Patents by Inventor WEN-WEN HONG

WEN-WEN HONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230211532
    Abstract: A molding die includes a first mold assembly, a second mold assembly, and a mold core. The first and second mold assemblies are adapted to be clamped together. The mold core defines a molding groove. The molding core is pressed between the first and second mold assemblies to form a molding cavity. The second mold assembly includes a light transmitting area corresponding to the molding cavity, so that the molding cavity will receive incident light through the light transmitting area. In the molding die, the first mold assembly, the second mold assembly, and the mold core cooperate to form the molding cavity, adhesive is injected into the molding cavity, and the molding cavity receives incident light through the light transmitting area, so that curing efficiency of the adhesive is improved, production efficiency is high, shape of molded adhesive is uniform, and product quality is improved.
    Type: Application
    Filed: December 28, 2022
    Publication date: July 6, 2023
    Inventors: ZHI-QIANG CHEN, WEN-WEN HONG, HUA-ZHONG LIU, BING CHEN, XIANG-YONG LIU, YU-MEI ZHAO