Patents by Inventor Wen-Yi Kuo

Wen-Yi Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240394848
    Abstract: A video noise reduction method and a video noise reduction system based on a portrait mode are provided. The method includes configuring a processor to perform: inputting a current image into a portrait mode model to generate a current portrait probability image; executing a post-processing process, including performing a binarization process on the current portrait probability image to generate a mask image and executing a contour extraction process to extract a foreground region, a background region and a contour region; performing a filtering process, including: executing a motion detection process to locate a motion region and a stationary region; performing a time-domain filtering operation on the stationary region; for the motion region, obtaining a similar part of the previous image and a degree of difference of the similar part, so as to determine whether to compensate the motion region or to perform a spatial domain filtering operation.
    Type: Application
    Filed: December 5, 2023
    Publication date: November 28, 2024
    Inventors: ZHONG-YI QIU, WEN-TSUNG HUANG, YAO-JIA KUO
  • Publication number: 20240379670
    Abstract: A semiconductor device includes a substrate with a high voltage region and a low voltage region. A first deep trench isolation is disposed within the high voltage region. The first deep trench isolation includes a first deep trench and a first insulating layer filling the first deep trench. The first deep trench includes a first sidewall and a second sidewall facing the first sidewall. The first sidewall is formed by a first plane and a second plane. The edge of the first plane connects to the edge of the second plane. The slope of the first plane is different from the slope of the second plane.
    Type: Application
    Filed: June 6, 2023
    Publication date: November 14, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Ya-Ting Hu, Chih-Yi Wang, Yao-Jhan Wang, Wei-Che Chen, Kun-Szu Tseng, Yun-Yang He, Wen-Liang Huang, Lung-En Kuo, Po-Tsang Chen, Po-Chang Lin, Ying-Hsien Chen
  • Publication number: 20240377903
    Abstract: An electronic device is provided, which includes: a first substrate; a second substrate; a first polarizer, wherein the first substrate is disposed between the second substrate and the first polarizer; and a conductive adhesive disposed on the second substrate, wherein from a top view of the electronic device, a first portion of the conductive adhesive contacts the second substrate and extends along a first extending direction, a second portion of the conductive adhesive contacts the first substrate and extends along a second extending direction, the first extending direction and the second extending direction are different, a length of the second portion of the conductive adhesive along the second extending direction is greater than a length of the first portion of the conductive adhesive along the first extending direction, the first polarizer comprises an arc edge, and the arc edge is adjacent to the conductive adhesive.
    Type: Application
    Filed: July 24, 2024
    Publication date: November 14, 2024
    Inventors: Chiu-Lien YANG, Kuan-Hung KUO, Chiung-chieh KUO, Jiou-Teng LAI, Wen-Yi CHEN
  • Publication number: 20240371741
    Abstract: A layout structure of a flexible circuit board includes a flexible substrate, a circuit layer and a dummy circuit layer which are arranged on the flexible substrate. The circuit layer includes first inner leads, second inner leads, an inverted U-shape connection line and a horizontal inner lead. A first distance between the first inner leads is less than a second distance between the second inner leads. One of dummy leads of the dummy circuit layer is located between the first and second inner leads, another dummy lead is located between the second inner leads. The dummy leads are provided to allow lead spaces on both sides of the inverted U-shape connection line is the same. Thus, etching solution will not flow laterally in an etching space between the inverted U-shape connection line and the horizontal inner lead.
    Type: Application
    Filed: March 25, 2024
    Publication date: November 7, 2024
    Inventors: Hou-Chang Kuo, Wen-Ping Hsu, Ting-Yi Kuo, Yi-Ling Hsieh
  • Publication number: 20240355983
    Abstract: A display apparatus includes a driving backplane and a light emitting component. The driving backplane has a first pad and a second pad. The light emitting component is disposed on the driving backplane. The light emitting component includes a first semiconductor layer, a second semiconductor layer, an active layer, a first electrode, a second electrode, a first solder and a second solder. The first solder and the second solder of the light-emitting component are respectively disposed on the first pad and the second pad of the driving backplane and electrically connected to the first pad and the second pad respectively. A volume of the first solder is larger than a volume of the second solder, and an area of the first pad is smaller than an area of the second pad.
    Type: Application
    Filed: December 13, 2023
    Publication date: October 24, 2024
    Inventors: Chia-Hui Pai, Wen-Hsien Tseng, Chien-Hung Kuo, Wei-Chieh Chen, Kuan-Yi Lee, Chih-Chun Yang
  • Publication number: 20240355960
    Abstract: A light emitting element substrate includes a substrate and a light emitting element disposed on the substrate and including first and second semiconductor layers, an active layer, first and second electrodes, and first and second solders. The second semiconductor layer is disposed opposite to the first semiconductor layer. The active layer is disposed between the first and second semiconductor layers. The first and second electrodes are electrically connected to the first and second semiconductor layers respectively. The first and second solders are respectively disposed on and electrically connected to the first and second electrodes respectively. The first electrode includes a first under barrier pattern. The first solder covers the first under barrier pattern. A projection area of the first solder on the substrate is greater than a projection area of the first under barrier pattern on the substrate. A display apparatus is provided.
    Type: Application
    Filed: November 9, 2023
    Publication date: October 24, 2024
    Applicant: AUO Corporation
    Inventors: Chia-Hui Pai, Wen-Hsien Tseng, Chien-Hung Kuo, Wei-Chieh Chen, Kuan-Yi Lee, Chih-Chun Yang
  • Publication number: 20240332212
    Abstract: A package structure includes a package substrate, a semiconductor die module on the package substrate, a ring structure on the package substrate adjacent to the semiconductor die module, and a hybrid adhesive having a first modulus and a second modulus less than the first modulus and attaching the ring structure to the package substrate.
    Type: Application
    Filed: March 28, 2023
    Publication date: October 3, 2024
    Inventors: Wen-Yi Lin, Yi-Che Chiang, Chien-Chen Li, Chien-Li Kuo, Kuo-Chio Liu
  • Publication number: 20240290683
    Abstract: An embodiment semiconductor package structure may include a package substrate, a semiconductor die coupled to the package substrate, and a package lid attached to the package substrate and covering the semiconductor die. The package lid may include a top portion having a spatially varying thermal conductivity that is greater in a first region than in a second region. The first region may include a multi-layer structure including a metal/diamond composite material supported by a copper layer. The metal/diamond composite material may include a silver/diamond, copper/diamond, or aluminum/diamond material and may have a thermal conductivity that is within a range from 600 W/m·K to 900 W/m·K and a coefficient of thermal expansion that is in a second range from 5 ppm/° C. to 10 ppm/° C. The package lid may have an effective coefficient of thermal expansion that is in a range from 14.5 ppm/° C. to 17 ppm/° C.
    Type: Application
    Filed: February 27, 2023
    Publication date: August 29, 2024
    Inventors: Wen-Yi LIN, Kuang-Chun LEE, Chien-Chen LI, Chien-Li KUO, Kuo-Chio LIU
  • Publication number: 20240258722
    Abstract: This disclosure relates to a combination structure of an output line and a terminal. An output line includes an insulation sleeve and a copper wire. A conducting terminal includes a riveting ring, a conducting ring and a soldering segment connected to one another. The riveting ring is fixed on the insulation sleeve. The conducting ring covers the copper wire. The soldering segment is bent and extended with an included angle with respect to an extending direction of the output line. The output line and the conducting terminal pass through a reflow oven to make the conducting ring and the copper wire be tinned and connected. The insulation seat includes a base and a terminal slot. The soldering segment is embedded in the terminal slot. The circuit board and the conducting terminal pass through the reflow oven to make the soldering segment be tinned and connected to the circuit board.
    Type: Application
    Filed: April 20, 2023
    Publication date: August 1, 2024
    Inventors: Wen-Chuan LO, Po-Yi KUO, Chia-Hsiong HUANG
  • Publication number: 20240219553
    Abstract: A multiple-input multiple-output (MIMO) radar device for scanning at least one moving object in space, comprising a transmitting antenna array having a plurality of transmitters, a receiving antenna array having a plurality of receivers, and a processor. The transmitters transmit electromagnetic wave signals with predetermined timing delays to the moving object, the electromagnetic wave signals are configured with random sequences. The receivers receive the electromagnetic wave signals reflected by the moving object, each receiver includes a plurality of matched filters corresponding to the plurality of transmitters, each matched filter obtains the electromagnetic wave signals with the predetermined timing delays from a corresponding transmitter and outputting a value. The processor accumulating the value outputted by each matched filter of each receiver and calculating a 3D cubic aggregate result for showing an existence probability of the at least one moving object in space.
    Type: Application
    Filed: December 30, 2022
    Publication date: July 4, 2024
    Inventors: WEN-YI KUO, Li-Chun Wang, Yun-Ruei Lee, Yi-Lin Lee, CHENG-FENG YEH
  • Publication number: 20240130801
    Abstract: An imaging self-positioning system includes a robotic actuator for manipulating an imaging tool or medical probe and a sensory component for maintaining a normal orientation above patient a treatment site. The imaging tool, typically an US probe, is grasped by an end-effector or similar actuator, and a sensory component engaged with the imaging tool senses an orientation of the tool relative to the treatment surface, and the robotic actuator disposes the imaging tool for maintaining a normal or other predetermined angular alignment with the treatment surface. The treatment surface is a patient epidermal region adjacent an imaged region for identifying anatomical features and surgical targets. A medical probe such as a biopsy needle may accompany the end-effector for movement consistent with the probe, either manually or robotically advanced towards the surgical target.
    Type: Application
    Filed: October 18, 2023
    Publication date: April 25, 2024
    Inventors: Haichong Zhang, Xihan Ma, Ashiqur Rahaman, Wen-Yi Kuo
  • Publication number: 20230244436
    Abstract: A method and a system for switching multi-function modes applied in an electronic device having a plurality of hardware module functions, and includes receiving input information from a user of the electronic device; obtaining status information of the electronic device; and switching the electronic device to one of the multi-function modes according to the input information and the status information, each of the multi-function modes corresponds to at least one of the plurality of hardware module functions.
    Type: Application
    Filed: August 19, 2022
    Publication date: August 3, 2023
    Inventors: WEN-YI KUO, CHUNG-TSUNG WANG, JU-CHI HSUEH, CHENG-FENG YEH, WEI-CHENG WANG
  • Patent number: 11483779
    Abstract: A user equipment and a communication method are provided. The user equipment includes a signal transceiver, a first antenna, a second antenna, a third antenna, and a power amplifier module. The signal transceiver applies a conversion between a baseband signal and a radio frequency signal. The first antenna is a primary antenna for receiving and transmitting RF signals. The second antenna is a diversity antenna for receiving RF signals. The third antenna is a low frequency antenna for transmitting signals in a specific low frequency band. The power amplifier module is electrically connected to the signal transceiver, the first antenna, and the third antenna. The power amplifier module amplifies the RF signal output by the signal transceiver and outputs same to either the first or third antenna.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: October 25, 2022
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Chung-Tsung Wang, Wen-Yi Kuo
  • Publication number: 20220061000
    Abstract: A user equipment and a communication method are provided. The user equipment includes a signal transceiver, a first antenna, a second antenna, a third antenna, and a power amplifier module. The signal transceiver applies a conversion between a baseband signal and a radio frequency signal. The first antenna is a primary antenna for receiving and transmitting RF signals. The second antenna is a diversity antenna for receiving RF signals. The third antenna is a low frequency antenna for transmitting signals in a specific low frequency band. The power amplifier module is electrically connected to the signal transceiver, the first antenna, and the third antenna. The power amplifier module amplifies the RF signal output by the signal transceiver and outputs same to either the first or third antenna.
    Type: Application
    Filed: July 6, 2021
    Publication date: February 24, 2022
    Inventors: CHUNG-TSUNG WANG, WEN-YI KUO
  • Patent number: 11211691
    Abstract: An antenna structure able to occupy a very small space in an electronic device includes a metal frame and at least one feed source. The metal frame is metallic, a protruding portion protrudes from a side of the metal frame. The side of the metal frame with the protruding portion defines a first gap and a second gap. The first gap and the second gap divide the metal frame into radiation portions. The at least one feed source is electrically connected to each of the at least two radiation portions and feeds a current to each of the at least two radiation portions.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: December 28, 2021
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Wen-Yi Kuo, Po-Ching Huang, Chueh-Chuan Chen, Yen-Hui Lin
  • Patent number: 11101548
    Abstract: An antenna of reduced size but of multiple functions according to manual adjustment includes a side frame made of metallic material, a feeding portion, and a moving module. The side frame defines first and second gaps each passing through the side frame to form at least one radiating portion. The feeding portion can feed current to either of the radiating portions. The metallic and movable moving module including an extending portion is movable relative to the side frame. In a first position, the extending portion is not connected to any radiating portion, and when moved to a second position, the extending portion is connected to one of the radiating portions.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: August 24, 2021
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Yen-Hui Lin, Wen-Yi Kuo, Po-Ching Huang, Chueh-Chuan Chen
  • Publication number: 20200076060
    Abstract: An antenna of reduced size but of multiple functions according to manual adjustment includes a side frame made of metallic material, a feeding portion, and a moving module. The side frame defines first and second gaps each passing through the side frame to form at least one radiating portion. The feeding portion can feed current to either of the radiating portions. The metallic and movable moving module including an extending portion is movable relative to the side frame. In a first position, the extending portion is not connected to any radiating portion, and when moved to a second position, the extending portion is connected to one of the radiating portions.
    Type: Application
    Filed: August 26, 2019
    Publication date: March 5, 2020
    Inventors: YEN-HUI LIN, WEN-YI KUO, PO-CHING HUANG, CHUEH-CHUAN CHEN
  • Patent number: 10536634
    Abstract: A multiple lens system includes at least one lens unit, at least one reflecting unit, a first image sensing element, a second image sensing element, and a processing unit. The processing unit is electrically connected to the first image sensing element and the second image sensing element. The processing unit controls at least one angle of the at least one reflection unit according to a capturing mode, changes at least one optical path of the at least one reflection unit, and selects at least one lens of the at least one lens unit. At least one image beam obtained by the selected at least one lens is reflected or projected to at least one of the first image sensing element and the second image sensing element through the at least one optical path.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: January 14, 2020
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Shang-Wen Lee, Wen-Yi Kuo, Meng-Jer Huang
  • Publication number: 20190386379
    Abstract: An antenna structure able to occupy a very small space in an electronic device includes a metal frame and at least one feed source. The metal frame is metallic, a protruding portion protrudes from a side of the metal frame. The side of the metal frame with the protruding portion defines a first gap and a second gap. The first gap and the second gap divide the metal frame into radiation portions. The at least one feed source is electrically connected to each of the at least two radiation portions and feeds a current to each of the at least two radiation portions.
    Type: Application
    Filed: June 14, 2019
    Publication date: December 19, 2019
    Inventors: WEN-YI KUO, PO-CHING HUANG, CHUEH-CHUAN CHEN, YEN-HUI LIN
  • Publication number: 20170272650
    Abstract: A multiple lens system includes at least one lens unit, at least one reflecting unit, a first image sensing element, a second image sensing element, and a processing unit. The processing unit is electrically connected to the first image sensing element and the second image sensing element. The processing unit controls at least one angle of the at least one reflection unit according to a capturing mode, changes at least one optical path of the at least one reflection unit, and selects at least one lens of the at least one lens unit. At least one image beam obtained by the selected at least one lens is reflected or projected to at least one of the first image sensing element and the second image sensing element through the at least one optical path.
    Type: Application
    Filed: March 14, 2017
    Publication date: September 21, 2017
    Inventors: SHANG-WEN LEE, WEN-YI KUO, MENG-JER HUANG