Abstract: A bokeh filter membrane, which is disposed on a surface of a substrate, includes a gradient thickness absorbing membrane and an anti-reflection membrane. The anti-reflection membrane includes a high-and-low refraction membrane and a gradient refraction membrane. A transmittance of the substrate at a center thereof is greater than a transmittance of the substrate at a peripheral region thereof. The high-and-low refraction membrane includes a first high-and-low refraction membrane and a second high-and-low refraction membrane, the gradient thickness absorbing membrane is farther away from the substrate than the first high-and-low refraction membrane, the second high-and-low refraction membrane is farther away from the substrate than the gradient thickness absorbing membrane, and the gradient refraction membrane is farther away from the substrate than the second high-and-low refraction membrane. The gradient refraction membrane includes a plurality of pores.

Abstract: A catadioptric optical membrane, which is disposed on a surface of a substrate, includes a reflection membrane and a matting membrane. The reflection membrane is disposed on an effective optical path area of the substrate and includes a reflection metal membrane and a reflection oxidation membrane. The reflection oxidation membrane includes a first reflection oxidation membrane and a second reflection oxidation membrane. The reflection metal membrane is farther away from the substrate than the first reflection oxidation membrane. The second reflection oxidation membrane is farther away from the substrate than the reflection metal membrane. The matting membrane is disposed on a non-effective optical path area of the substrate. The matting membrane includes a deep-color membrane and a first anti-reflection membrane. The deep-color membrane includes a deep-color metal membrane and a deep-color oxidation membrane. The deep-color membrane is farther away from the substrate than the first anti-reflection membrane.

Abstract: A method for fabricating a package structure is provided, including the steps of: disposing and electrically connecting a sensing chip to a substrate; forming an encapsulant on the substrate to encapsulate the sensing chip; and forming a bright layer on the encapsulant to increase the gloss of the package structure. The encapsulant includes an additive to increase the Mohs hardness of the encapsulant. Further, the encapsulant with different additives presents different colors. Therefore, the invention obtains a high-gloss, high-hardness and colorful sensor package structure.

Abstract: A method for fabricating a package structure is provided, including the steps of: disposing and electrically connecting a sensing chip to a substrate; forming an encapsulant on the substrate to encapsulate the sensing chip; and forming a bright layer on the encapsulant to increase the gloss of the package structure. The encapsulant includes an additive to increase the Mohs hardness of the encapsulant. Further, the encapsulant with different additives presents different colors. Therefore, the invention obtains a high-gloss, high-hardness and colorful sensor package structure.