Abstract: An anti-twist structure of a voice coil motor includes a base, a lens housing, a first elastic sheet, a second elastic sheet, a magnet, and a yoke member. The lens housing has first margin wall and a second margin wall, and a first protrusion extends from the first margin wall. The height of the second protrusion is lower than the height of the first protrusion. The yoke member has a first wall, a connection wall, a second wall, and a side wall. The first wall is disposed above the first protrusion, and the second wall is disposed above the second protrusion. The lens housing has a deflectable angle relative to a horizontal reference line. When the lens housing deflects to a maximum value of the deflectable angle, the first margin wall abuts against the second wall and/or the first protrusion abuts against the first wall.

Abstract: An anti-twist structure of a voice coil motor includes a base, a lens housing, a first elastic sheet, a second elastic sheet, a magnet, and a yoke member. The lens housing has first margin wall and a second margin wall, and a first protrusion extends from the first margin wall. The height of the second protrusion is lower than the height of the first protrusion. The yoke member has a first wall, a connection wall, and a second wall. The first wall is disposed above the first protrusion, and the second wall is disposed above the second protrusion. The lens housing has a deflectable angle relative to a horizontal reference line. When the lens housing deflects to a maximum value of the deflectable angle, the first margin wall abuts against the second wall and/or the first protrusion abuts against the first wall.

Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, an insulating layer, and a diaphragm. The substrate has an opening portion. The backplate is disposed on a side of the substrate, with protrusions protruding toward the substrate. The diaphragm is movably disposed between the substrate and the backplate and spaced apart from the backplate by a spacing distance. The protrusions are configured to limit the deformation of the diaphragm when air flows through the opening portion.

Abstract: A biocompatible magnetic material containing an iron oxide nanoparticle and one or more biocompatible polymers, each having formula (I) below, covalently bonded to the iron oxide nanoparticle: in which each of variables R, L, x, and y is defined herein, the biocompatible magnetic material contains 4-15% Fe(II) ions relative to the total iron ions. Also disclosed in a method of preparing the biocompatible magnetic material.

Abstract: A glass composition includes, based on 100 wt % of the glass composition, silicon dioxide present in an amount ranging from 45 wt % to 61 wt %, aluminum oxide present in an amount (A) ranging from 15 wt % to 22 wt %, calcium oxide present in an amount (C) ranging from 0.1 wt % to 6 wt %, magnesium oxide present in an amount (M) of greater than 0 wt % and lower than 2 wt %, zinc oxide present in an amount of greater than 0 wt % and lower than 8 wt %, copper oxide present in an amount of greater than 0 wt % and lower than 7 wt %, and boron oxide present in an amount of greater than 6 wt % and lower than 18 wt %. A glass fiber including the glass composition, and an electronic product including the glass fiber are also provided.

Abstract: The anti-twist structure includes a base, a lens housing, an elastic sheet and a yoke member. The lens housing has a margin wall with a first protrusion, a second protrusion and a contact portion. The contact portion is extended outwardly the first protrusion, and the second protrusion is protruded from the contact portion. The first protrusion and the second protrusion are protruded along an axial direction substantially perpendicular to the margin wall. The elastic sheet is disposed on the contact portion. When the lens housing deflects from the horizontal reference line to a maximum value of the deflectable angle, the first protrusion abuts against an upper wall of the yoke member, the second protrusion abuts against the elastic sheet, and the contact portion abuts against the elastic sheet or the upper wall at the same time, whereby the lens housing and the yoke member interfere with each other.

Abstract: The anti-twist structure includes a base, a lens housing, an elastic sheet and a yoke member. The lens housing has a margin wall with a first protrusion, a second protrusion and a contact portion. The contact portion is extended outwardly the first protrusion, and the second protrusion is protruded from the contact portion. The first protrusion and the second protrusion are protruded along an axial direction substantially perpendicular to the margin wall. The elastic sheet is disposed on the contact portion. When the lens housing deflects from the horizontal reference line to a maximum value of the deflectable angle, the first protrusion abuts against an upper wall of the yoke member, the second protrusion abuts against the elastic sheet, and the contact portion abuts against the elastic sheet or the upper wall at the same time, whereby the lens housing and the yoke member interfere with each other.

Abstract: A camera structure, including a lens holder, a lens frame and a plurality of balls. The lens holder has a holder body, one end of which has a first rolling groove. The first groove wall part and the second groove wall part are disposed on two sides of the first rolling groove, and the groove bottom is disposed between the first groove wall part and the second groove wall part. The lens frame is mounted on an outer side of the holder body. The plurality of balls are located inside the first rolling groove, wherein the first groove wall part and the second groove wall part support the plurality of balls, there is a gap between each of the plurality of balls and the groove bottom, and the plurality of balls lay between the lens holder and the lens frame.

Abstract: An electrical connector assembly includes an electrical connector having a card slot and plural terminals extending into the card slot; and a heat dissipation module having a fixing plate at one end thereof, the fixing plate having a notch; wherein the electrical connector has a supporting surface for supporting the fixing plate and a fixing member for mating with the notch, the fixing member includes a spherical or hemispherical head portion for guiding the fixing plate at multiple angles.

Abstract: An anti-twist structure of a voice coil motor includes a base, a lens housing, a first elastic sheet, a second elastic sheet, a magnet, and a yoke member. The lens housing has first margin wall and a second margin wall, and a first protrusion extends from the first margin wall. The yoke member has a first wall, a connection wall, a second wall, and a side wall. The first wall is disposed above the first protrusion, and the second wall is above the first margin wall. The lens housing has a deflectable angle relative to a horizontal reference line. When the lens housing deflects to a maximum value of the deflectable angle, the first margin wall abuts against the second wall and/or the first protrusion abuts against the first wall.

Abstract: A MEMS structure is provided. The MEMS structure includes a substrate and a backplate, the substrate has an opening portion, and the backplate is disposed on one side of the substrate and has acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate, and the diaphragm extends across the opening portion of the substrate and includes outer ventilation holes and inner ventilation holes arranged in a concentric manner. The outer ventilation holes and the inner ventilation holes are relatively arranged in a ring shape and surround the center of the diaphragm. The MEMS structure further includes a pillar disposed between the backplate and the diaphragm. The pillar prevents the diaphragm from being electrically connected to the backplate.

Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate. The opening portion of the substrate is under the diaphragm, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a pillar structure connected with the backplate and the diaphragm and a protection post structure extending from the backplate into the air gap. From a top view of the backplate, the protection post structure surrounds the pillar structure.

Abstract: The present invention provides a probing system, which utilizes a suction nozzle to suck a wafer in probing. A relative distance between the suction nozzle and the probes can be adjusted according the conditions of the probing system, so the system extends the usage life.

Abstract: A testing substrate includes a substrate and a first build-up structure. The substrate has a first surface and a second surface opposite to each other. The substrate includes a first conductive pattern. The first conductive pattern includes a plurality of conductive connectors, and each conductive connector penetrates the substrate from the first surface to the second surface of the substrate. The first build-up structure is arranged on the first surface. The first build-up structure has a second conductive pattern. The first conductive pattern is electrically connected to the second conductive pattern, and the size of the first conductive pattern is larger than or equal to the size of the second conductive pattern. A manufacturing method of the testing substrate and a probe card are also provided.

Abstract: The present invention provides a probe card. A module cap, on the probe card substrate, is designed to have a chute and the probe module can be installed on or uninstalled from the module cap via the chute. That simplifies the operations of assembling and disassembling the probe card and avoids positioning error.

Abstract: An injection device is disclosed herein. The injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a base, a reservoir, a first testing pipe, a cleaning pipe and a liquid-draining pipe. The reservoir set on the base is provided with at least one connecting port and a dropping port, wherein the dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to at least one connecting port, wherein a first liquid is injected from the first testing pipe into the reservoir, and wherein the a cleaning liquid is injected from the cleaning pipe into the reservoir to clean the reservoir and the test area. The dropping port is utilized to drain off the first testing liquid and the cleaning liquid in the reservoir. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.

Abstract: An injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a height-adjusting base, a reservoir, a first testing pipe, a cleaning pipe, a liquid-draining pipe, and an electrode rod. The reservoir is provided with a dropping port. The dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to the reservoir. The electrode rod penetrates through the reservoir and contacts and ionizes a testing liquid. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.

Abstract: An injection device is disclosed herein. The injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a base, a reservoir, a first testing pipe, a cleaning pipe and a liquid-draining pipe. The reservoir set on the base is provided with at least one connecting port and a dropping port, wherein the dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to at least one connecting port, wherein a first liquid is injected from the first testing pipe into the reservoir, and wherein the a cleaning liquid is injected from the cleaning pipe into the reservoir to clean the reservoir and the test area. The dropping port is utilized to drain off the first testing liquid and the cleaning liquid in the reservoir. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.

Abstract: An injection device is disclosed herein. The injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a base, a reservoir, a first testing pipe, a cleaning pipe and a liquid-draining pipe. The reservoir set on the base is provided with at least one connecting port and a dropping port, wherein the dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to at least one connecting port, wherein a first liquid is injected from the first testing pipe into the reservoir, and wherein the a cleaning liquid is injected from the cleaning pipe into the reservoir to clean the reservoir and the test area. The dropping port is utilized to drain off the first testing liquid and the cleaning liquid in the reservoir. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.

Abstract: The present invention provides an automated system for exchanging polish plate, comprising a loading chamber to store polish plates ready for use, and the automated system has a mechanical arm to pick up and place polish plates between a test chamber and the loading chamber. The present invention realizes automated exchange of polish plates.