Patents by Inventor Wen-Yi Tseng

Wen-Yi Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240134150
    Abstract: A lens driving apparatus includes a holder, a cover, a carrier, a first magnet, a coil, a spring, two second magnets and a hall sensor. The holder includes an opening hole. The cover is made of metal material and coupled to the holder. The carrier is movably disposed in the cover, and for coupling to a lens. The first magnet is connected to an inner side of the cover. The coil is wound around an outer side of the carrier, and adjacent to the first magnet. The spring is coupled to the carrier. The second magnets are disposed on one end of the carrier which is toward the holder. The hall sensor is for detecting a magnetic field of any one of the second magnets, wherein the magnetic field is varied according to a relative displacement between the hall sensor and the second magnet which is detected.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Chun-Yi LU, Te-Sheng TSENG, Wen-Hung HSU
  • Publication number: 20240128420
    Abstract: A display panel including a circuit board, a plurality of bonding pads, a plurality of light emitting devices, and a plurality of solder patterns is provided. The bonding pads are disposed on the circuit board, and each includes a first metal layer and a second metal layer. The second metal layer is located between the first metal layer and the circuit board. The first metal layer includes an opening overlapping the second metal layer. A material of the first metal layer is different from a material of the second metal layer. The light emitting devices are electrically bonded to the bonding pads. Each of the solder patterns electrically connects one of the light emitting devices and one of the bonding pads. The solder patterns each contact the second metal layer through the opening of the first metal layer of one of the bonding pads to form a eutectic bonding.
    Type: Application
    Filed: December 6, 2022
    Publication date: April 18, 2024
    Applicant: AUO Corporation
    Inventors: Chia-Hui Pai, Tai-Tso Lin, Wen-Hsien Tseng, Wei-Chieh Chen, Kuan-Yi Lee, Chih-Chun Yang
  • Publication number: 20090220848
    Abstract: A fuel cell stack assembly includes a fuel cell stack, a first pressure-supporting end plate assembly, a first current collector plate, a second pressure-supporting end plate assembly, a second current collector plate, and a pressure-applying structure. The first pressure-supporting end plate assembly is coupled to a first electrode side of the fuel cell stack through the first end plate and the first current collector plate, and the second pressure-supporting end plate assembly is coupled to a second electrode side of the fuel cell stack through the second end plate and the second current collector plate. The pressure-applying structure includes a pressure-applying plate and a pair of side plates form therebetween an open end.
    Type: Application
    Filed: February 19, 2009
    Publication date: September 3, 2009
    Inventors: Jefferson Ys Yang, Mao-Chun Hsu, Feng-Hsiang Hsiao, Wen-Yi Tseng