Patents by Inventor Wenchao Jin

Wenchao Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250081115
    Abstract: This invention discloses an adaptive low-power method, device, and medium for the MAC layer of a wireless sensor network. The method includes: determining the environmental traffic based on the number of packets sent and received by nodes within a set timeframe; obtaining the remaining battery energy percentage; establishing the average node frequency based on the power of all nodes; setting the maximum duty cycle frequency (RDCmax) and minimum duty cycle frequency (RDCmin). When the remaining battery energy percentage is above 50%, adjusting the current duty cycle frequency based on the environmental traffic; when the remaining battery energy percentage is approximately 20% to 50%, reducing the maximum duty cycle frequency (RDCmax) to limit the maximum change in duty cycle frequency while adjusting the current duty cycle frequency based on environmental traffic.
    Type: Application
    Filed: January 9, 2024
    Publication date: March 6, 2025
    Inventors: Zhiqun Wang, Bo Zhang, Minghe Zhu, Zikai Jin, Zhen Yang, Wenchao Zhao
  • Patent number: 11212611
    Abstract: A MEMS microphone and a manufacturing method thereof. The method comprises: sequentially forming a first isolation layer, a diaphragm, and a second isolation layer on a substrate; sequentially forming a first protective layer, a backplate electrode, and a second protective layer on the second isolation layer; forming a release hole penetrating through the first protective layer, the backplate electrode, and the second protective layer; forming an acoustic cavity penetrating through the substrate; releasing the diaphragm through the acoustic cavity and the release hole; and forming a groove on a surface of the first isolation layer, wherein the diaphragm conformally covers the surface of the first isolation layer, thereby forming a spring structure at a position of the groove.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: December 28, 2021
    Assignees: HANGZHOU SILAN INTEGRATED CIRCUIT CO., LTD., HANGZHOU SILAN MICROELECTRONICS CO., LTD.
    Inventors: Yongxiang Wen, Fuhe Sun, Chen Liu, Wenchao Jin, Wenliang Sun
  • Publication number: 20210168497
    Abstract: A MEMS microphone and a manufacturing method thereof. The method comprises: sequentially forming a first isolation layer, a diaphragm, and a second isolation layer on a substrate; sequentially forming a first protective layer, a backplate electrode, and a second protective layer on the second isolation layer; forming a release hole penetrating through the first protective layer, the backplate electrode, and the second protective layer; forming an acoustic cavity penetrating through the substrate; releasing the diaphragm through the acoustic cavity and the release hole; and forming a groove on a surface of the first isolation layer, wherein the diaphragm conformally covers the surface of the first isolation layer, thereby forming a spring structure at a position of the groove.
    Type: Application
    Filed: January 23, 2020
    Publication date: June 3, 2021
    Inventors: Yongxiang Wen, Fuhe Sun, Chen Liu, Wenchao Jin, Wenliang Sun
  • Patent number: D1029036
    Type: Grant
    Filed: September 5, 2022
    Date of Patent: May 28, 2024
    Assignee: Keeson Technology Corporation Limited
    Inventors: Huafeng Shan, Xiaodong Shou, Yifan Ma, Qi Shen, Jijia Liu, Mengjie Su, Lingfeng Yu, Xintao Shen, Wenchao Jin
  • Patent number: D1036487
    Type: Grant
    Filed: September 6, 2022
    Date of Patent: July 23, 2024
    Assignee: Keeson Technology Corporation Limited
    Inventors: Huafeng Shan, Xiaodong Shou, Yifan Ma, Qi Shen, Jijia Liu, Mengjie Su, Lingfeng Yu, Xintao Shen, Wenchao Jin