Abstract: A transfer-bonding method for light emitting devices including following steps is provided. A plurality of light emitting devices is formed over a first substrate and is arranged in array, wherein each of the light emitting devices includes a device layer and a sacrificial pattern sandwiched between the device layer and the first substrate. A protective layer is formed over the first substrate to selectively cover parts of the light emitting devices, and other parts of the light emitting devices are uncovered by the protective layer. The device layers uncovered by the protective layer are bonded with a second substrate. The sacrificial patterns uncovered by the protective layer are removed, so that parts of the device layers uncovered by the protective layer are separated from the first substrate and are transfer-bonded to the second substrate.

Abstract: A light emitting device including a carrying element having two electric conductors connectable to a power source, a light emitting element disposed on the carrying element and electrically connected to the two electric conductors, and at least one correction element electrically connected to the light emitting element, wherein the light emitting element is adapted to provide a light source upon connection of the two electric conductors with the power source, and the at least one correction element allows the light emitting element to have functions of temperature compensation, voltage correction, or surge absorption.

Abstract: A light emitting device includes a plurality of micro diodes, which are electrically connected to constitute a bridge rectifier circuit. Each branch of the bridge rectifier circuit includes a single micro diode or a plurality of micro diodes. The light emitting device is electrically connected to an AC power source, which alternately drives the light emitting device in two current loops. Therefore, the micro diodes in two current loops of the bridge rectifier circuit emit light by turns.

Abstract: A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip. Alternatively, an AC LED system in single chip with four metal contacts is also disclosed.

Abstract: A light emitting unit array including a plurality of micro-light emitting diodes (?-LEDs) is provided. The micro-light emitting diodes are arranged in an array on a substrate, and each of the micro-light emitting diodes includes a reflection layer, a light emitting structure, and a light collimation structure. The light emitting structure is disposed on the reflection layer, and includes a first type doped semiconductor layer, an active layer, and a second type doped semiconductor layer that are stacked sequentially. At least a portion of the first type doped semiconductor layer, the active layer, and the second type doped semiconductor layer are sandwiched between the reflection layer and the light collimation structure.

Abstract: Lighting devices capable of being powered by both AC and DC power sources without requiring AC power source to the DC power source conversion are provided, in which a lighting module comprises a plurality of micro-diodes formed on a substrate and a conductive wire pattern connecting to the micro-diodes, wherein the conductive wire pattern has at least three voltage feed points. A selection unit is coupled to a power source and selects at least two of the voltage feed points, such that a portion of the micro-diodes and the power source form at least one loop thereby turning on the micro-diodes in the loop.

Abstract: A light emitting device includes a first power node and a second power node configured to receive single-phase voltage provided from an AC voltage source, a first light emitting unit including at least one light emitting diode (LED), wherein a first end of the first light emitting unit is coupled to the first power node, a second light emitting unit including at least one LED, wherein a first end of the second light emitting unit is coupled to the first power node, and a second end of the second light emitting unit couples to the second power node, and a first phase modulator coupled between a second end of the first light emitting unit and the second power node and configured to change the phase of the single-phase voltage provided to the first light emitting unit.

Abstract: A projection apparatus is provided. The projection apparatus includes a light-emitting unit array, an optical sensor, and a control unit. The light-emitting unit array is for emitting an image beam. The optical sensor is for detecting electromagnetic waves so as to generate a signal. The control unit is electrically coupled to the light-emitting unit array and the optical sensor for controlling emission of the light-emitting unit array according to the signal from the optical sensor.

Abstract: A method for forming a pixel of an LED light source is provided. The method includes: forming a first layer on a first substrate; forming a second layer and a first light-emitting active layer on the first layer; forming a first intermediate layer on the second layer; forming a third layer on a second substrate; forming a fourth layer and a second light-emitting active layer on the third layer; placing the third layer, the fourth layer, and the second light-emitting active layer on the first intermediate layer, wherein the first light-emitting active layer and the second light-emitting active layer emit different colors of light. A method for forming a plurality of light-emitting diode pixels arranged in a two-dimensional array is also provided.

Abstract: A light-emitting unit array includes a plurality of light-emitting units arranged and integrated monolithically in an array, and each of the light-emitting units includes a first doped type layer, a second doped type layer, a light-emission layer, and a photonic crystal structure. The light emission layer is disposed between the first doped type layer and the second doped type layer, wherein the second doped type layer has a surface facing away from the light emission layer. The photonic crystal structure is disposed on the surface of the second doped type layer.

Abstract: A method for forming a pixel of an LED light source is provided. The method includes following steps: forming a first layer on a substrate; forming a second layer and a first light-emitting active layer on the first layer; exposing a portion of an upper surface of the first layer; forming a third layer on the substrate; forming a fourth layer and a second light-emitting active layer on the third layer; exposing a portion of an upper surface of the third layer; and forming a first electrode on the exposed upper surface of the first layer, a second electrode on a portion of an upper surface of the second layer, a third electrode on the exposed upper surface of the third layer, and a fourth electrode a portion of an upper surface of the fourth layer. The first light-emitting active layer and the second light-emitting active layer emit different colors of light.

Abstract: A light emitting device includes a light emitting element having at least two electrodes disposed at the side of the light output surface thereof; and a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection, and a light reflecting portion is disposed in the recess adjacent to the light output surface such that the light emitted from the light emitting element can be reflected to walls of the recess to form a substantially collimated light beam so as to improve light efficiency.

Abstract: A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip. Alternatively, an AC LED system in single chip with four metal contacts is also disclosed.

Abstract: A charge apparatus including a natural energy conversion module, an energy converter, an energy transmitter, and an energy receiver is provided. The natural energy conversion module receives a natural energy and converts the natural energy into a first electric energy. The energy converter is electrically connected to the natural energy conversion module and converts the first electric energy into a wireless energy. The energy transmitter is electrically connected to the energy converter and transmits the wireless energy in a wireless manner. The energy receiver receives the wireless energy in a wireless manner and converts the wireless energy into a second electric energy.

Abstract: A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip with three metal contacts to be driven by three-phase voltage sources. Alternatively, an AC_LED system in single chip with four metal contacts is also disclosed to be driven by four-phase voltage sources.

Abstract: A light-emitting system is introduced herein. The light-emitting system includes a substrate and a plurality of light-emitting units electrically-connected on the substrate. Each of the plurality of light-emitting units includes a plurality of light-emitting diodes arranged as a bridge rectifier. A first part of the plurality of light-emitting diodes emits light during positive half cycles of an AC power signal. A second part of the plurality of light-emitting diodes emits light during negative half cycles of the AC power signal. The third part of the plurality of light-emitting diodes comprising at least one light-emitting diode emits light during both the positive half cycles and the negative half cycles of the AC power signal.

Abstract: A new light emitting device is disclosed, including a polarizing surface layer, a light emitting layer which emits light at a wavelength, and a light transformation layer disposed between the light emitting layer and the reflective layer, wherein the light emitting layer is disposed between the reflective layer and the polarizing surface layer, and an optical thickness between the light emitting layer and the reflective layer is less than a value of five times of a quarter of the wavelength.

Abstract: An alternating current light-emitting device includes a substrate, a plurality of microdie light-emitting elements formed on the substrate, a rectifying element-dedicated member formed on a surface of a portion of microdie light-emitting elements, a rectifying unit formed on the rectifying element-dedicated member and provided with at least four rectifying elements forming a Wheatstone bridge circuit, and an electrically conductive structure electrically connecting the rectifying elements and the microdie light-emitting elements. With the rectifying unit being formed on the rectifying element-dedicated member, the rectifying elements are highly tolerant of reverse bias and feature low starting forward bias. Also, the present invention provides a method for fabricating an alternating current light-emitting device.

Abstract: A light-emitting system includes a first and second power input terminals for receiving an external power input to the light-emitting system; a first light-emitting-diode string comprising at least three light-emitting diodes placed sequentially in a first direction to allow a current flow through the at least three light-emitting diodes of the first light-emitting-diode string generally in the first direction; and a second light-emitting-diode string comprising at least three light-emitting diodes placed sequentially in a second direction to allow a current flow through the at least three light-emitting diodes of the second light-emitting-diode string generally in the second direction, The first and second light-emitting-diode strings may be serially coupled, and the first direction may be substantially vertical to the second direction.

Abstract: A light-emitting system includes a first and second power input terminals; a first, second, third, and fourth light-emitting-diode groups each having at least one light-emitting diode; a first circuit path having at least one diode from each of the first and second light-emitting-diode groups, with the diodes coupled serially and emitting light during a positive power cycle; and a second circuit path having at least one diode from each of the third and fourth light-emitting-diode groups, with the diodes coupled serially and emitting light during a negative power cycle. The second light-emitting-diode group and the third light-emitting-diode group share at least one common diode, The first and second power input terminals, the first, second, third, and fourth light-emitting-diode groups, and the first and second circuit paths may belong to a single chip light-emitting system.