Patents by Inventor Wen-Yu Chiu

Wen-Yu Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151743
    Abstract: The present disclosure is directed to a method of manufacturing one or more needles of a probe card by refining and processing a conductive body that extends from the probe card to form a respective tip at the end of the respective conductive body. Forming the respective tip of a respective needle includes removing respective portions from the end of the conductive body by flowing an electrolytic fluid between a conductive pattern structure and an end of the respective conductive body. Removing the respective portions with the flow of the electrons may be performed in multiple successive steps to form various needles with various sizes, shapes, and profiles (e.g., cylindrical, rectangular, triangular, trapezoidal, etc.).
    Type: Application
    Filed: February 7, 2023
    Publication date: May 9, 2024
    Inventors: Ting-Yu CHIU, Yi-Neng CHANG, Wen-Chun TU, Te-Kun LIN, Chien Fang HUANG
  • Patent number: 11921001
    Abstract: A method and system for inspecting deviation in dynamic characteristics of a feeding system are provided, and the method includes: exciting the feeding system and detecting vibrations of a subcomponent of a component to be inspected of the feeding system to generate a monitoring excitation signal in a monitoring mode; calculating, by a modal analysis method, monitoring eigenvalues and monitoring eigenvectors of the monitoring excitation signal; determining, by a modal verification method, similarity between the monitoring eigenvalues and standard eigenvalues of a digital twin model and similarity between the monitoring eigenvectors and standard eigenvectors of the digital twin model; determining that the dynamic characteristics of the subcomponent are deviated, when the monitoring eigenvalues and monitoring eigenvectors are not similar to the standard eigenvalues and standard eigenvectors. Therefore, the subcomponent whose dynamic characteristics are deviated can be sensed remotely and precisely.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: March 5, 2024
    Assignee: Hiwin Technologies Corp.
    Inventors: Hsien-Yu Chen, Yu-Sheng Chiu, Chih-Chun Cheng, Wen-Nan Cheng, Chi-Ming Liu
  • Publication number: 20070151125
    Abstract: The shoe has a body, an insole, illuminating device and a shoe-pad. The body is formed as a single piece and has a recess, a heel, and a cavity. The cavity is formed in the body near the heel and communicates with the recess. The insole is mounted in the recess and has a crevice, a containing hole and a fixing hole. The crevice is formed in the bottom of the insole and corresponds to the cavity in the body. The containing hole is formed in the insole and corresponds to the cavity, and the fixing hole is formed in the periphery of the insole. The illuminating device is mounted between the body and the insole and has two wires, a power source, a circuit board, multiple illuminating elements and a switch. The shoe-pad is attached to insole and has a through hole and a cover.
    Type: Application
    Filed: January 5, 2006
    Publication date: July 5, 2007
    Inventors: Cheng-Yang Tsai, Wen-Yu Chiu, Kuo-Hsun Wu