Patents by Inventor Wen-Yin Chang

Wen-Yin Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240191040
    Abstract: Synthetic amino acid-modified polymers and methods of making the same and using the same are disclosed. The synthetic amino acid-modified polymers possess distinct thermosensitive, improved water-erosion resistant, and enhanced mechanical properties, and are suitable of reducing or preventing formation of postoperative tissue adhesions. Additionally, the amino acid-modified polymers can also be used as a vector to deliver pharmaceutically active agents.
    Type: Application
    Filed: February 21, 2024
    Publication date: June 13, 2024
    Applicant: PROVIEW-MBD BIOTECH CO., LTD.
    Inventors: Yu-Chia CHANG, Yunn-Kuen CHANG, Wen-Yen HUANG, Ging-Ho HSIUE, Hsieh-Chih TSAI, Shuian-Yin LIN, Nai-Sheng HSU, Tzu-Yu LIN
  • Patent number: 11939432
    Abstract: Synthetic amino acid-modified polymers and methods of making the same and using the same are disclosed. The synthetic amino acid-modified polymers possess distinct thermosensitive, improved water-erosion resistant, and enhanced mechanical properties, and are suitable of reducing or preventing formation of postoperative tissue adhesions. Additionally, the amino acid-modified polymers can also be used as a vector to deliver pharmaceutically active agents.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: March 26, 2024
    Assignee: PROVIEW-MBD BIOTECH CO., LTD.
    Inventors: Yu-Chia Chang, Yunn-Kuen Chang, Wen-Yen Huang, Ging-Ho Hsiue, Hsieh-Chih Tsai, Shuian-Yin Lin, Nai-Sheng Hsu, Tzu-Yu Lin
  • Patent number: 11939431
    Abstract: The present invention relates to a composition comprising an amino acid-modified polymer, a carboxypolysaccharide, and may further include a metal ion for anti-adhesion and vector application. More specifically, the invention relates to a thermosensitive composition having enhanced mechanical and improved water-erosion resistant properties for efficiently preventing tissue adhesions and can serve as a vector with bio-compatible, bio-degradable/absorbable, and in-vivo sustainable properties.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: March 26, 2024
    Assignee: PROVIEW-MBD BIOTECH CO., LTD.
    Inventors: Yu-Chia Chang, Yunn-Kuen Chang, Wen-Yen Huang, Ging-Ho Hsiue, Hsieh-Chih Tsai, Shuian-Yin Lin, Nai-Sheng Hsu, Tzu-Yu Lin
  • Publication number: 20240074119
    Abstract: An immersion cooling system includes a pressure seal tank, an electronic apparatus, a pressure balance pipe and a relief valve. The pressure seal tank is configured to store coolant. A vapor space is formed in the pressure seal tank above the liquid level of the coolant. The electronic apparatus is completely immersed in the coolant. The pressure balance pipe has a gas collection length. The first port of the pressure balance pipe is disposed on the top surface of the pressure seal tank. The relief valve is disposed on the second port of the pressure balance pipe. The second port is farther away from the top surface of the pressure seal tank than the first port. The gas collection length of the pressure equalization tube allows the concentration of vaporized coolant at the first port to be greater than the concentration of vaporized coolant at the second port.
    Type: Application
    Filed: May 9, 2023
    Publication date: February 29, 2024
    Inventors: Ren-Chun CHANG, Wei-Chih LIN, Sheng-Chi WU, Wen-Yin TSAI, Li-Hsiu CHEN
  • Patent number: 7320901
    Abstract: A fabrication method for a chip packaging structure disclosed herein is utilizing the method of plating metal to connect different layers so as to replace the traditional method that drill hole firstly and then plate metal in the hole. In the present invention, the metal in the conductive through hole is solid metal so as can provide good ability of heat sinking. Besides, the present fabrication method utilizes the existing manufacturing processes without extra process or equipment so as can decrease the PCB processes and lower the package cost.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: January 22, 2008
    Assignee: Taiwan Solutions Systems Corp.
    Inventor: Wen-Yin Chang
  • Publication number: 20070099339
    Abstract: A fabrication method for a chip packaging structure disclosed herein is utilizing the method of plating metal to connect different layers so as to replace the traditional method that drill hole firstly and then plate metal in the hole. In the present invention, the metal in the conductive through hole is solid metal so as can provide good ability of heat sinking. Besides, the present fabrication method utilizes the existing manufacturing processes without extra process or equipment so as can decrease the PCB processes and lower the package cost.
    Type: Application
    Filed: October 31, 2005
    Publication date: May 3, 2007
    Inventor: Wen-Yin Chang