Patents by Inventor Wen-Yuan Chi

Wen-Yuan Chi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9671951
    Abstract: A method for zooming screen, an electronic apparatus and a computer readable medium using the same are provided. The method is adapted to an electronic apparatus having a touch screen. Firstly, a zooming gesture is detected by utilizing the touch screen. Next, a screen object acted by the zooming gesture on the touch screen is searched. Afterwards, a specific part of the screen object and a screen edge of the touch screen are used as a reference to zoom all of objects displayed in a screen of the touch screen, such that a height of the specific part of the screen object is constantly maintained during zooming the screen.
    Type: Grant
    Filed: October 9, 2013
    Date of Patent: June 6, 2017
    Assignee: HTC Corporation
    Inventors: Wen-Yuan Chi, Chuan-Feng Yeh, Sheng-Hsin Huang
  • Publication number: 20140115544
    Abstract: A method for zooming screen, an electronic apparatus and a computer readable medium using the same are provided. The method is adapted to an electronic apparatus having a touch screen. Firstly, a zooming gesture is detected by utilizing the touch screen. Next, a screen object acted by the zooming gesture on the touch screen is searched. Afterwards, a specific part of the screen object and a screen edge of the touch screen are used as a reference to zoom all of objects displayed in a screen of the touch screen, such that a height of the specific part of the screen object is constantly maintained during zooming the screen.
    Type: Application
    Filed: October 9, 2013
    Publication date: April 24, 2014
    Applicant: HTC Corporation
    Inventors: Wen-Yuan Chi, Chuan-Feng Yeh, Sheng-Hsin Huang
  • Patent number: 8188377
    Abstract: A circuit board having an electrically connecting structure and a method for fabricating the same are provided. A circuit board body having inner-layer circuits is provided. A circuit layer is formed on at least an outermost surface of circuit board body, and including electrically connecting pads and circuits. The electrically connecting pads are partially electrically connected to the circuits, and are partially electrically connected to the inner-layer circuits via conductive vias. An insulating protective layer is disposed on the circuit board body and is formed with openings therein for exposing the electrically connecting pads. Conductive posts are formed on the electrically connecting pads. Standalone metal pads are formed on the insulating protective layer but are not used for electrical connection.
    Type: Grant
    Filed: August 21, 2008
    Date of Patent: May 29, 2012
    Assignee: Unimicron Technology Corp.
    Inventors: Wen-Hung Hu, Wen-Yuan Chi
  • Publication number: 20090050359
    Abstract: A circuit board having an electrically connecting structure and a method for fabricating the same are provided. A circuit board body having inner-layer circuits is provided. A circuit layer is formed on at least an outermost surface of circuit board body, and including electrically connecting pads and circuits. The electrically connecting pads are partially electrically connected to the circuits, and are partially electrically connected to the inner-layer circuits via conductive vias. An insulating protective layer is disposed on the circuit board body and is formed with openings therein for exposing the electrically connecting pads. Conductive posts are formed on the electrically connecting pads. Standalone metal pads are formed on the insulating protective layer but are not used for electrical connection.
    Type: Application
    Filed: August 21, 2008
    Publication date: February 26, 2009
    Applicant: Phoenix Precision Technology Corporation
    Inventors: Wen-Hung Hu, Wen-Yuan Chi