Abstract: A thermally conductive board includes a first metal layer, a second metal layer, and a thermally conductive layer. The material of the first metal layer includes copper, and the first metal layer has a first top surface and a first bottom surface opposite to the first top surface. A first metal coating layer covers the first bottom surface. The material of the second metal layer includes copper, and the second metal layer has a second top surface and a second bottom surface opposite to the second top surface. A second metal coating layer covers the second top surface and faces the first metal coating layer. The thermally conductive layer is an electrically insulator laminated between the first metal coating layer and the second metal coating layer.

Abstract: A transporting device can transport at least one product, the transporting device includes a mounting frame, a driving mechanism, a transmitting mechanism including a plurality of bent portions, a plurality of guiding mechanisms, and a supporting mechanism. Each guiding mechanism includes a rotating wheel and a guiding plate. Each bent portion is connected to the rotating wheel. The guiding plate is connected to the rotating wheel. The supporting mechanism can support the product. The driving mechanism is further connected to the rotating wheel and can drive the transmitting mechanism to rotate to drive the supporting mechanism to move. The driving mechanism is further connected to the guiding plate, the guiding plate and the rotating wheel can synchronously rotate to drive the supporting mechanism to pass through the bent portions. The present disclosure further provides a heating device.

Abstract: Microelectromechanical devices and methods of manufacture are presented. Embodiments include bonding a mask substrate to a first microelectromechanical system (MEMS) device. After the bonding has been performed, the mask substrate is patterned. A first conductive pillar is formed within the mask substrate, and a second conductive pillar is formed within the mask substrate, the second conductive pillar having a different height from the first conductive pillar. The mask substrate is then removed.

Abstract: The present disclosure provides a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes channel members disposed over a substrate, a gate structure engaging the channel members, and an epitaxial feature adjacent the channel members. At least one of the channel members has an end portion in physical contact with an outer portion of the epitaxial feature. The end portion of the at least one of the channel members includes a first dopant of a first concentration. The outer portion of the epitaxial feature includes a second dopant of a second concentration. The first concentration is higher than the second concentration.

Abstract: A semiconductor device includes a substrate, at least one via, a liner layer and a conductive layer. The substrate includes an electronic circuitry. The at least one via passes through the substrate. The at least one via includes a plurality of concave portions on a sidewall thereof. The liner layer fills in the plurality of concave portions of the at least one via. The conductive layer is disposed on the sidewall of the at least one via, covers the liner layer, and extends onto a surface of the substrate. The thickness of the conductive layer on the sidewall of the at least one via is varied.

Abstract: A method of manufacturing a semiconductor device includes forming a first bonding layer over a substrate of a first wafer, the first wafer including a first semiconductor die and a second semiconductor die, performing a first dicing process to form two grooves that extend through the first bonding layer, the two grooves being disposed between the first semiconductor die and the second semiconductor die, performing a second dicing process to form a trench that extends through the first bonding layer and partially through the substrate of the first wafer, where the trench is disposed between the two grooves, and thinning a backside of the substrate of the first wafer until the first semiconductor die is singulated from the second semiconductor die.

Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.

Abstract: Various embodiments of the present application are directed towards a control gate layout to improve an etch process window for word lines. In some embodiments, an integrated chip comprises a memory array, an erase gate, a word line, and a control gate. The memory array comprises a plurality of cells in a plurality of rows and a plurality of columns. The erase gate and the word line are elongated in parallel along a row of the memory array. The control gate is elongated along the row and is between and borders the erase gate and the word line. Further, the control gate has a pad region protruding towards the erase gate and the word line. Because the pad region protrudes towards the erase gate and the word line, a width of the pad region is spread between word-line and erase-gate sides of the control gate.

Abstract: The display panel includes an array substrate, a light emitting diode and a first connection electrode. The array substrate includes a driving circuit layer. The light emitting diode is disposed on the array substrate. The light emitting diode includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The first connection electrode is electrically connected to the driving circuit layer and the first semiconductor layer. The first connection electrode wraps the light emitting layer such that a normal projection of the light emitting layer over the array substrate is within a normal projection of the first connection electrode over the array substrate.

Abstract: A bi-directional optical module includes a substrate, at least one first light-emitting diode (LED), and at least one second LED. The first LED is disposed on a surface of the substrate. The first LED has a first reflection surface and a first light-outlet surface that are opposite to each other, and the first light-outlet surface is away from the substrate relative to the first reflection surface. The second LED is disposed on the same surface of the substrate. The second LED has a second reflection surface and a second light-outlet surface that are opposite to each other, and the second light-outlet surface is close to the substrate relative to the second reflection surface. The substrate has at least one light-transparent area that is not occupied by the first LED and the second LED.

Abstract: A display panel and a pixel structure are provided. The pixel structure includes a substrate, a micro light emitting diode (micro LED or ?LED), a sidewall structure, a filling layer, and a reflective layer. The substrate has a bearing surface, and the micro LED is disposed on the bearing surface directly or indirectly. The sidewall structure is disposed on the bearing surface and defines at least one accommodation cavity to accommodate the micro LED. The filling layer is filled in the accommodation cavity and surrounds the micro LED. The reflective layer covers a top surface of the filling layer and has a plurality of light-transmissible windows. The micro LED forms, in a vertical projection direction, a vertical projection region in an overlapping region on the reflective layer. Among the light-transmissible windows, those having longer distances to the vertical projection region have larger areas.

Abstract: The display panel includes an array substrate, a light emitting diode and a first connection electrode. The array substrate includes a driving circuit layer. The light emitting diode is disposed on the array substrate. The light emitting diode includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The first connection electrode is electrically connected to the driving circuit layer and the first semiconductor layer. The first connection electrode wraps the light emitting layer such that a normal projection of the light emitting layer over the array substrate is within a normal projection of the first connection electrode over the array substrate.

Abstract: A display panel including a substrate, a light-emitting device, a light-shielding layer, and a light-guide pillar is provided. The light-emitting device is disposed on the substrate. The light-shielding layer is disposed on the substrate and has a sidewall surrounding an opening. The light-guide pillar is disposed between the substrate and the light-emitting device and located in the opening. A gap exists between the light-guide pillar and the sidewall of the light-shielding layer.

Abstract: An LED panel including a substrate, multiple first pixels, multiple second pixels, multiple first protrusion structures and second protrusion structures is provided. The first pixels and second pixels each disposed in a display area of the substrate has at least one light emitting element. The second pixels are positioned on at least one display edge of the display area and positioned between the first pixels and a substrate edge. Each first protrusion structure is positioned on the periphery of the at least one light emitting element of one corresponding first pixel. Each second protrusion structure is positioned on the periphery of the at least one light emitting element of one corresponding second pixel. The orthogonal projection contour of each first protrusion structure on the substrate is different from that of each second protrusion structure on the substrate. A tiling display apparatus adopting the light emitting diode panel is also provided.

Abstract: A light emitting diode (LED) display panel includes a back plate and a pixel structure, which includes multiple pixels. Each pixel includes a reflector structure and two LEDs emitting light of a same color, all disposed on the back plate. The reflector structure of each pixel has a first reflective bank structure and a second reflective bank structure. The first reflective bank structure has a first bank opening. The second reflective bank structure has a second bank opening. The two LEDs are disposed within the first and second bank openings. The first bank opening has a first shape, and the second bank opening has a second shape, which is a mirror shape or a 180° symmetrical shape of the first shape. For each of the pixels, the first shape is a polygonal shape, and at least two corners of the first shape have an included angle less than 90°.

Abstract: An LED panel including a substrate, multiple first pixels, multiple second pixels, multiple first protrusion structures and second protrusion structures is provided. The first pixels and second pixels each disposed in a display area of the substrate has at least one light emitting element. The second pixels are positioned on at least one display edge of the display area and positioned between the first pixels and a substrate edge. Each first protrusion structure is positioned on the periphery of the at least one light emitting element of one corresponding first pixel. Each second protrusion structure is positioned on the periphery of the at least one light emitting element of one corresponding second pixel. The orthogonal projection contour of each first protrusion structure on the substrate is different from that of each second protrusion structure on the substrate. A tiling display apparatus adopting the light emitting diode panel is also provided.

Abstract: A device substrate includes a receiving substrate, a micro light emitting element, a first wire, and a second wire is provided. The micro light emitting element is disposed on the receiving substrate. The micro light emitting element includes a first type semiconductor layer and a second type semiconductor layer. The first type semiconductor layer is disposed on the receiving substrate and has a first wire connecting surface away from the receiving substrate. The second type semiconductor layer is disposed on a part of the first type semiconductor layer and has a second wire connection surface away from the receiving substrate. The first wire is disposed on the first wire connection surface. The second wire is disposed on the second wire connection surface. A projection range of the first wire perpendicularly projected on the micro light emitting element and a projection range of the second wire perpendicularly projected on the micro light emitting element are at least partially overlap.

Abstract: A light emitting diode (LED) display panel includes a back plate and a pixel structure, which includes multiple pixels. Each pixel includes a reflector structure and two LEDs emitting light of a same color, all disposed on the back plate. The reflector structure of each pixel has a first reflective bank structure and a second reflective bank structure. The first reflective bank structure has a first bank opening. The second reflective bank structure has a second bank opening. The two LEDs are disposed within the first and second bank openings. The first bank opening has a first shape, and the second bank opening has a second shape, which is a mirror shape or a 180° symmetrical shape of the first shape. For each of the pixels, the first shape is a polygonal shape, and at least two corners of the first shape have an included angle less than 90°.

Abstract: A bi-directional optical module includes a substrate, at least one first light-emitting diode (LED), and at least one second LED. The first LED is disposed on a surface of the substrate. The first LED has a first reflection surface and a first light-outlet surface that are opposite to each other, and the first light-outlet surface is away from the substrate relative to the first reflection surface. The second LED is disposed on the same surface of the substrate. The second LED has a second reflection surface and a second light-outlet surface that are opposite to each other, and the second light-outlet surface is close to the substrate relative to the second reflection surface. The substrate has at least one light-transparent area that is not occupied by the first LED and the second LED.

Abstract: A display panel and a pixel structure are provided. The pixel structure includes a substrate, a micro light emitting diode (micro LED or ?LED), a sidewall structure, a filling layer, and a reflective layer. The substrate has a bearing surface, and the micro LED is disposed on the bearing surface directly or indirectly. The sidewall structure is disposed on the bearing surface and defines at least one accommodation cavity to accommodate the micro LED. The filling layer is filled in the accommodation cavity and surrounds the micro LED. The reflective layer covers a top surface of the filling layer and has a plurality of light-transmissible windows. The micro LED forms, in a vertical projection direction, a vertical projection region in an overlapping region on the reflective layer. Among the light-transmissible windows, those having longer distances to the vertical projection region have larger areas.