Patents by Inventor WENBO BAI

WENBO BAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210033321
    Abstract: An air conditioning heat dissipation structure control method and a system includes the steps obtaining a real-time temperature Te of the heat generating component; if Te>Ted, opening the solenoid valve SV2 and adjusting the electronic expansion valve 4 to a preset initial opening degree; obtaining an update real-time temperature Te of the heat generating component after a setting time period; if the update real-time temperature Te>Tmax, performing the following steps every set period of time, obtaining a refrigerant temperature refrigerant temperature Tin at the inlet end of the refrigerant heat dissipation pipe and a refrigerant temperature Tout at the outlet end of the refrigerant heat dissipation pipe; calculating a real-time temperature difference ?Treal-time of the inlet end temperature Tin and the outlet end temperature Tout, wherein ?Treal-time=Tout?Tin, obtaining a preset target temperature difference ?Ttarget and calculating a deviation ?Tdeviation, ?Tdeviation=?Treal-time??Ttarget; calculatin
    Type: Application
    Filed: January 28, 2019
    Publication date: February 4, 2021
    Applicants: QINGDAO HAIER AIR-CONDITIONING ELECTRONIC CO., LTD., HAIER SMART HOME CO., LTD.
    Inventors: YUHUI LIU, SHAOJIANG CHENG, XUEFEI HE, WENBO BAI, YU LENG