Abstract: An implantable device or implant is configured to be positioned within a native heart valve to allow the native heart valve to form a more effective seal. In some examples, a plurality of sutures is employed to secure frame portions of the implantable device to a connector of the implantable device. Each of the sutures can be passed through one or more eyelets of the frame portions and the connector. In some examples, an implantable device includes an actuation cap having a flexible portion or a biasing element positioned between an end portion of the actuation cap and an anchor portion of the implantable device. The flexible portion or the biasing element flex or compress responsive to forces between the connector and the actuation cap.

Abstract: An implantable device is configured to be positioned within a native heart valve to allow the native heart valve to form a more effective seal. The implantable device includes a cover. The cover can be attached to one or more sleeves, can have a portion that has a lower coefficient of friction, and/or can have separate pieces that cover different portions of the implantable device.

Abstract: The opto-electrical module packaging installs opto-electrical devices on a conductive leadframe to form an opto-electrical module. The opto-electrical module is then packaged using a molding packaging means, forming a transparent plastic base. The transparent plastic base is installed with a convergent lens to focus light. The leadframe has a plurality of pins and is mounted on the circuit board by soldering. This forms a packaging structure without bare pins exposed to the environment. In addition, the leadframe has a precision alignment structure extending outward as the alignment mechanism when assembled with a fiber connector. The precision packaging procedure provides a precision alignment of the converging lens and the opto-electrical devices at the same time.

Abstract: The opto-electrical module packaging installs opto-electrical devices on a conductive leadframe to form an opto-electrical module. The opto-electrical module is then packaged using a molding packaging means, forming a transparent plastic base. The transparent plastic base is installed with a convergent lens to focus light. The leadframe has a plurality of pins and is mounted on the circuit board by soldering. This forms a packaging structure without bare pins exposed to the environment. In addition, the leadframe has a precision alignment structure extending outward as the alignment mechanism when assembled with a fiber connector. The precision packaging procedure provides a precision alignment of the converging lens and the opto-electrical devices at the same time.