Abstract: A sensing substrate and a manufacturing method thereof are provided. The sensing substrate includes a base substrate, a heat electrode and a strain detection electrode which are disposed on the base substrate, and an insulation layer covering the heat electrode and the strain detection electrode. The heat electrode is configured for heating, and the strain detection electrode is configured to detect strain. The heat electrode and the strain detection electrode each have a metal mesh structure.

Abstract: A sensor chip is provided. The sensor chip includes a first base substrate; a piezoresistor and a resistor lead on the first base substrate; a second base substrate on a side of the piezoresistor and the resistor lead away from the first base substrate; a metal wire bond extending through the second base substrate and connected to the resistor lead; a redistribution layer on a side of the second base substrate away from the first base substrate; and a pressure reference chamber between the first base substrate and the second base substrate. The first base substrate and the second base substrate encapsulate at least a portion of the piezoresistor inside the pressure reference chamber. The metal wire bond is connected to the resistor lead, and is connected to the redistribution layer. The resistor lead is connected to the piezoresistor.

Abstract: The present disclosure provides a detection apparatus, a training method and a training apparatus. The detection apparatus includes a plurality of MEMS sensors configured to collect signals to be detected in real time and output sensing signals according to the signals to be detected; a processing module configured to receive the sensing signals of the plurality of MEMS sensors and determine a detection result of the detection apparatus according to the sensing signals of the plurality of MEMS sensors at each sampling time; wherein, there is a predetermined interval duration between two adjacent sampling times, and a sensing signal of each of the MEMS sensors at the current sampling time is related to a signal to be detected at the current sampling time, a sensing signal at the previous sampling time and an attenuation coefficient.

Abstract: A filter circuit includes a first resonant sub-circuit, a second resonant sub-circuit and an impedance matching network; the first resonant sub-circuit and the second resonant sub-circuit are each connected to the impedance matching network in series; the first resonant sub-circuit is configured to allow a signal with a frequency higher than a first frequency to pass; the second resonant sub-circuit is configured to allow a signal with a frequency lower than a second frequency to pass, and the second frequency is greater than the first frequency; the impedance matching network is configured to allow a signal between the first frequency and the second frequency to pass; the impedance matching network includes a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor and a first inductor.

Abstract: A substrate integrated with passive devices and a manufacturing method thereof are provided.

Abstract: A filter, a method for manufacturing a filter and an electronic apparatus are provided, and belongs to the field of passive device technology. The filter includes a dielectric substrate, and at least one inductor and at least one capacitor integrated thereon. The dielectric substrate includes first connection vias penetrating through the dielectric substrate in a thickness direction thereof, and opposite first and second surfaces in the thickness direction. Each inductor includes first and second conductive structures respectively on the first and second surfaces, and first connection electrodes in the first connection vias. The first conductive structures and the second conductive structures form a coil structure of the inductor by the first connection electrodes. A buffer layer is provided between the first conductive structures and the first surface. Each first conductive structure is electrically connected to the first connection electrode by a second connection via penetrating through the buffer layer.

Abstract: A bulk acoustic wave resonator, a manufacturing method thereof and a filter are provided and belong to the technical field of radio frequency micro-electro-mechanical system. The resonator includes a dielectric substrate, a first electrode, a piezoelectric layer, and a second electrode. The dielectric substrate has a first cavity penetrating through the dielectric substrate in a thickness direction thereof, and the first cavity includes a first opening penetrating through the first surface, and a second opening penetrating through the second surface. The first opening includes first sides sequentially arranged in a clockwise direction, and first connecting sides each connecting two adjacent first sides; the second opening includes second sides sequentially arranged in a clockwise direction, and second connecting sides each connecting two adjacent second sides.

Abstract: The present disclosure provides a hybrid filter, a preparation method thereof, and a filtering apparatus. The hybrid filter includes a first substrate (100) and a second substrate (200) disposed oppositely, a first space (300) is disposed between the first substrate (100) and the second substrate (200), at least one of the first substrate (100) and the second substrate (200) is provided with a film bulk acoustic resonator (30), at least one of the first substrate (100) and the second substrate (200) is provided with at least one passive filter (40), the film bulk acoustic resonator (30) is disposed in the first space (300) and is connected with the passive filter (40), the passive filter (40) includes a filtering inductor and a filtering capacitor, and the filtering inductor has a three-dimensional spiral inductor structure.

Abstract: The present disclosure provides an inductor, a manufacturing method therefor, a filter and an electronic device, belongs to the technical field of passive devices. The inductor according to the present disclosure includes a dielectric substrate and N coil structures disposed on the dielectric substrate; the N coil structures are nested and electrically connected in sequence, wherein N is an integer greater than or equal to 2. Any one of the coil structures includes a plurality of layers of sub-coils disposed on the dielectric substrate in sequence, and at least one interlayer insulating layer is disposed between sub-coils disposed adjacently, and adjacent layers of sub-coils are electrically connected through a first connection via penetrating the interlayer insulating layer between the adjacent layers of sub-coils.

Abstract: An MEMS pressure sensor, a method for manufacturing an MEMS pressure sensor, and a pressure detection device are provided. The MEMS pressure sensor includes: an adapter board; an integrated circuit chip on one side of the adapter board; and a sensor chip on a side of the adapter board away from the integrated circuit chip. The sensor chip includes a first electrode and a second electrode, and the first electrode is between the adapter board and the second electrode; the second electrode includes a pressure-sensitive portion opposite to the first electrode and an edge portion surrounding the pressure-sensitive portion, the edge portion is fixed onto the adapter board by a bonding layer, and the first electrode, the second electrode, the bonding layer and the adapter board define a cavity. The first and second electrodes of the sensor chip are electrically connected to the integrated circuit chip through the adapter board.

Abstract: A filter circuit includes a first resonant sub-circuit, a second resonant sub-circuit and an impedance matching network; the first resonant sub-circuit and the second resonant sub-circuit are each connected to the impedance matching network in series; the first resonant sub-circuit is configured to allow a signal with a frequency higher than a first frequency to pass; the second resonant sub-circuit is configured to allow a signal with a frequency lower than a second frequency to pass, and the second frequency is greater than the first frequency; the impedance matching network is configured to allow a signal between the first frequency and the second frequency to pass; the impedance matching network includes a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor and a first inductor.

Abstract: The present disclosure provides a filter unit and a manufacturing method therefor, and an electronic device, relating to the technical field of radio frequency micro-electromechanical systems. The filter unit includes a resonant structure; and a substrate disposed at one side of the resonant structure, the substrate including a modified structure and a supporting structure surrounding the modified structure, and a cavity being formed between the modified structure and the resonant structure. The filter unit provided in the present disclosure can greatly simplify the process manufacturing flow and reduce the process manufacturing procedure difficulty by forming a cavity between the modified structure and the resonant structure.

Abstract: A filter and a manufacturing method thereof are provided. The filler includes a first inductor, and further includes: a base substrate, having a plurality of through-holes passing therethrough; a plurality of conductive pillars, respectively corresponding to the through-holes, filled in the through-hole corresponding thereto, and forming a portion of a coil of the first inductor; a first conductive layer, provided on the base substrate, and comprising a plurality of first conductive wires, the first conductive wire being connected between two conductive pillars, and being configured to form a portion of the coil of the first inductor; and a second conductive layer, provided on a side, away from the base substrate, of the first conductive layer, and comprising second conductive wires, the second conductive wires corresponding to the first conductive wires respectively, and the second conductive wire being connected to the first conductive wire corresponding thereto through a via-hole.

Abstract: Provided is a package structure, including: an insulating dielectric layer having a first surface and a second surface opposite to each other, wherein at least one first accommodation space running from the first surface to the second surface is formed in the insulating dielectric layer; and at least one conductive post in one-to-one correspondence with the at least one first accommodation space, wherein the conductive post is within the corresponding first accommodation space, a material of the conductive post comprises a non-metallic conductive material, and an absolute value of a difference between a thermal expansion coefficient of the conductive post and a thermal expansion coefficient of the insulating dielectric layer is less than or equal to 8×10?6/° C.; wherein the at least one conductive post comprises at least one first conductive post, two end faces of the first conductive post are flush with the first surface and the second surface, respectively.

Abstract: Disclosed are a barometric pressure sensor and a method for preparing the same, and an electronic device, which relate to the technical field of sensors. The barometric pressure sensor includes a base substrate, and a first capacitor provided on a side of the base substrate. The first capacitor includes a first bottom electrode provided close to the base substrate; a first insulating layer provided on a side of the first bottom electrode away from the base substrate; and a first top electrode provided on a side of the first insulating layer away from the base substrate. The first top electrode is provided with a first opening which is configured to expose the first insulating layer at a corresponding position. A dielectric constant of the first insulating layer may vary with different humidity environments, so that a capacitance value of the first capacitor varies.

Abstract: A filter and a method for manufacturing a filter are provided and belong to the field of electronics technology. The method includes forming at least one inductor and at least one capacitor. Forming the at least one inductor includes: providing a first dielectric substrate; the first dielectric substrate includes a first surface and a second surface opposite to each other along a thickness direction thereof; forming first sub-structures of the inductor on the first surface; forming first connection vias penetrating through the first dielectric substrate in the thickness direction thereof; forming first connection electrodes in the first connection vias; and forming second sub-structures of the inductor on the second surface; the first connection electrodes sequentially connects the first and second sub-structures through the first connection vias to form a coil structure of the inductor.

Abstract: An inductor, a manufacturing method for an inductor, a filter and an electronic device are provided, and belongs to the field of electronic device technology. The inductor includes: a first dielectric substrate including opposite first and second surfaces along a thickness direction of the first dielectric substrate, wherein the first dielectric substrate is provided with first connection vias penetrating through the first dielectric substrate along the thickness direction, and a first groove penetrating through a part of the first dielectric substrate in the thickness direction; first sub-structures on the first surface; second sub-structures on the second surface; first connection electrodes in the first connection vias, wherein the first and second sub-structures are sequentially connected together through the first connection electrodes to form a coil structure of the inductor; and a magnetic core in the first groove to be insulated from the first and second sub-structures and in the coil structure.

Abstract: The present disclosure provides dimming glass, a dimming module and an operating method thereof. The dimming glass includes: a first glass substrate and a second glass substrate arranged opposite to each other; a first electrode and a second electrode arranged between the first glass substrate and the second glass substrate; a liquid crystal dimming layer arranged between the first glass substrate and the second glass substrate; and a heating layer arranged between the liquid crystal dimming layer and the first glass substrate, and configured to heat the liquid crystal dimming layer upon the receipt of an electric signal.

Abstract: Provided are a substrate, a method for preparing the substrate, an integrated passive device, and an electronic apparatus. The method for preparing the substrate includes: providing a base substrate including at least one blind via, wherein the base substrate includes a first surface and a second surface disposed oppositely, a blind via extends from a first surface side to interior of the base substrate, and an aperture of the blind via gradually decreases in a direction from the first surface to the second surface; forming a connection electrode in the blind via; thinning the base substrate along a direction from the second surface to the first surface, wherein the blind via on the thinned base substrate forms a via hole penetrating the base substrate.

Abstract: A MEMS switch includes an insulating substrate, a driving electrode, a first insulating layer, a first surface of the insulating substrate is provided with a first region, the first region is closer to a surface of the insulating substrate away from the first surface, relative to the first surface, and the driving electrode is on the first region; the first insulating layer completely covers the driving electrode; the first signal transmission line is on a surface of the first insulating layer away from the insulating substrate; and the second signal transmission line includes a signal transmission segment and a cantilever segment connected together as a one-piece member, the signal transmission segment is on the first surface of the insulating substrate, and the cantilever segment is suspended on a side of the first signal transmission line away from the insulating substrate.