Abstract: An IC chip package is constructed to include a substrate, a chip, adhesive means, a cover, and a spacer. The substrate has a top side, a bottom side, and a plurality of conductive pads at the top side. The chip is fixedly mounted in the top side of the substrate, having a plurality of conductive pads respectively electrically connected to the conductive pads of substrate by respective bonding wires. The adhesive means is provided at the top side of the substrate around the border area. The spacer is connected between the substrate and the cover to keep the cover from the substrate at a distance. The spacer has at least two columns fixedly connected between the substrate and the cover.

Abstract: An IC chip package is constructed to include a substrate, a chip, adhesive means, a cover, and a spacer. The substrate has a top side, a bottom side, and a plurality of conductive pads at the top side. The chip is fixedly mounted in the top side of the substrate, having a plurality of conductive pads respectively electrically connected to the conductive pads of substrate by respective bonding wires. The adhesive means is provided at the top side of the substrate around the border area. The spacer is connected between the substrate and the cover to keep the cover from the substrate at a distance.

Abstract: An IC chip package is constructed to include a substrate, a chip, adhesive means, a cover, and a spacer. The substrate has a top side, a bottom side, and a plurality of conductive pads at the top side. The chip is fixedly mounted in the top side of the substrate, having a plurality of conductive pads respectively electrically connected to the conductive pads of substrate by respective bonding wires. The adhesive means is provided at the top side of the substrate around the border area. The spacer is connected between the substrate and the cover to keep the cover from the substrate at a distance. The spacer has at least two columns fixedly connected between the substrate and the cover.

Abstract: The present invention is to provide a manufacturing process of an integrated circuit module comprising the following steps: (a) providing a circuit board, which has at least one module circuit pattern thereon, said circuit pattern having at least one chip assembly area and an electronic element assembly area; (b) mounting at least one substrate on said at least one chip assembly area; said substrate is provided thereon with at least one connecting circuit pattern which is electrically connected to the at least one module circuit pattern of said circuit board; (c) mounting at least one IC chip on said at least one substrate such that said IC chip is electrically connected to said connecting circuit pattern of the substrate.

Abstract: The present invention is to provide a multi-chip module including a substrate, at least a chip, a plurality of bonding wires, and a cover body. The substrate has a top surface, a bottom surface, and at least a receiving chamber recessed inward from the top surface toward the bottom surface of the substrate. The chip is fixedly received in the receiving chamber and provided with a plurality of bonding pads. Each of the bonding wires has one end electrically connected to one of the bonding pads of the chip and the other end substantially horizontally electrically connected to a conductive pattern of the substrate. The cover body is fixedly mounted on the top surface of the substrate for covering the receiving chamber and isolating the chip from the outside, whereby the cover body is extremely adjacently mounted on the top surface of the substrate to effectively reduce the overall thickness of the module.

Abstract: The present invention is to provide a manufacturing process of an integrated circuit module comprising the following steps: (a) providing a circuit board, which has at least one module circuit pattern thereon, said circuit pattern having at least one chip assembly area and an electronic element assembly area; (b) mounting at least one substrate on said at least one chip assembly area; said substrate is provided thereon with at least one connecting circuit pattern which is electrically connected to the at least one module circuit pattern of said circuit board; (c) mounting at least one IC chip on said at least one substrate such that said IC chip is electrically connected to said connecting circuit pattern of the substrate.

Abstract: A lens module is fixed on a board body which is provided thereon with an imaging chip. The lens module comprises a seat body in which at least one lens is fixed for passage of rays of light from the outside of the seat body so as to form an image on the chip. An expandable tube is sandwiched between the seat body and the board body and is provided with a serpentine segment. A closed passage is formed between the lens and the chip. The expandable tube is provided thereon with a fixation member for limiting deformation of the serpentine segment of the expandable tube.

Abstract: A lens module is fixed on a board body which is provided thereon with an imaging chip. The lens module comprises a seat body in which at least one lens is fixed for passage of rays of light from the outside of the seat body so as to form an image on the chip. An expandable tube is sandwiched between the seat body and the board body and is provided with a serpentine segment. A closed passage is formed between the lens and the chip. The expandable tube is provided thereon with a fixation member for limiting deformation of the serpentine segment of the expandable tube.

Abstract: An IC chip package is constructed to include a substrate, a chip, adhesive means, a cover, and a spacer. The substrate has a top side, a bottom side, and a plurality of conductive pads at the top side. The chip is fixedly mounted in the top side of the substrate, having a plurality of conductive pads respectively electrically connected to the conductive pads of substrate by respective bonding wires. The adhesive means is provided at the top side of the substrate around the border area. The spacer is connected between the substrate and the cover to keep the cover from the substrate at a distance.