Abstract: The present invention relates to an electronic device having a passive heat-dissipating mechanism. The electronic device includes a circuit board and a radiation enhancement layer. The circuit board has at least an electronic component thereon. The radiation enhancement layer is attached onto at least a portion of a surface of the electronic component for facilitating radiating the heat from the electronic component to the ambient air via natural convection. The radiation enhancement layer is made of a ceramic material.

Abstract: A heat-dissipating device for radiating heat to the ambient air via natural convection includes a thermally conductive plate and a radiation-enhancing layer. The thermally conductive plate is mounted on a circuit board. The radiation-enhancing layer is attached onto a surface of the thermally conductive plate and having a higher emissivity than the thermally conductive plate. By means of such a structure of the heat-dissipating device, the heat generated from an electronic component on the circuit board is successively conducted to the thermally conductive plate, transferred to the radiation-enhancing layer and radiated from the radiation-enhancing layer to the ambient air via natural convection.