Abstract: The present disclosure relates to the technical field of medical devices, and in particular to catheter implant systems and included associated device, prosthetic heart valves and method. The interventional delivery system included includes a catheter assembly and a control handle connected to the catheter assembly, the catheter assembly has opposing distal and proximal ends and includes an inner sheath and an outer sheath slidably engaged with each other, the outer sheath includes a loading section and a sheath section in sequence from the distal end to the proximal end, the loading section is configured to enclose and keep the interventional device in a compressed state; the control handle includes a main handle and an auxiliary handle slidably fitted over the inner sheath, the proximal end of the inner sheath is connected to the main handle and the proximal end of the outer sheath is connected to the auxiliary handle.

Abstract: A MEMS microphone and a manufacturing method thereof. The method comprises: sequentially forming a first isolation layer, a diaphragm, and a second isolation layer on a substrate; sequentially forming a first protective layer, a backplate electrode, and a second protective layer on the second isolation layer; forming a release hole penetrating through the first protective layer, the backplate electrode, and the second protective layer; forming an acoustic cavity penetrating through the substrate; releasing the diaphragm through the acoustic cavity and the release hole; and forming a groove on a surface of the first isolation layer, wherein the diaphragm conformally covers the surface of the first isolation layer, thereby forming a spring structure at a position of the groove.

Abstract: A MEMS microphone and a manufacturing method thereof. The method comprises: sequentially forming a first isolation layer, a diaphragm, and a second isolation layer on a substrate; sequentially forming a first protective layer, a backplate electrode, and a second protective layer on the second isolation layer; forming a release hole penetrating through the first protective layer, the backplate electrode, and the second protective layer; forming an acoustic cavity penetrating through the substrate; releasing the diaphragm through the acoustic cavity and the release hole; and forming a groove on a surface of the first isolation layer, wherein the diaphragm conformally covers the surface of the first isolation layer, thereby forming a spring structure at a position of the groove.