Patents by Inventor Wen Yuan Hsu
Wen Yuan Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240134250Abstract: The present disclosure provides a base assembly of voice coil motor and a voice coil motor. The base assembly includes a base body having a first elastic piece connecting area, a lower elastic piece disposed on the first elastic piece connecting area, and a first terminal disposed in the base body. The first terminal has: a first conductive part disposed in the base body; a first terminal connecting part disposed on one side of the first conductive part and extending toward a direction away from the first conductive part, wherein a part of the first terminal connecting part protrudes from the first elastic piece connecting area and is contacted and connected with the lower elastic piece; and an engaging part disposed on one side of the first terminal connecting part and extending toward a direction away from the first terminal connecting part.Type: ApplicationFiled: December 22, 2023Publication date: April 25, 2024Applicant: Lanto Electronic LimitedInventors: Wen-Yen HUANG, Fu-Yuan WU, Shang-Yu HSU, Meng-Ting LIN, BingBing MA, Jie DU
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Publication number: 20240111116Abstract: An anti-twist structure of voice coil motor includes a base, a lens housing, an elastic sheet, a magnet, and a yoke member. The lens housing has a margin wall, and the margin wall has a first protrusion and a contact portion. The elastic sheet has a hollowed slot, and the first protrusion pass through the hollowed slot, so that the elastic sheet is disposed on a portion of the margin wall and on the contact portion. The yoke member has an upper wall and a side wall. The side wall is disposed at one side of the upper wall and the side wall extends outward in a direction not parallel to the upper wall. The yoke member surrounds the lens housing, the elastic sheet, and the magnet. The lens housing has a deflectable angle relative to a horizontal reference line.Type: ApplicationFiled: December 7, 2023Publication date: April 4, 2024Applicant: Lanto Electronic LimitedInventors: Wen-Yen Huang, Meng-Ting Lin, Fu-Yuan Wu, Shang-Yu Hsu, Bing-Bing Ma, Jie Du
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Publication number: 20240103244Abstract: An anti-twist structure of voice coil motor includes a base, a lens housing, an elastic sheet, a magnet, and a yoke member. The lens housing has a margin wall, and the margin wall has a first protrusion and a contact portion. The elastic sheet has a hollowed slot, and the first protrusion pass through the hollowed slot, so that the elastic sheet is disposed on a portion of the margin wall and on the contact portion. The yoke member has an upper wall and a side wall. The side wall is disposed at one side of the upper wall and the side wall extends outward in a direction not parallel to the upper wall. The yoke member surrounds the lens housing, the elastic sheet, and the magnet. The lens housing has a deflectable angle relative to a horizontal reference line.Type: ApplicationFiled: December 7, 2023Publication date: March 28, 2024Applicant: Lanto Electronic LimitedInventors: Wen-Yen Huang, Meng-Ting Lin, Fu-Yuan Wu, Shang-Yu Hsu, Bing-Bing Ma, Jie Du
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Patent number: 11943584Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a diaphragm, a backplate and a first protrusion. The substrate has an opening portion. The diaphragm is disposed on one side of the substrate and extends across the opening portion of the substrate. The backplate includes a plurality of acoustic holes. The backplate is disposed on one side of the diaphragm. An air gap is formed between the backplate and the diaphragm. The first protrusion extends from the backplate towards the air gap.Type: GrantFiled: April 7, 2022Date of Patent: March 26, 2024Assignee: FORTEMEDIA, INC.Inventors: Chih-Yuan Chen, Jien-Ming Chen, Feng-Chia Hsu, Wen-Shan Lin, Nai-Hao Kuo
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Publication number: 20240084064Abstract: A foamable resin composition comprising: (meth)acrylate oligomer, which accounts for 10-40 wt % of the foamable resin composition; (meth)acrylate monomer, which accounts for 35-80 wt % of the foamable resin composition; a photocuring initiator, which accounts for 1-5 wt % of the foamable resin composition; and a foaming agent, which accounts for 3-20 wt % of the foamable resin composition; wherein the foamable resin composition has a specific gravity of 0.10-1.05 g/cm3 after photocuring and thermal foam expansion for 15-20 minutes at 120° C. The aforementioned foamable resin composition can become a low specific gravity (0.10-1.05 g/cm3) material after photocuring and thermal foam expansion, then can expand the application in 3D printing, and manufacture of plastic products, such as shoe soles, coasters, floats, various types of protective gear and the like.Type: ApplicationFiled: September 14, 2022Publication date: March 14, 2024Inventors: WEN-CHANG SHEN, KUEI-YUAN CHANG, MEI-CHUAN HSU
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Patent number: 11703524Abstract: The present invention provides a probing system, which utilizes a suction nozzle to suck a wafer in probing. A relative distance between the suction nozzle and the probes can be adjusted according the conditions of the probing system, so the system extends the usage life.Type: GrantFiled: November 1, 2021Date of Patent: July 18, 2023Assignee: HERMES TESTING SOLUTIONS INC.Inventors: Wen-Yuan Hsu, Chi-Ming Yang, Sih-Ying Chang, Tsung-Po Lee, Kee-Leong Yu
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Publication number: 20230213555Abstract: A testing substrate includes a substrate and a first build-up structure. The substrate has a first surface and a second surface opposite to each other. The substrate includes a first conductive pattern. The first conductive pattern includes a plurality of conductive connectors, and each conductive connector penetrates the substrate from the first surface to the second surface of the substrate. The first build-up structure is arranged on the first surface. The first build-up structure has a second conductive pattern. The first conductive pattern is electrically connected to the second conductive pattern, and the size of the first conductive pattern is larger than or equal to the size of the second conductive pattern. A manufacturing method of the testing substrate and a probe card are also provided.Type: ApplicationFiled: March 6, 2022Publication date: July 6, 2023Applicant: HERMES TESTING SOLUTIONS INC.Inventors: Wen-Yuan Hsu, Chun-Hsiung Chou
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Publication number: 20230194571Abstract: The present invention provides a probe card. A module cap, on the probe card substrate, is designed to have a chute and the probe module can be installed on or uninstalled from the module cap via the chute. That simplifies the operations of assembling and disassembling the probe card and avoids positioning error.Type: ApplicationFiled: December 19, 2022Publication date: June 22, 2023Inventors: TZU-CHIEN WANG, WEN-YUAN HSU, MING-HSIEN CHEN, JIA-LIN LU
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Patent number: 11656275Abstract: An injection device is disclosed herein. The injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a base, a reservoir, a first testing pipe, a cleaning pipe and a liquid-draining pipe. The reservoir set on the base is provided with at least one connecting port and a dropping port, wherein the dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to at least one connecting port, wherein a first liquid is injected from the first testing pipe into the reservoir, and wherein the a cleaning liquid is injected from the cleaning pipe into the reservoir to clean the reservoir and the test area. The dropping port is utilized to drain off the first testing liquid and the cleaning liquid in the reservoir. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.Type: GrantFiled: July 13, 2022Date of Patent: May 23, 2023Assignee: HERMES TESTING SOLUTIONS INC.Inventors: Bo-Lung Chen, Wen-Yuan Hsu
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Publication number: 20230045244Abstract: An injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a height-adjusting base, a reservoir, a first testing pipe, a cleaning pipe, a liquid-draining pipe, and an electrode rod. The reservoir is provided with a dropping port. The dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to the reservoir. The electrode rod penetrates through the reservoir and contacts and ionizes a testing liquid. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.Type: ApplicationFiled: October 17, 2022Publication date: February 9, 2023Inventors: Bo-Lung CHEN, WEN-YUAN HSU
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Patent number: 11567125Abstract: An injection device is disclosed herein. The injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a base, a reservoir, a first testing pipe, a cleaning pipe and a liquid-draining pipe. The reservoir set on the base is provided with at least one connecting port and a dropping port, wherein the dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to at least one connecting port, wherein a first liquid is injected from the first testing pipe into the reservoir, and wherein the a cleaning liquid is injected from the cleaning pipe into the reservoir to clean the reservoir and the test area. The dropping port is utilized to drain off the first testing liquid and the cleaning liquid in the reservoir. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.Type: GrantFiled: October 9, 2019Date of Patent: January 31, 2023Assignee: HERMES TESTING SOLUTIONS INC.Inventors: Bo-Lung Chen, Wen-Yuan Hsu
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Publication number: 20220349939Abstract: An injection device is disclosed herein. The injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a base, a reservoir, a first testing pipe, a cleaning pipe and a liquid-draining pipe. The reservoir set on the base is provided with at least one connecting port and a dropping port, wherein the dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to at least one connecting port, wherein a first liquid is injected from the first testing pipe into the reservoir, and wherein the a cleaning liquid is injected from the cleaning pipe into the reservoir to clean the reservoir and the test area. The dropping port is utilized to drain off the first testing liquid and the cleaning liquid in the reservoir. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.Type: ApplicationFiled: July 13, 2022Publication date: November 3, 2022Inventors: Bo-Lung CHEN, WEN-YUAN HSU
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Publication number: 20220297259Abstract: The present invention provides an automated system for exchanging polish plate, comprising a loading chamber to store polish plates ready for use, and the automated system has a mechanical arm to pick up and place polish plates between a test chamber and the loading chamber. The present invention realizes automated exchange of polish plates.Type: ApplicationFiled: October 21, 2021Publication date: September 22, 2022Inventors: Tzu-Chien WANG, Wen-Yuan HSU
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Publication number: 20220163563Abstract: The present invention provides a probing system, which utilizes a suction nozzle to suck a wafer in probing. A relative distance between the suction nozzle and the probes can be adjusted according the conditions of the probing system, so the system extends the usage life.Type: ApplicationFiled: November 1, 2021Publication date: May 26, 2022Inventors: Wen-Yuan HSU, Chi-Ming YANG, Sih-Ying CHANG, Tsung-Po LEE, Kee-Leong YU
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Publication number: 20210055340Abstract: A probe card for detecting a wafer. The probe card includes a light-output element, which is connected to a positioning element. The light-output element is set within a through hole of an electrical detection substrate. The light-output element is connected to a light source controller by an optical fiber, thereby an output light can be transmitted from the light source controller to the light-output element. The positioning element can move the light-output element in three-dimensional space or adjust an emitting angle from an axis of the light-output element. Therefore, an optical measurement and an electrical measurement can be implemented at the same time in the silicon photonic wafer test.Type: ApplicationFiled: August 20, 2019Publication date: February 25, 2021Inventors: WEN-YUAN HSU, SHIH-YING CHOU, SIH-YING CHANG
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Publication number: 20210003550Abstract: An injection device is disclosed herein. The injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a base, a reservoir, a first testing pipe, a cleaning pipe and a liquid-draining pipe. The reservoir set on the base is provided with at least one connecting port and a dropping port, wherein the dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to at least one connecting port, wherein a first liquid is injected from the first testing pipe into the reservoir, and wherein the a cleaning liquid is injected from the cleaning pipe into the reservoir to clean the reservoir and the test area. The dropping port is utilized to drain off the first testing liquid and the cleaning liquid in the reservoir. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.Type: ApplicationFiled: October 9, 2019Publication date: January 7, 2021Inventors: Bo-Lung Chen, WEN-YUAN HSU
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Patent number: 10830794Abstract: An active wafer prober preheat-precool system comprises a wafer loading unit used to load at least one wafer; a probe card disposed corresponding to the wafer loading unit and used to test the wafer; a carrying mechanism including a central connector corresponding to the wafer loading unit and having a first opening, wherein the probe card is connected with the central connector and faces the wafer loading unit through the first opening; a peripheral connector having a second opening, wherein the central connector is detachably disposed inside the second opening; and a first temperature regulation unit disposed in the peripheral connector; and a control unit electrically connected with the first temperature regulation unit and controlling the first temperature regulation unit to adjust the temperature of the peripheral connector. The present invention also discloses a method for testing wafers.Type: GrantFiled: May 4, 2018Date of Patent: November 10, 2020Assignee: HERMES-EPITEK CORP.Inventor: Wen-Yuan Hsu
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Patent number: 10788514Abstract: A semiconductor test apparatus includes a test chamber, a chuck and a refrigeration element. The chuck is arranged in the test chamber to fix a semiconductor element to be tested. The refrigeration element is connected to the test chamber to reduce a chamber ambient temperature of the test chamber from a first temperature to a second temperature. The foregoing semiconductor test apparatus is able to reduce the chamber ambient temperature of the test chamber to be equal to or lower than the specified test temperature.Type: GrantFiled: May 4, 2018Date of Patent: September 29, 2020Assignee: HERMES-EPITEK CORP.Inventors: Wen-Yuan Hsu, Shih-Ying Chou
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Publication number: 20180335450Abstract: A semiconductor test apparatus includes a test chamber, a chuck and a refrigeration element. The chuck is arranged in the test chamber to fix a semiconductor element to be tested. The refrigeration element is connected to the test chamber to reduce a chamber ambient temperature of the test chamber from a first temperature to a second temperature. The foregoing semiconductor test apparatus is able to reduce the chamber ambient temperature of the test chamber to be equal to or lower than the specified test temperature.Type: ApplicationFiled: May 4, 2018Publication date: November 22, 2018Inventors: WEN-YUAN HSU, SHIH-YING CHOU
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Publication number: 20180321279Abstract: An active wafer prober preheat-precool system comprises a wafer loading unit used to load at least one wafer; a probe card disposed corresponding to the wafer loading unit and used to test the wafer; a carrying mechanism including a central connector corresponding to the wafer loading unit and having a first opening, wherein the probe card is connected with the central connector and faces the wafer loading unit through the first opening; a peripheral connector having a second opening, wherein the central connector is detachably disposed inside the second opening; and a first temperature regulation unit disposed in the peripheral connector; and a control unit electrically connected with the first temperature regulation unit and controlling the first temperature regulation unit to adjust the temperature of the peripheral connector. The present invention also discloses a method for testing wafers.Type: ApplicationFiled: May 4, 2018Publication date: November 8, 2018Inventor: WEN-YUAN HSU