Patents by Inventor Wen Yen Kung

Wen Yen Kung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLISHING PAD CONDITIONING SYSTEM AND METHOD OF USING
    Publication number: 20240009801
    Abstract: A method of conditioning a polishing pad includes conditioning the polishing pad using a conditioner. The method includes detecting a roughness of the polishing pad following the conditioning. The method further includes tracking a number of iterations of the conditioning of the polishing pad. The method further includes outputting a signal for replacing the polishing pad in response to the number of iterations reaching an iteration limit. The method further includes repeating the conditioning in response to the detected roughness of the polishing pad being outside of a threshold roughness range and the number of iterations failing to reach the iteration limit.
    Type: Application
    Filed: July 25, 2023
    Publication date: January 11, 2024
    Inventor: Wen Yen KUNG
  • Chemical mechanical polishing system and method of using
    Patent number: 11724360
    Abstract: A method of conditioning a polishing pad includes receiving information on a roughness of the polishing pad from a first sensor. The method further includes conditioning the polishing pad using a conditioner. The method further includes detecting the roughness of the polishing pad following the conditioning. The method further includes repeating the conditioning in response to the detected roughness of the polishing pad being outside of a threshold roughness range.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: August 15, 2023
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC NANJING COMPANY, LIMITED
    Inventor: Wen Yen Kung
  • CHEMICAL MECHANICAL POLISHING SYSTEM AND METHOD OF USING
    Publication number: 20210370466
    Abstract: A method of conditioning a polishing pad includes receiving information on a roughness of the polishing pad from a first sensor. The method further includes conditioning the polishing pad using a conditioner. The method further includes detecting the roughness of the polishing pad following the conditioning. The method further includes repeating the conditioning in response to the detected roughness of the polishing pad being outside of a threshold roughness range.
    Type: Application
    Filed: June 24, 2020
    Publication date: December 2, 2021
    Inventor: Wen Yen Kung