Patents by Inventor WEN-WEI TSENG

WEN-WEI TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Publication number: 20240128211
    Abstract: Some implementations described herein provide techniques and apparatuses for a stacked semiconductor die package. The stacked semiconductor die package may include an upper semiconductor die package above a lower semiconductor die package. The stacked semiconductor die package includes one or more rows of pad structures located within a footprint of a semiconductor die of the lower semiconductor die package. The one or more rows of pad structures may be used to mount the upper semiconductor die package above the lower semiconductor die package. Relative to another stacked semiconductor die package including a row of dummy connection structures adjacent to the semiconductor die that may be used to mount the upper semiconductor die package, a size of the stacked semiconductor die package may be reduced.
    Type: Application
    Filed: April 27, 2023
    Publication date: April 18, 2024
    Inventors: Chih-Wei WU, An-Jhih SU, Hua-Wei TSENG, Ying-Ching SHIH, Wen-Chih CHIOU, Chun-Wei CHEN, Ming Shih YEH, Wei-Cheng WU, Der-Chyang YEH
  • Publication number: 20130009929
    Abstract: 3D liquid crystal shutter glasses include a pair of LCD lenses (1), and a control circuit (100) associated with the LCD lenses. The LCD lens includes an LCD-glass layer (2), a front polarizing filter (3), and a transparent scratchproof layer (4) laminated together. The control circuit includes a sync signal receiver (5), an LCD driver (6) for controlling LCD lenses, a boost circuitry (7) associated with LCD driver for outputting a drive voltage to the LCD driver, a CPU (8) which is respectively associated with the receiver, LCD driver, and boost circuitry for controlling operation of the same, and a power supply module (11) for powering the control circuit. The lenses prevent light in environment affecting and flaring thereon. The light transmittance of the lenses is approximated to 40%. Accordingly, the 3D glasses present the user brighter and lively image in higher quality, and avoid hurting user's eyesight.
    Type: Application
    Filed: July 8, 2011
    Publication date: January 10, 2013
    Applicant: LI-TEK CORPORATION CO., LTD.
    Inventor: WEN-WEI TSENG
  • Publication number: 20130009916
    Abstract: 3D liquid crystal shutter glasses in the present invention include LCD lenses (1) and a control circuit (20, 30) which is operable to receive sync RF signal and drive the LCD lenses operation. The control circuit includes: an RF receiver for receiving sync signal (2); an LCD driver (3) for driving the LCD lenses operation; a boost circuitry (4) for supplying an operating voltage to the LCD driver; a CPU (5) for controlling the RF receiver, LCD driver and boost circuitry; a power control module (7); and a battery (6) for powering the control circuit via the power control module. The glasses can eliminate the impact from light in environment and the orientation limited, and improve the viewing effect and quality of 3D image or video. Therefore, it is more practical.
    Type: Application
    Filed: July 8, 2011
    Publication date: January 10, 2013
    Applicant: LI-TEK CORPORATION CO., LTD.
    Inventor: WEN-WEI TSENG