Abstract: A method for printed circuit board design of temperature sensitive components includes a scrub tool receiving a list of part numbers for electronic components of a printed circuit board assembly (“PCBA”). The scrub tool sends one or more queries for finding temperature and time limits of the electronic components to a database. A mapping tool receives a selection of one or more part numbers responsive to the one or more queries, wherein the selection is responsive to the temperature and time limits. The mapping tool sends a data structure to a physical design tool which is configured with physical design data for generating a graphic representation of the PCBA. The data structure from the mapping tool provides the received selection of one or more part numbers and configures the physical design tool to highlight components having part numbers of the selection on the PCBA graphic representation.

Abstract: A device includes a work piece including a metal bump; and a dielectric layer having a portion directly over the metal bump. The metal bump and a surface of the portion of the dielectric layer form an interface. A metal finish is formed over and contacting the metal bump. The metal finish extends from over the dielectric layer to below the interface.

Abstract: A file accessing system and a file accessing method thereof are provided. The file accessing system includes a storing unit and a processing unit. The storing unit stores a file accessing table which has a file record item. The file record item has a block point field and a key field. The processing unit: decides a storing block and a key of a file, where the storing block stores a data record table having a data record item which has a corresponding key field and a data allocation field; records a block identification of the storing block and the key into the block point field and the key field respectively; stores the file into a segment of the storing block; and records the key and the segment into the corresponding key field and the data allocation field respectively.

Abstract: A mating connector includes a plastic body, a first terminal group and a second terminal group received in the plastic body, a retaining elastic sheet retained at the plastic body and located at a side of the first terminal group and the second terminal group, a middle shielding sheet located between the first terminal group and the second terminal group, and a shielding case contacting the middle shielding sheet. An urging portion is extended from the middle shielding sheet and abuts the retaining elastic sheet. The middle shielding sheet shields an interference signal between plate surfaces of the first and second terminal groups. The retaining elastic sheet shields an interference signal between side surfaces of the first and second terminal groups.

Abstract: An emitting device using smart mobile electronic device as operation interface comprises a connector having a circuit board, the circuit board having an electrical connection portion at a front end, and the electrical connection portion set to match specifications of a transmission port of a smart mobile electronic device for being inserted into the transmission port to get the power and signal; a light emitting module installed at a side of the circuit board; a drive circuit couple between the circuit board and light emitting module. Whereby when the connector of the emitting device is electrically connected to the transmission port, the power module provides the power to the emitting device to turn on or off the light emitting module of the emitting device through the user's operation interface on the touch screen.

Abstract: A byte addressable storing system is provided. The byte addressable storing system includes a data transmission interface and a processing unit. The data transmission interface connects to a byte addressable storing device. The processing unit creates a primary metadata table, a secondary metadata table, an indirect metadata matching table, a sub-block using status table and a metadata pointer in the byte addressable storing device via the data transmission interface. The processing unit further adjusts the allocation of metadata in the byte addressable storing device dynamically based on the aforesaid tables and pointer. The processing unit further stores a file into sub-blocks of blocks non-sequentially, and achieves record of the file via dynamic multi-level pointing.

Abstract: A semiconductor device includes a substrate, a redistribution layer, a plurality of through-silicon vias (TSVs), and a plating seed layer. The substrate has a first surface and a second surface opposite to each other, and a plurality of cavities. The redistribution layer is disposed on the first surface, and the TSVs are respectively disposed in the cavities. The plating seed layer is disposed between the inner wall of each of the cavities and the corresponding TSVs. The anti-oxidation layer is disposed between the plating seed layer and the corresponding TSVs. The buffer layer covers the first surface and exposes the redistribution layers. Furthermore, a manufacturing method and a stacking structure of the semiconductor device are also provided.

Abstract: The present embodiments disclose a method for locating a unit in an assembly. According to the embodiments, a unit in an assembly is located. An identification of the target unit in the assembly is obtained. An image of at least a part of the assembly is acquired. The image includes a visual code associated with the part. The visual code is decoded to obtain an identification of at least one unit in the part. It is determined if the target unit is included in the part responsive to identification of a match of the target unit with the identification of the at least one unit. There is further disclosed a corresponding apparatus, assembly, and fault diagnosis device.

Abstract: A method for molding an electrical connector, includes: S1: providing a row of first terminals, and integrally wrapping an insulating block on the first terminals by insert molding, wherein the insulating block wraps a part of each first terminal, and the insulating block and the row of first terminals together form a first terminal module; S2: providing a middle shielding sheet; and S3: integrally wrapping an insulating body around the middle shielding sheet and the first terminal module by insert molding.

Abstract: An electrical connector includes a body having a tongue, a row of first terminals insert-molded in the body, a depressed slot, and a positioning slot. The tongue includes a first surface having multiple receiving slots. Each first terminal has a contact portion accommodated in the receiving slot and exposed from the first surface. The first terminals include a pair of differential signal terminals and multiple non-high-speed terminals. The depressed slot is depressed from the first surface, located between contact portions of two differential signal terminals, and in communication with two adjacent receiving slots. The positioning slot is depressed from the first surface, located between contact portions of two adjacent non-high-speed terminals, or of adjacent non-high-speed terminal and differential signal terminal, and in communication with two adjacent receiving slots. The length of the positioning slot is less than the length of the depressed slot.

Abstract: An electrical connector includes a body having a tongue, a pair of first differential signal terminals and a pair of second differential signal terminals fixed to the body, and a middle shielding sheet fixed to the tongue, and located between the first and second differential signal terminals. The tongue includes an upper surface having two depressed first receiving slots and a lower surface having two depressed second receiving slots. A first groove is depressed from each first receiving slot. A second groove is upward depressed from each second receiving slot. Each first differential signal terminal has a first contact portion fixed to and exposed from the upper surface of the tongue. Each second differential signal terminal has a second contact portion fixed to and exposed from the lower surface of the tongue. The first and second contact portions are partially accommodated in the first and second receiving slot respectively.

Abstract: A bump structure that may be used to interconnect one substrate to another substrate is provided. A conductive pillar is formed on a first substrate such that the conductive pillar has a width different than a contact surface on a second substrate. In an embodiment the conductive pillar of the first substrate has a trapezoidal shape or a shape having tapered sidewalls, thereby providing a conductive pillar having base portion wider than a tip portion. The substrates may each be an integrated circuit die, an interposer, a printed circuit board, a high-density interconnect, or the like.

Abstract: An electrical connector includes a body having a tongue, a row of first terminals insert-molded in the body, a depressed slot, and a positioning slot. The tongue includes a first surface having multiple receiving slots. Each first terminal has a contact portion accommodated in the receiving slot and exposed from the first surface. The first terminals include a pair of differential signal terminals and multiple non-high-speed terminals. The depressed slot is depressed from the first surface, located between contact portions of two differential signal terminals, and in communication with two adjacent receiving slots. The positioning slot is depressed from the first surface, located between contact portions of two adjacent non-high-speed terminals, or of adjacent non-high-speed terminal and differential signal terminal, and in communication with two adjacent receiving slots. The length of the positioning slot is less than the length of the depressed slot.

Abstract: A method suppresses transmission noise comprised in a plurality of downlink signals received by one of a first radio module or a second radio module comprised in a communications apparatus. The method receives a plurality of first signals and a plurality of second signals, wherein the first signals and the second signals are the downlink signals respectively received via different antennas of the one of the first radio module or the second radio module, or the first signals are the downlink signals received by the one of the first radio module or the second radio module and the second signals are a portion of the uplink signals provided by the other one of the first radio module and the second radio module, and processes the plurality of first signals and the plurality of second signals to cancel transmission noise comprised in the plurality of downlink signals.

Abstract: A device includes a work piece including a metal bump; and a dielectric layer having a portion directly over the metal bump. The metal bump and a surface of the portion of the dielectric layer form an interface. A metal finish is formed over and contacting the metal bump. The metal finish extends from over the dielectric layer to below the interface.

Abstract: A mating connector includes a plastic body, a first terminal group and a second terminal group received in the plastic body, a retaining elastic sheet retained at the plastic body and located at a side of the first terminal group and the second terminal group, a middle shielding sheet located between the first terminal group and the second terminal group, and a shielding case contacting the middle shielding sheet. An urging portion is extended from the middle shielding sheet and abuts the retaining elastic sheet. The middle shielding sheet shields an interference signal between plate surfaces of the first and second terminal groups. The retaining elastic sheet shields an interference signal between side surfaces of the first and second terminal groups.

Abstract: A system and method for providing content to a user based on at least one prior user experience are provided. First content is transmitted to a user, wherein at least some of the first content is transmitted in response to one or more user content selections. Frequency information based on the inputs and/or the first content is stored. A request for content is received from the user. Second content is selected based on the frequency information.

Abstract: A method for printed circuit board design of temperature sensitive components includes a scrub tool receiving a list of part numbers for electronic components of a printed circuit board assembly (“PCBA”). The scrub tool sends one or more queries for finding temperature and time limits of the electronic components to a database. A mapping tool receives a selection of one or more part numbers responsive to the one or more queries, wherein the selection is responsive to the temperature and time limits. The mapping tool sends a data structure to a physical design tool which is configured with physical design data for generating a graphic representation of the PCBA. The data structure from the mapping tool provides the received selection of one or more part numbers and configures the physical design tool to highlight components having part numbers of the selection on the PCBA graphic representation.

Abstract: An object recognition method and an object recognition apparatus using the same are provided. In one or more embodiments, a real-time image including a first object is acquired, and a chamfer distance transform is performed on the first object of the real-time image to produce a chamfer image including a first modified object. Preset image templates each including a second object are acquired, and the chamfer distance transform is performed on the second object of each preset image template to produce a chamfer template including a second modified object. When the difference between the first modified object and the second modified object is less than a first preset error threshold, the object recognition apparatus may operate according to a control command corresponding to the preset image template.

Abstract: A method of preparing an epitope for a secondary antibody detected protein tag, comprising: constructing a expressing vector, comprising a nucleotide sequence for encoding the secondary antibody detected protein tag comprising at least one epitope selected from at least one primary antibody which is detected by corresponding secondary antibody; expressing the vector in a host cell; and obtaining the secondary antibody detected protein tag which is expressed in the host cell. Further, a method for constructing a protein molecular weight marker ladder, comprising constructing a plurality of recombinant protein tags with different molecular weights, wherein each the recombinant protein tag comprises at least one epitope of primary antibody. Besides, a secondary antibody detected protein tag comprises at least two peptide sequences of epitopes selected from primary antibodies of at least two different species.