Patents by Inventor Wen-Yen Tzeng

Wen-Yen Tzeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF REPAIRING DEFECT IN SUPERCONDUCTING FILM, METHOD OF COATING SUPERCONDUCTING FILM, AND SUPERCONDUCTING FILM FORMED BY THE METHOD
    Publication number: 20150303368
    Abstract: A method of repairing defect in a superconducting film, a method of coating a superconducting film, and a superconducting film formed by the method are prepared. The method of repairing defect includes detecting the superconducting film during a manufacturing process thereof. When a defect therein is detected, a repairing structure with superconductivity is formed on a position of the defect.
    Type: Application
    Filed: July 15, 2014
    Publication date: October 22, 2015
    Inventors: Kun-Ping Huang, Hsi-Chuan Chen, Chiang-Hsiung Tong, Chih-Wei Luo, Wen-Yen Tzeng
  • Method of joining superconductor materials
    Patent number: 8808492
    Abstract: A method of joining superconductor materials is described. A microwave chamber including a first heat absorption plate and a second heat absorption plate corresponding to the first absorption plate is provided. A first superconductor material and a second superconductor material are disposed between the first heat absorption plate and the second heat absorption plate in the microwave chamber. The first superconductor material and the second superconductor material have an overlapping region therebetween, and a pressure is applied to the first heat absorption plate and the second heat absorption plate. Microwave power is supplied to the microwave chamber. The first heat absorption plate and the second heat absorption plate transform the microwave power into thermal energy so as to join the first superconductor material and the second superconductor material at the overlapping region.
    Type: Grant
    Filed: June 6, 2012
    Date of Patent: August 19, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Kun-Ping Huang, Chih-Chen Chang, Yu-Tse Hsieh, Chih-Wei Luo, Chih-Hsiang Su, Wen-Yen Tzeng
  • METHOD OF JOINING SUPERCONDUCTOR MATERIALS
    Publication number: 20130157868
    Abstract: A method of joining superconductor materials is described. A microwave chamber including a first heat absorption plate and a second heat absorption plate corresponding to the first absorption plate is provided. A first superconductor material and a second superconductor material are disposed between the first heat absorption plate and the second heat absorption plate in the microwave chamber. The first superconductor material and the second superconductor material have an overlapping region therebetween, and a pressure is applied to the first heat absorption plate and the second heat absorption plate. Microwave power is supplied to the microwave chamber. The first heat absorption plate and the second heat absorption plate transform the microwave power into thermal energy so as to join the first superconductor material and the second superconductor material at the overlapping region.
    Type: Application
    Filed: June 6, 2012
    Publication date: June 20, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kun-Ping Huang, Chih-Chen Chang, Yu-Tse Hsieh, Chih-Wei Luo, Chih-Hsiang Su, Wen-Yen Tzeng