Abstract: The present invention provides a probing system, which utilizes a suction nozzle to suck a wafer in probing. A relative distance between the suction nozzle and the probes can be adjusted according the conditions of the probing system, so the system extends the usage life.

Abstract: A testing substrate includes a substrate and a first build-up structure. The substrate has a first surface and a second surface opposite to each other. The substrate includes a first conductive pattern. The first conductive pattern includes a plurality of conductive connectors, and each conductive connector penetrates the substrate from the first surface to the second surface of the substrate. The first build-up structure is arranged on the first surface. The first build-up structure has a second conductive pattern. The first conductive pattern is electrically connected to the second conductive pattern, and the size of the first conductive pattern is larger than or equal to the size of the second conductive pattern. A manufacturing method of the testing substrate and a probe card are also provided.

Abstract: The present invention provides a probe card. A module cap, on the probe card substrate, is designed to have a chute and the probe module can be installed on or uninstalled from the module cap via the chute. That simplifies the operations of assembling and disassembling the probe card and avoids positioning error.

Abstract: An injection device is disclosed herein. The injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a base, a reservoir, a first testing pipe, a cleaning pipe and a liquid-draining pipe. The reservoir set on the base is provided with at least one connecting port and a dropping port, wherein the dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to at least one connecting port, wherein a first liquid is injected from the first testing pipe into the reservoir, and wherein the a cleaning liquid is injected from the cleaning pipe into the reservoir to clean the reservoir and the test area. The dropping port is utilized to drain off the first testing liquid and the cleaning liquid in the reservoir. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.

Abstract: An injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a height-adjusting base, a reservoir, a first testing pipe, a cleaning pipe, a liquid-draining pipe, and an electrode rod. The reservoir is provided with a dropping port. The dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to the reservoir. The electrode rod penetrates through the reservoir and contacts and ionizes a testing liquid. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.

Abstract: An injection device is disclosed herein. The injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a base, a reservoir, a first testing pipe, a cleaning pipe and a liquid-draining pipe. The reservoir set on the base is provided with at least one connecting port and a dropping port, wherein the dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to at least one connecting port, wherein a first liquid is injected from the first testing pipe into the reservoir, and wherein the a cleaning liquid is injected from the cleaning pipe into the reservoir to clean the reservoir and the test area. The dropping port is utilized to drain off the first testing liquid and the cleaning liquid in the reservoir. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.

Abstract: An injection device is disclosed herein. The injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a base, a reservoir, a first testing pipe, a cleaning pipe and a liquid-draining pipe. The reservoir set on the base is provided with at least one connecting port and a dropping port, wherein the dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to at least one connecting port, wherein a first liquid is injected from the first testing pipe into the reservoir, and wherein the a cleaning liquid is injected from the cleaning pipe into the reservoir to clean the reservoir and the test area. The dropping port is utilized to drain off the first testing liquid and the cleaning liquid in the reservoir. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.

Abstract: The present invention provides an automated system for exchanging polish plate, comprising a loading chamber to store polish plates ready for use, and the automated system has a mechanical arm to pick up and place polish plates between a test chamber and the loading chamber. The present invention realizes automated exchange of polish plates.

Abstract: The present invention provides a probing system, which utilizes a suction nozzle to suck a wafer in probing. A relative distance between the suction nozzle and the probes can be adjusted according the conditions of the probing system, so the system extends the usage life.

Abstract: A probe card for detecting a wafer. The probe card includes a light-output element, which is connected to a positioning element. The light-output element is set within a through hole of an electrical detection substrate. The light-output element is connected to a light source controller by an optical fiber, thereby an output light can be transmitted from the light source controller to the light-output element. The positioning element can move the light-output element in three-dimensional space or adjust an emitting angle from an axis of the light-output element. Therefore, an optical measurement and an electrical measurement can be implemented at the same time in the silicon photonic wafer test.

Abstract: An injection device is disclosed herein. The injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a base, a reservoir, a first testing pipe, a cleaning pipe and a liquid-draining pipe. The reservoir set on the base is provided with at least one connecting port and a dropping port, wherein the dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to at least one connecting port, wherein a first liquid is injected from the first testing pipe into the reservoir, and wherein the a cleaning liquid is injected from the cleaning pipe into the reservoir to clean the reservoir and the test area. The dropping port is utilized to drain off the first testing liquid and the cleaning liquid in the reservoir. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.

Abstract: An active wafer prober preheat-precool system comprises a wafer loading unit used to load at least one wafer; a probe card disposed corresponding to the wafer loading unit and used to test the wafer; a carrying mechanism including a central connector corresponding to the wafer loading unit and having a first opening, wherein the probe card is connected with the central connector and faces the wafer loading unit through the first opening; a peripheral connector having a second opening, wherein the central connector is detachably disposed inside the second opening; and a first temperature regulation unit disposed in the peripheral connector; and a control unit electrically connected with the first temperature regulation unit and controlling the first temperature regulation unit to adjust the temperature of the peripheral connector. The present invention also discloses a method for testing wafers.

Abstract: A semiconductor test apparatus includes a test chamber, a chuck and a refrigeration element. The chuck is arranged in the test chamber to fix a semiconductor element to be tested. The refrigeration element is connected to the test chamber to reduce a chamber ambient temperature of the test chamber from a first temperature to a second temperature. The foregoing semiconductor test apparatus is able to reduce the chamber ambient temperature of the test chamber to be equal to or lower than the specified test temperature.

Abstract: A semiconductor test apparatus includes a test chamber, a chuck and a refrigeration element. The chuck is arranged in the test chamber to fix a semiconductor element to be tested. The refrigeration element is connected to the test chamber to reduce a chamber ambient temperature of the test chamber from a first temperature to a second temperature. The foregoing semiconductor test apparatus is able to reduce the chamber ambient temperature of the test chamber to be equal to or lower than the specified test temperature.

Abstract: An active wafer prober preheat-precool system comprises a wafer loading unit used to load at least one wafer; a probe card disposed corresponding to the wafer loading unit and used to test the wafer; a carrying mechanism including a central connector corresponding to the wafer loading unit and having a first opening, wherein the probe card is connected with the central connector and faces the wafer loading unit through the first opening; a peripheral connector having a second opening, wherein the central connector is detachably disposed inside the second opening; and a first temperature regulation unit disposed in the peripheral connector; and a control unit electrically connected with the first temperature regulation unit and controlling the first temperature regulation unit to adjust the temperature of the peripheral connector. The present invention also discloses a method for testing wafers.

Abstract: The present invention is related to a workpiece processing apparatus and method for processing a warping workpiece. The workpiece processing apparatus comprises a base, a carrier and an adjusting device. The carrier comprises a loading surface and a plurality of suction units, wherein each of the plurality of suction units is disposed inside the carrier. The adjusting device comprises an adjusting surface, and at least one adjusting portion is protruded from the adjusting surface. A first surface of the workpiece partially contacts to the loading surface of the carrier. At least one of the adjusting device and the carrier is movably connected to the base. By generating a relative movement between the adjusting device and the carrier, the first surface contacts the loading surface in a more even condition so as to make the workpiece become an adjusted workpiece.

Abstract: The present invention provides a probe card structure, an assembling method thereof and a replacing method thereof. The probe card structure comprises a circuit board and a probe head assembly. The circuit board includes a first side and a second side opposite the first side. The circuit board also has at least one first connecting part and a containing hole penetrating the first side and the second side of the circuit board. The probe assembly, which is partially disposed in the containing hole, further comprises a fixing part and a probe head. The fixing part includes at least one second connecting part corresponding to the at least one first connecting part. The fixing part is detachably connected with the circuit board through the connection of the second connecting part and the first connecting part. The probe head is integrally formed with or detachably connected with the fixing part.

Abstract: An air cleaner for engines includes a fender provided on the side of the air inlet and the air passage, and a hollow tube adapted to the air inlet to prevent weeds, dust, and pebbles from entering into the air cleaner for enabling clean air to be delivered to the engine continuously and protecting the carburetor from being contaminated by foreign matter.

Abstract: An air cleaner for engines includes a fender provided on the side of the air inlet and the air passage, and a hollow tube adapted to the air inlet to prevent weeds, dust, and pebbles from entering into the air cleaner for enabling clean air to be delivered to the engine continuously and protecting the carburetor from being contaminated by foreign matter.