Patents by Inventor Wen-Yuan YI

Wen-Yuan YI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board heat dissipation system
    Patent number: 11240906
    Abstract: A circuit board heat dissipation system includes circuit board unit that includes a motherboard and a daughterboard, a base seat, and a fastening unit that includes a plurality of first and second fastening components. Each first fastening component extends through the daughterboard and is engaged with the base seat. Each second fastening component includes a long fastener that extends through the base seat and the daughterboard and that is engaged with the motherboard, and a flat washer and a resilient member that are sleeved on the long fastener. The resilient member is disposed between a head portion of the long fastener and the flat washer for biasing the base seat and the daughterboard against the motherboard.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: February 1, 2022
    Assignee: ADVANTECH CO., LTD.
    Inventors: Yu-Chin Liu, Wen-Yuan Yi
  • CIRCUIT BOARD HEAT DISSIPATION SYSTEM
    Publication number: 20210352799
    Abstract: A circuit board heat dissipation system includes circuit board unit that includes a motherboard and a daughterboard, a base seat, and a fastening unit that includes a plurality of first and second fastening components. Each first fastening component extends through the daughterboard and is engaged with the base seat. Each second fastening component includes a long fastener that extends through the base seat and the daughterboard and that is engaged with the motherboard, and a flat washer and a resilient member that are sleeved on the long fastener. The resilient member is disposed between a head portion of the long fastener and the flat washer for biasing the base seat and the daughterboard against the motherboard.
    Type: Application
    Filed: December 3, 2020
    Publication date: November 11, 2021
    Inventors: Yu-Chin LIU, Wen-Yuan YI