Abstract: Aqueous inkjet ink compositions, methods of preparing the inkjet ink compositions, inkjet ink cartridges containing the aqueous inkjet ink composition, methods of filling a print cartridge with the aqueous inkjet ink composition, and methods of printing an image on a substrate using the inkjet ink composition are disclosed.

Abstract: A rigid connecting device for connecting the upper and lower surfaces inside an oil tank includes a connecting rod. The upper and lower sides of the connecting rod are each provided with a connecting end surface. The connecting end surface is provided with material-passing hole. The outer surface of the rigid connecting device is covered with high-density polyethylene. The upper and lower surfaces of the oil tank are connected by a connecting rod, and such arrangement is locally applied to areas where the rigidity of the oil tank is poor, so there are more effective space. The part of the rigid connecting rod contacting with the oil fuel is made of high-density polyethylene, so the requirements of strength and anti-corrosion can be satisfied.

Abstract: Aqueous inkjet ink compositions, methods of preparing the inkjet ink compositions, inkjet ink cartridges containing the aqueous inkjet ink composition, methods of filling a print cartridge with the aqueous inkjet ink composition, and methods of printing an image on a substrate using the inkjet ink composition are disclosed.

Abstract: A rigid connecting device for connecting the upper and lower surfaces inside an oil tank includes a connecting rod. The upper and lower sides of the connecting rod are each provided with a connecting end surface. The connecting end surface is provided with material-passing hole. The outer surface of the rigid connecting device is covered with high-density polyethylene. The upper and lower surfaces of the oil tank are connected by a connecting rod, and such arrangement is locally applied to areas where the rigidity of the oil tank is poor, so there are more effective space. The part of the rigid connecting rod contacting with the oil fuel is made of high-density polyethylene, so the requirements of strength and anti-corrosion can be satisfied.

Abstract: Aqueous inkjet ink compositions, methods of preparing the inkjet ink compositions, inkjet ink cartridges containing the aqueous inkjet ink composition, methods of filling a print cartridge with the aqueous inkjet ink composition, and methods of printing an image on a substrate using the inkjet ink composition are disclosed.

Abstract: A dispersion comprising a pigment, a polymer comprising a carboxyl group, a crosslinking agent capable of undergoing a crosslinking reaction with the carboxyl group, an inhibition agent comprising a tertiary amine, and a liquid carrier, wherein at least one of the mean particle size and the viscosity of the dispersion increases by less than 20% over about three months in sealed storage at ambient temperature, as determined by accelerated shelf life testing.

Abstract: A molding method of blow-molding a hollow tank body with a built-in component is provided. The method molds the hollow tank body by molding the sheet parisons in the half molds. After the moving cooperation of the half molds, an expanding mechanism of a pre-molding template device, the template half plates and the bases, the half molds are respectively leaned against the closed template half plates, and the sheet parisons are leaned against the half molds by blowing and/or sucking so as to be pre-molded. The tank body is molded after placing the component into it. A pre-molding template device is also provided. An expanding mechanism and the template half plates are mounted on the bases, and the bases are mounted on a rail bracket, the bases are driven by a power device to move on the rail bracket.

Abstract: New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.

Abstract: New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

Abstract: A dispersion comprising a pigment, a polymer comprising a carboxyl group, a crosslinking agent capable of undergoing a crosslinking reaction with the carboxyl group, an inhibition agent comprising a tertiary amine, and a liquid carrier, wherein at least one of the mean particle size and the viscosity of the dispersion increases by less than 20% over about three months in sealed storage at ambient temperature, as determined by accelerated shelf life testing.

Abstract: The present invention provides new polyimide materials suitable for use in optically transparent fiber composites, ribbon composites, and optical communications applications. The polyimide compounds include monomeric repeat units comprising a fluorinated moiety and a fluorene cardo structure. The polyimides exhibit good optical transparency and have a low absolute thermo-optic coefficient (|dn/dT|).

Abstract: New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.

Abstract: The present invention provides new polyimide materials suitable for use in optically transparent fiber composites, ribbon composites, and optical communications applications. The polyimide compounds include monomeric repeat units comprising a fluorinated moiety and a fluorene cardo structure. The polyimides exhibit good optical transparency and have a low absolute thermo-optic coefficient (|dn/dT|).

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

Abstract: A molding method of blow-molding a hollow tank body with a built-in component is provided. The method molds the hollow tank body by molding the sheet parisons in the half molds. After the moving cooperation of the half molds, an expanding mechanism of a pre-molding template device, the template half plates and the bases, the half molds are respectively leaned against the closed template half plates, and the sheet parisons are leaned against the half molds by blowing and/or sucking so as to be pre-molded. The tank body is molded after placing the component into it. A pre-molding template device is also provided. An expanding mechanism and the template half plates are mounted on the bases, and the bases are mounted on a rail bracket, the bases are driven by a power device to move on the rail bracket.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

Abstract: New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.