a plasma etch process, a plasma chemical vapor deposition process, a plasma physical vapor deposition process, a plasma clean process, or the like. An RF power measurement device according to one or more embodiments of the present disclosure assists the in situ closed-loop RF power management on RF processes. In some embodiments, the RF power measurement device includes a coil-shaped current sensor that is wound around the path between an RF generator and a chamber. The coil-shaped current sensor senses the current flowing through this path so that the power of the RF generator may be calibrated without having to separate the RF generator for separate analysis and calibration. The RF power measurement device allows management of RF power in an in situ closed-loop manner.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Inventors: Wei Ting LIU, Wen-Wei FAN
  • Publication number: 20130173047
    Abstract: A micro-machining tool is disclosed herein. It includes a micro-moving platform, a supporting device to support the micro-moving platform, an anti-rotation device embedded in a bar for preventing the supporting device from rotating, and a fixing device for fixing the supporting device for limiting its rotation as the bar is moving.
    Type: Application
    Filed: March 7, 2012
    Publication date: July 4, 2013
    Applicant: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: Yi-Hua Fan, Ching-En Chen, Wen-Wei Fan, Ying Tsun Lee