Abstract: The present disclosure provides a display device and a display method. The display device includes: a memory for storing at least one pre-stored image; and a controller for: obtaining first and second target images according to the at least one pre-stored image; and controlling a display module, according to a first control instruction, to display the second target image and hide a display of at least one first sub-region in a first region in a frame displayed after switching from the first target image to the second target image. A size of the first target image is different from that of the second target image, and/or a position of the first target image in a display picture is different from that of the second target image. The first region represents a region within an outer contour of the first target image and not overlapping with the second target image.

Abstract: A method for fabricating an image sensor includes following steps. First, a substrate having semiconductor devices formed thereon is provided. Interlayer insulating films and Interlayer conductive films are formed on the substrate alternately, wherein the interlayer conductive films are electrically connected to the semiconductor devices. Next, isolated photo-diodes are formed on a topmost layer of the interlayer conductive films, wherein one electrode of the isolated photo-diodes is electrically connected to a topmost layer of the interlayer conductive films. A top insulating layer is formed on the topmost layer of the interlayer conductive films, wherein the isolated photo-diodes are covered by the top insulating layer. A top conductive layer is formed in the top insulating layer, wherein the top conductive layer is electrically connected to another electrode of the isolated photo-diodes.

Abstract: A method for fabricating an image sensor includes following steps. First, a substrate having semiconductor devices formed thereon is provided. Interlayer insulating films and Interlayer conductive films are formed on the substrate alternately, wherein the interlayer conductive films are electrically connected to the semiconductor devices. Next, isolated photo-diodes are formed on a topmost layer of the interlayer conductive films, wherein one electrode of the isolated photo-diodes is electrically connected to a topmost layer of the interlayer conductive films. A top insulating layer is formed on the topmost layer of the interlayer conductive films, wherein the isolated photo-diodes are covered by the top insulating layer. A top conductive layer is formed in the top insulating layer, wherein the top conductive layer is electrically connected to another electrode of the isolated photo-diodes.

Abstract: An image sensor including a substrate having a plurality of semiconductor devices formed thereon, an interconnection layer disposed on the substrate, and a plurality of isolated photo-diodes embedded in the interconnection layer is provided. The isolated photo-diodes are located above the semiconductor devices and electrically connected to the semiconductor devices through the interconnection layer. In the above-mentioned image sensor, thickness of the interconnection layer is not limited so as to facilitate fabrication of the SOC CMOS image sensor. In addition, the image sensor is advantageous in relatively high fill-factor, layout area saving and easy being implanted. Furthermore, a method for fabricating the image mentioned above is also provided.

Abstract: An image sensor including a substrate having a plurality of semiconductor devices formed thereon, an interconnection layer disposed on the substrate, and a plurality of isolated photo-diodes embedded in the interconnection layer is provided. The isolated photo-diodes are located above the semiconductor devices and electrically connected to the semiconductor devices through the interconnection layer. In the above-mentioned image sensor, thickness of the interconnection layer is not limited so as to facilitate fabrication of the SOC CMOS image sensor. In addition, the image sensor is advantageous in relatively high fill-factor, layout area saving and easy being implanted. Furthermore, a method for fabricating the image mentioned above is also provided.