Patents by Inventor Wenbo Luo

Wenbo Luo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12294343
    Abstract: Provided in the present invention are a cavity-type bulk acoustic resonator without the need to prepare a sacrificial layer, and a preparation method therefor, comprising the following steps: taking a piezoelectric single crystal wafer subjected to ion implantation and having a bottom electrode, and forming a cavity on the side of the piezoelectric single crystal wafer having the bottom electrode; then taking a substrate, and bonding the substrate to the side of the piezoelectric single crystal wafer having the cavity; performing heat treatment on the bonded intermediate product to peel off the thin film of the piezoelectric single crystal wafer; and producing a top electrode on the peeled side of the piezoelectric single crystal wafer.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: May 6, 2025
    Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA
    Inventors: Yao Shuai, Chuangui Wu, Wenbo Luo
  • Patent number: 11901097
    Abstract: A round superconductor wire and method for fabricating same are disclosed. Embodiments are directed to a round superconductor wire including at least two superconductor tapes wound on a wire former. Each superconductor tape includes: bottom stabilizer and silver layers; substrate disposed above the bottom silver layer; buffer film stack disposed above the substrate; superconductor film disposed above the buffer film stack; top silver layer disposed above the superconductor film; and top stabilizer layer disposed above the top silver layer. At least one of the bottom stabilizer layer, bottom silver layer, substrate, buffer film stack, superconductor film, top silver layer, or top stabilizer layer is of a different width, thickness, or material composition in one of the superconductor tapes than in another of the superconductor tapes. These and other embodiments achieve a round superconductor wire having improved current density in high magnetic field applications when made in small diameters.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: February 13, 2024
    Assignees: University of Houston System, AMPEERS LLC
    Inventors: Goran Majkic, Anis Ben Yahia, Wenbo Luo, Venkat Selvamanickam, Soumen Kar
  • Patent number: 11779300
    Abstract: A method of detecting flow instability includes insonating an area of interest with ultrasound wave pulses, acquiring radio frequency (RF) data from echo pulses of the ultrasound wave pulses, processing the RF data, and deriving a Doppler band-width from the processed RF data by AR modeling. Also described herein is a device for detecting flow instability. The device includes an emitter configured to insonate ultrasound wave pulses on an area of interest, a receiver configured to acquiring radio frequency (RF) data from echo pulses of the ultrasound wave pulses, and a processor configured to process the RF data, and derive a Doppler band-width from the processed RF data by AR modeling.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: October 10, 2023
    Assignee: BIOPROBER CORPORATION
    Inventors: Yat Shun Yiu, Adrian Jian Yuan Chee, Alfred Cheuk Hang Yu, Guo Tang, Wenbo Luo
  • Publication number: 20220321078
    Abstract: The present invention provides a preparation method of solid reflection-type bulk acoustic resonator, including the following steps: taking a piece of ion-implanted piezoelectric material, growing reflecting layers below the implantation face of the piezoelectric material and/or above the substrate, then taking a substrate, and bonding it to the piezoelectric material; heating the bonded intermediate product gained to strip the film from the piezoelectric material and growing an upper electrode on the stripped side of the piezoelectric material. According to the preparation method of solid reflection-type bulk acoustic resonator disclosed in the present invention, resonators with high strength and good performance can be prepared by using wafer bonding and lay transfer technique for preparing high-quality piezoelectric films and combining the solid reflecting layer structure.
    Type: Application
    Filed: November 13, 2019
    Publication date: October 6, 2022
    Inventors: Yao SHUAI, Chuangui WU, Wenbo LUO
  • Publication number: 20220149803
    Abstract: Provided in the present invention are a cavity-type bulk acoustic resonator without the need to prepare a sacrificial layer, and a preparation method therefor, comprising the following steps: taking a piezoelectric single crystal wafer subjected to ion implantation and having a bottom electrode, and forming a cavity on the side of the piezoelectric single crystal wafer having the bottom electrode; then taking a substrate, and bonding the substrate to the side of the piezoelectric single crystal wafer having the cavity; performing heat treatment on the bonded intermediate product to peel off the thin film of the piezoelectric single crystal wafer; and producing a top electrode on the peeled side of the piezoelectric single crystal wafer.
    Type: Application
    Filed: November 13, 2019
    Publication date: May 12, 2022
    Inventors: Yao SHUAI, Chuangui WU, Wenbo LUO
  • Publication number: 20210358660
    Abstract: A round superconductor wire and method for fabricating same are disclosed. Embodiments are directed to a round superconductor wire including at least two superconductor tapes wound on a wire former. Each superconductor tape includes: bottom stabilizer and silver layers; substrate disposed above the bottom silver layer; buffer film stack disposed above the substrate; superconductor film disposed above the buffer film stack; top silver layer disposed above the superconductor film; and top stabilizer layer disposed above the top silver layer. At least one of the bottom stabilizer layer, bottom silver layer, substrate, buffer film stack, superconductor film, top silver layer, or top stabilizer layer is of a different width, thickness, or material composition in one of the superconductor tapes than in another of the superconductor tapes. These and other embodiments achieve a round superconductor wire having improved current density in high magnetic field applications when made in small diameters.
    Type: Application
    Filed: October 28, 2019
    Publication date: November 18, 2021
    Inventors: Goran Majkic, Anis Ben Yahia, Wenbo Luo, Venkat Selvamanickam, Soumen Kar
  • Publication number: 20200077972
    Abstract: A method of detecting flow instability includes insonating an area of interest with ultrasound wave pulses, acquiring radio frequency (RF) data from echo pulses of the ultrasound wave pulses, processing the RF data, and deriving a Doppler band-width from the processed RF data by AR modeling. Also described herein is a device for detecting flow instability. The device includes an emitter configured to insonate ultrasound wave pulses on an area of interest, a receiver configured to acquiring radio frequency (RF) data from echo pulses of the ultrasound wave pulses, and a processor configured to process the RF data, and derive a Doppler band-width from the processed RF data by AR modeling.
    Type: Application
    Filed: September 6, 2019
    Publication date: March 12, 2020
    Inventors: Yat Shun YIU, Adrian Jian Yuan CHEE, Alfred Cheuk Hang YU, Guo TANG, Wenbo LUO
  • Patent number: 9520445
    Abstract: Various embodiments describe an integrated non-volatile component. The component may include a surface contact with associated mating contact wherein a ferroelectric layer is used as a conductive channel having variable conductivity and the surface contact and/or the associated mating contact are/is embodied as a rectifying contact and, as a result of an applied voltage between the surface contact and the associated mating contact, a non-volatile space charge zone forms in the surface contact terminal region and/or mating contact terminal region in the ferroelectric layer.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: December 13, 2016
    Assignee: HELMHOLTZ-ZENTRUM DRESDEN-ROSSENDORF E. V.
    Inventors: Heidemarie Schmidt, Yao Shuai, Shengqiang Zhou, Ilona Skorupa, Xin Ou, Nan Du, Christian Mayr, Wenbo Luo
  • Publication number: 20140312400
    Abstract: Various embodiments describe an integrated non-volatile component. The component may include a surface contact with associated mating contact wherein a ferroelectric layer is used as a conductive channel having variable conductivity and the surface contact and/or the associated mating contact are/is embodied as a rectifying contact and, as a result of an applied voltage between the surface contact and the associated mating contact, a non-volatile space charge zone forms in the surface contact terminal region and/or mating contact terminal region in the ferroelectric layer.
    Type: Application
    Filed: July 12, 2012
    Publication date: October 23, 2014
    Applicant: HELMHOLTZ-ZENTRUM DRESDEN-ROSSENDORF E. V.
    Inventors: Heidemarie Schmidt, Yao Shuai, Shengqiang Zhou, Ilona Skorupa, Xin Ou, Nan Du, Christian Mayr, Wenbo Luo
  • Patent number: D1006808
    Type: Grant
    Filed: July 24, 2023
    Date of Patent: December 5, 2023
    Inventor: Wenbo Luo
  • Patent number: D1022999
    Type: Grant
    Filed: January 17, 2024
    Date of Patent: April 16, 2024
    Inventor: Wenbo Luo
  • Patent number: D1027848
    Type: Grant
    Filed: January 17, 2024
    Date of Patent: May 21, 2024
    Inventor: Wenbo Luo
  • Patent number: D1043675
    Type: Grant
    Filed: August 3, 2023
    Date of Patent: September 24, 2024
    Inventor: Wenbo Luo