Patents by Inventor Wen-Yin Chang

Wen-Yin Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fabrication method for a chip packaging structure
    Patent number: 7320901
    Abstract: A fabrication method for a chip packaging structure disclosed herein is utilizing the method of plating metal to connect different layers so as to replace the traditional method that drill hole firstly and then plate metal in the hole. In the present invention, the metal in the conductive through hole is solid metal so as can provide good ability of heat sinking. Besides, the present fabrication method utilizes the existing manufacturing processes without extra process or equipment so as can decrease the PCB processes and lower the package cost.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: January 22, 2008
    Assignee: Taiwan Solutions Systems Corp.
    Inventor: Wen-Yin Chang
  • Fabrication method for a chip packaging structure
    Publication number: 20070099339
    Abstract: A fabrication method for a chip packaging structure disclosed herein is utilizing the method of plating metal to connect different layers so as to replace the traditional method that drill hole firstly and then plate metal in the hole. In the present invention, the metal in the conductive through hole is solid metal so as can provide good ability of heat sinking. Besides, the present fabrication method utilizes the existing manufacturing processes without extra process or equipment so as can decrease the PCB processes and lower the package cost.
    Type: Application
    Filed: October 31, 2005
    Publication date: May 3, 2007
    Inventor: Wen-Yin Chang