Abstract: Ophthalmic irrigating solutions are disclosed. The ophthalmic irrigating solution comprises: a) ?-polyglutamic acid (?-PGA) and/or salt thereof in an amount effective to increase the viscosity of the irrigating solution, and b) an ophthalmically acceptable aqueous vehicle for the ?-PGA and/or salt thereof. Also disclosed is a method of irrigating ocular tissues of a patient, in which the method comprises introducing to the ocular tissues of the patient an ophthalmic irrigating solution comprising ?-PGA) and/or salt thereof in an amount sufficient to irrigate the ocular tissues of the patient.

Abstract: An apparatus comprises an ionization chamber for providing ions during a process of ion implantation, and an electron beam source device inside the ionization chamber. The electron beam source device comprises a field emission array having a plurality of emitters for generating electrons in vacuum under an electric field.

Abstract: A semiconductor photodetector structure is provided. The structure includes a substrate, a photodetecting element and a semiconductor layer disposed on the photodetecting element. The substrate includes a first semiconductor material and includes a deep trench. The surface of the deep trench includes a first type dopant. The photodetecting element is disposed in the deep trench. The photodetecting element includes a second semiconductor material. The semiconductor layer includes a second type dopant.

Abstract: An apparatus comprises a plasma flood gun for neutralizing a positive charge buildup on a semiconductor wafer during a process of ion implantation using an ion beam. The plasma flood gun comprises more than two arc chambers, wherein each arc chamber is configured to generate and release electrons into the ion beam in a respective zone adjacent to the semiconductor wafer.

Abstract: An integrated circuit for accessing a universal serial bus (USB) device via a USB 3.0 receptacle is provided. The integrated circuit includes a plurality of pins and a controlling unit. The pins include a first group for coupling to a first pair of differential pins of the USB receptacle, a second group for coupling to a second pair of differential pins of the USB receptacle, a third group for coupling to a third pair of differential pins to the USB receptacle, a ground pin, a first and second power pins. The second group is disposed between the first and third groups. The controlling unit controls the plurality of pins to receive or transmit the USB 2.0 or USB 3.0 signals.

Abstract: A back light module is provided, which includes a light guide plate, a first light source device and a second light source device. The light guide plate has a first side surface, a second side surface and a third side surface, wherein the first side surface is opposite to the third side surface, and the second side surface is orthogonal to the first and third side surfaces. The first lighting device is disposed at two sides of an intersection corner of the first and second side surfaces and faces the first and second side surfaces. The second light source device is disposed at two sides of an intersection corner of the second and third side surfaces and faces the second and third side surfaces.

Abstract: The present invention relates to a protective film for electronic device. The protective film comprises a protective-film body and a first microstructure layer. The protective-film body has a first surface and a second surface. The first microstructure layer is disposed on the first surface of the protective-film body. The second surface of the protective-film body covers the surface of an electronic device. The hardness of the protective film is between 1 H and 12 H. Thanks to it high surface hardness, the protective film according to the present invention has superior wear and scrape resistance. Thereby, the life time of the protective film is extended and hence ensuring protection of the surface of the electronic device.

Abstract: A method for fabricating flip-chip semiconductor optoelectronic devices initially flip-chip bonds a semiconductor optoelectronic chip attached to an epitaxial substrate to a packaging substrate. The epitaxial substrate is then separated using lift-off technology.

Abstract: Disclosed is a light-emitting diode with a semiconductor layer including dielectric material layer, and a manufacturing method thereof for increasing the external quantum efficiency. The semiconductor layer includes a non-flat structure having a plurality of recess regions, and at least one dielectric material layer disposed within each recess region, the dielectric material layer has a generally inverted pyramid shape or a ball shape, and a portion of the non-flat structure is exposed outside the dielectric material layer. Photons emitted from the active layer are scattered by the dielectric material layer as photon scattering structure, and are guided by the inclined internal side faces of the recess regions so that the probability of photons escaping from the light-emitting diode is increased, and thus total internal reflection is reduced, thereby increasing the extraction efficiency and hence the external quantum efficiency.

Abstract: Disclosed is a light-emitting diode with a semiconductor layer including stacked-type scattering layer, and a manufacturing method thereof. The semiconductor layer includes a non-flat structure and at least two scattering layers disposed therein. The scattering layers are stacked on the non-flat structure. The top surface of each layer of the scattering layers is non-flat having an undulating fashion, and refractive indices of two adjacent layers of the scattering layers are different from each other.

Abstract: An orthodontic fixture system includes a tap, a screw, a tool, and fixation wire. In a method of orthodontic fixation, a user manipulates the tool to drive the tap and screw. The tap is configured to first make a threaded hole in only a proximal wall of an alveolus bone. The screw is configured for firm insertion in the proximal wall of the alveolus bone through the hole made with the tap and to abut an inner surface of the distal wall of the alveolus bone in a non-damaging manner. The screw and fixation wire include cooperating structures to enable a user to readily apply both tension and torsional forces via mutual engagement of the screw and fixation wire and thus to one or more orthodontic elements attachable to patient teeth.

Abstract: A screen protector is revealed. The screen protector includes a first microstructure layer, a transparent protective layer, a second microstructure layer, a plurality of ink layer, and a silicone layer. The transparent protective layer is disposed over the first microstructure layer and the second microstructure layer is arranged over the transparent protective layer. The ink layers are stacked in a frame form and disposed over the second microstructure layer. The silicone layer is also a frame arranged over the ink layers. The screen protector provides high anti-glare and anti-reflective effect by the arrangement of the first microstructure layer and the second microstructure layer. Moreover, the screen protector is applied conveniently due to disposition of the ink layers and the silicone layer.

Abstract: A lateral thermal dissipation LED and a fabrication method thereof are provided. The lateral thermal dissipation LED utilizes a patterned metal layer and a lateral heat spreading layer to transfer heat out of the LED. The thermal dissipation efficiency of the LED is increased, and the lighting emitting efficiency is accordingly improved.

Abstract: Systems and methods for improving seal performance in a centrifugal water pump for an internal combustion engine increase static pressure at the seal by incorporating a combination of slots and ribs into a seal cavity of the pump housing that are positioned to convert dynamic fluid pressure into static pressure at the seal while reducing coolant velocity at the seal. Vent holes in the impeller having an appropriate size and location may also be used to increase the static pressure at the seal to enhance seal performance.

Abstract: A clock generator is provided. The clock generator includes a crystal oscillator, an inverter coupled to the crystal oscillator in parallel, a first circuit and a second circuit. The crystal oscillator has a first terminal and a second terminal. The inverter generates a first signal and a second signal at the first and second terminals of the crystal oscillator, respectively. The first circuit coupled to the first terminal of the crystal oscillator generates a first clock signal with a constant frequency according to the first signal. The second circuit coupled to the second terminal of the crystal oscillator generates a second clock signal with a variable frequency according to the second signal.

Abstract: A method for fabricating flip-chip semiconductor optoelectronic devices initially flip-chip bonds a semiconductor optoelectronic chip attached to an epitaxial substrate to a packaging substrate. The epitaxial substrate is then separated using lift-off technology.

Abstract: A surface enhanced Raman spectroscopy (SERS) analytical device includes a substrate having a porous structure, and a plurality of plasmonic nanoparticles embedding in the porous structure and forming a sensing region. A method of detecting a target analyte in a sample includes contacting the sample with the substrate, whereby the target analyte, if present in the sample, is concentrated in the sensing matrix. The substrate may then be analyzed using SERS detection equipment.

Abstract: A pharmaceutical composition for inhibiting inflammation is provided. The pharmaceutical composition comprises (a) hyaluronic acid, (b) a vitamin and (c) a pharmaceutically acceptable carrier.

Abstract: A multilayer polyimide-containing film comprises a coloring layer containing a pigment, and a first protection layer disposed on one surface of the coloring layer, the first protection layer having a thickness between about 0.5 and about 3 micrometers. In some embodiments, methods of manufacturing the multilayer polyimide-containing film are also described.

Abstract: An overhead wafer transport system includes an over head transportation (OHT) rail and at least one shuttle. The OHT rail includes a main track and two lateral tracks, each having a hollow transverse cross-section, each lateral track being in corresponding connection with the main track through the two sides thereof, constituting an approximate tri-directional branch form. The shuttle has a track-interface assembly and a docking unit, the track-interface assembly being adapted to travel along the OHT rail. The track-interface assembly being arranged at the junction of the two lateral tracks and the main track, wherein the track-interface assembly is adapted to selectively travel along at least one of the main track and the lateral tracks. Therefore, the overhead wafer transport system can be applied to a clean room with higher transfer efficiency and clean room space utilization.