Patents by Inventor Wen-Yung WEI

Wen-Yung WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230275100
    Abstract: This disclosure provides a display panel including pixels and a metal layer below the pixels. The metal layer includes a body portion at the center of the display panel and a mesh portion at the edge of the display panel and adjacent to the body portion. The contour of the body portion defines a first region, where first pixels are disposed in the first region and electrically connected to the body portion. The contour of the mesh portion defines a second region, where second pixels are disposed in the second region and electrically connected to the mesh portion. The mesh portion and the body portion are electrically connected to each other, the density of metal distribution of the first region is higher than that of the second region, and the area of the second region is 20% to 40% of the area of the display panel.
    Type: Application
    Filed: February 22, 2023
    Publication date: August 31, 2023
    Inventors: I-Peng CHIEN, Tai-Tso LIN, Wen-Yung WEI, Chen-Yuan TU
  • Publication number: 20230275101
    Abstract: The present disclosure provides a display panel including a substrate, a pixel pad layer above the substrate, and a contact stack above the substrate and electrically connected the pixel pad layer. The contact stack includes a first metal layer, a second metal layer above the first metal layer, and a first interlayer insulation layer between the first metal layer and the second metal layer. The first interlayer insulation layer includes a first top portion covering an edge of a top surface of the first metal layer. The second metal layer is electrically connected to the top surface of the first metal layer exposed by the first interlayer insulation layer. A sidewall of the first interlayer insulation layer is recessed from a sidewall of the substrate by a first distance greater than zero.
    Type: Application
    Filed: November 8, 2022
    Publication date: August 31, 2023
    Inventors: I-Peng CHIEN, Tai-Tso LIN, Chen-Yuan TU, Wen-Yung WEI