Patents by Inventor Wenbin KANG

Wenbin KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240171093
    Abstract: A transducer is provided for converting mechanical energy to electrical energy. The transducer (100) comprises: a substrate (120); a ferroelectric element (110) adhered to the substrate (120); and a first and second electrode (114, 115) in electrical contact with the ferroelectric element (110). The first and second electrode (114, 115) are arranged to receive charge resulting from ferroelectric domain switching of the ferroelectric element (110) in response to mechanical loading of the transducer (100). The ferroelectric element (110) is partially polarised, so that a mechanical load cycle imposed on the transducer results in a reversible cycle of ferroelectric domain switching.
    Type: Application
    Filed: February 18, 2022
    Publication date: May 23, 2024
    Inventors: Wenbin KANG, John HUBER
  • Patent number: 11764163
    Abstract: Provided are a semiconductor encapsulation structure and an encapsulation method. The structure includes a circuit board, which includes at least one electromagnetic shield area and a non-electromagnetic shield area located on one side of the electromagnetic shield area, where the circuit board internally includes a number N of metal line layers stacked in sequence and insulating layers located between adjacent metal line layers; a non-shield module and a shield module, where the non-shield module is located within the non-electromagnetic shield area, and the shield module is located within the electromagnetic shield area; a thin film encapsulation layer, located on a side of the circuit board adjacent to the first surface, where the thin film encapsulation layer covers the non-electromagnetic shield area and the electromagnetic shield area; an electromagnetic shield structure, which covers the electromagnetic shield area and forms the closed space with the circuit board.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: September 19, 2023
    Assignee: LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN) LTD.
    Inventors: Xiaolei Zhou, Peng Liu, Wenbin Kang
  • Publication number: 20230223321
    Abstract: A manufacturing method includes performing imposition on at least two discrete double-side packaged structures such that lateral electrical connection structures located on the same side of each of the at least two discrete double-side packaged structures are coplanar; and electrically mounting a first component onto lateral electrical connection structures on the first side, where a double-side packaged structure includes a substrate, the lateral electrical connection structures are formed on the first face and the second face of the substrate, and the first face is opposite to the second face and is adjacent to the first side.
    Type: Application
    Filed: June 2, 2022
    Publication date: July 13, 2023
    Applicant: LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN) LTD.
    Inventors: Xiaolei ZHOU, Yong ZHOU, Wenbin KANG
  • Publication number: 20230178515
    Abstract: A manufacturing method of a double-sided package structure includes securing at least two discrete double-sided mount structures to a first side of a master at intervals; molding the first side of the master to form a molded body encasing the at least two discrete double-sided mount structures; removing the master; and splitting the molded body to obtain individual double-sided package structures.
    Type: Application
    Filed: May 26, 2022
    Publication date: June 8, 2023
    Applicant: LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN) LTD.
    Inventors: Xiaolei ZHOU, Yong ZHOU, Wenbin KANG
  • Patent number: 11530331
    Abstract: A functional ink suitable for 3D printing and a preparation method thereof are provided. The ink includes the following components in parts by weight: 0.5-1.5 parts of a regulator, 1-5 parts of a conductive material, 0.1-0.5 parts of a crosslinking agent, 0.1-0.5 parts of a catalyst, and 10-80 parts of a solvent. The prepared functional ink has a self-healing function at room temperature, eliminating the interface resistance between printing layers and improving the mechanical strength between the layers. Moreover, the prepared functional ink has excellent electrical conductivity and a variety of electrical, magnetic, and electrochemical properties, and can be applied in the fields of functional materials and devices such as energy storage, electromagnetic shielding and stress sensing.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: December 20, 2022
    Assignee: SICHUAN UNIVERSITY
    Inventors: Chuhong Zhang, Wenbin Kang, Li Zeng, Shangwen Ling
  • Patent number: 11527487
    Abstract: The invention provides a package structure, comprising: a substrate disposed with a solid grounded copper layer; at least two radio frequency chip modules disposed on the substrate; a plastic encapsulation disposed on the substrate, covered on a surface of the substrate, and coating the at least two radio frequency chip modules therein; a groove located between the adjacent two radio frequency chip modules, and penetrating an upper surface and a lower surface of the plastic encapsulation; a solder filling body filled in the groove, wherein an upper surface of the solder filling body is flushed with the upper surface of the plastic encapsulation; and a shielding layer covered on the upper surface and lateral surfaces of the plastic encapsulation, an upper surface of the solder filling body and lateral surfaces of the substrate; wherein a position of the solid grounded copper layer corresponds to a position of the groove, and makes contact with the solder filling body in the groove.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: December 13, 2022
    Assignee: LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN) LTD.
    Inventors: Xiaolei Zhou, Wenbin Kang, Peng Liu
  • Publication number: 20220102286
    Abstract: Provided are a semiconductor encapsulation structure and an encapsulation method. The structure includes a circuit board, which includes at least one electromagnetic shield area and a non-electromagnetic shield area located on one side of the electromagnetic shield area, where the circuit board internally includes a number N of metal line layers stacked in sequence and insulating layers located between adjacent metal line layers; a non-shield module and a shield module, where the non-shield module is located within the non-electromagnetic shield area, and the shield module is located within the electromagnetic shield area; a thin film encapsulation layer, located on a side of the circuit board adjacent to the first surface, where the thin film encapsulation layer covers the non-electromagnetic shield area and the electromagnetic shield area; an electromagnetic shield structure, which covers the electromagnetic shield area and forms the closed space with the circuit board.
    Type: Application
    Filed: July 20, 2021
    Publication date: March 31, 2022
    Applicant: LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN) LTD.
    Inventors: Xiaolei ZHOU, Peng LIU, Wenbin KANG
  • Publication number: 20220064471
    Abstract: A functional ink suitable for 3D printing and a preparation method thereof are provided. The ink includes the following components in parts by weight: 0.5-1.5 parts of a regulator, 1-5 parts of a conductive material, 0.1-0.5 parts of a crosslinking agent, 0.1-0.5 parts of a catalyst, and 10-80 parts of a solvent. The prepared functional ink has a self-healing function at room temperature, eliminating the interface resistance between printing layers and improving the mechanical strength between the layers. Moreover, the prepared functional ink has excellent electrical conductivity and a variety of electrical, magnetic, and electrochemical properties, and can be applied in the fields of functional materials and devices such as energy storage, electromagnetic shielding and stress sensing.
    Type: Application
    Filed: December 30, 2019
    Publication date: March 3, 2022
    Applicant: Sichuan University
    Inventors: Chuhong ZHANG, Wenbin KANG, Li ZENG, Shangwen LING
  • Publication number: 20220020699
    Abstract: The invention provides a package structure, comprising: a substrate disposed with a solid grounded copper layer; at least two radio frequency chip modules disposed on the substrate; a plastic encapsulation disposed on the substrate, covered on a surface of the substrate, and coating the at least two radio frequency chip modules therein; a groove located between the adjacent two radio frequency chip modules, and penetrating an upper surface and a lower surface of the plastic encapsulation; a solder filling body filled in the groove, wherein an upper surface of the solder filling body is flushed with the upper surface of the plastic encapsulation; and a shielding layer covered on the upper surface and lateral surfaces of the plastic encapsulation, an upper surface of the solder filling body and lateral surfaces of the substrate; wherein a position of the solid grounded copper layer corresponds to a position of the groove, and makes contact with the solder filling body in the groove.
    Type: Application
    Filed: February 4, 2021
    Publication date: January 20, 2022
    Applicant: LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN) LTD.
    Inventors: Xiaolei ZHOU, Wenbin KANG, Peng LIU