Patents by Inventor Wen-Yung Fu

Wen-Yung Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor structure and method for forming the same
    Publication number: 20080174011
    Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure comprises a substrate and an integrated circuit laid on the substrate. A barrier layer is formed to provide a flattened surface, so that the under bump metal can be formed thereon. In this way, discontinuities, which would otherwise affect the impedance distribution, are avoided in the conductive layer, and thus, provide a stable conduction.
    Type: Application
    Filed: October 10, 2007
    Publication date: July 24, 2008
    Inventor: Wen-Yung Fu