Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.

Abstract: A microcoil element, an array-type microcoil element and a device are provided. The microcoil element includes a wiring layer having continuous multiple metal line segments that form multiple loops around a starting point of the element. Every metal line segment includes a first electrode end and a second electrode end. The microcoil element includes an electrode layer having a first electrode zone and a second electrode zone that respectively collect the first electrode ends and the second electrode ends of the multiple metal line segments. When designing the microcoil element, parameters such as a total length of the multiple line segments, a line width, a line spacing of adjacent line segments, a length of each line segment, turns of the microcoil, and a loop distance according to impedance requirement. The single microcoil element or the array-type microcoil element can be used as a magnetic component of a device.