Abstract: A method for detecting heat dissipation is provided, including the following steps: sensing a core temperature of a heat emitting component of an electronic device; sensing current power of the heat emitting component when the core temperature is greater than or equal to a warning temperature; and transmitting an assembling check prompt and activating a thermal control circuit (TCC) when the current power is less than thermal design power (TDP) of the heat emitting component. An electronic device is further provided, to execute the method for detecting heat dissipation.

Abstract: A diagnostic system applied to an electronic equipment with a plurality of hardware devices is provided. The hardware devices include a display and a processor, the diagnostic system is executed by the processor to diagnose the hardware devices. The diagnostic system includes a diagnostic test interface, which is displayed on the display and includes a plurality of hardware items corresponding to the hardware devices. Each of the hardware items links to the hardware devices. When at least one of the hardware items is triggered, the processor executes the diagnostic item of the hardware device corresponding to the triggered hardware item.

Abstract: A method for detecting heat dissipation is provided, including the following steps: sensing a core temperature of a heat emitting component of an electronic device; sensing current power of the heat emitting component when the core temperature is greater than or equal to a warning temperature; and transmitting an assembling check prompt and activating a thermal control circuit (TCC) when the current power is less than thermal design power (TDP) of the heat emitting component. An electronic device is further provided, to execute the method for detecting heat dissipation.

Abstract: A diagnostic system applied to an electronic equipment with a plurality of hardware devices is provided. The hardware devices include a display and a processor, the diagnostic system is executed by the processor to diagnose the hardware devices. The diagnostic system includes a diagnostic test interface, which is displayed on the display and includes a plurality of hardware items corresponding to the hardware devices. Each of the hardware items links to the hardware devices. When at least one of the hardware items is triggered, the processor executes the diagnostic item of the hardware device corresponding to the triggered hardware item.

Abstract: A method for preparing a wear-resistant hybrid, includes (A) providing nano-silica with hydroxyl groups on its surface to react with an isocyanate-based silane to form silica with silyl groups; (B) subjecting the silica with silyl groups to a hydrolytic condensation reaction by using a sol-gel technology to form highly bifurcated Si-HB nanoparticles with hydroxyl groups; (C) providing a diisocyanate to react with a polyol to form a urethane pre-polymer; and (D) subjecting the Si-HB nanoparticles with hydroxyl groups to an addition reaction with the urethane pre-polymer and with a chain-extending reagent to form a hybrid of Si-polyurethane (PU/Si-HB), whereby a wear-resistant hybrid of Si-polyurethane is prepared.

Abstract: A method for preparing a wear-resistant hybrid, includes (A) providing nano-silica with hydroxyl groups on its surface to react with an isocyanate-based silane to form silica with silyl groups; (B) subjecting the silica with silyl groups to a hydrolytic condensation reaction by using a sol-gel technology to form highly bifurcated Si-HB nanoparticles with hydroxyl groups; (C) providing a diisocyanate to react with a polyol to form a urethane pre-polymer; and (D) subjecting the Si-HB nanoparticles with hydroxyl groups to an addition reaction with the urethane pre-polymer and with a chain-extending reagent to form a hybrid of Si-polyurethane (PU/Si-HB), whereby a wear-resistant hybrid of Si-polyurethane is prepared.