Patents by Inventor Wenchao Jin

Wenchao Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS microphone and manufacturing method thereof
    Patent number: 11212611
    Abstract: A MEMS microphone and a manufacturing method thereof. The method comprises: sequentially forming a first isolation layer, a diaphragm, and a second isolation layer on a substrate; sequentially forming a first protective layer, a backplate electrode, and a second protective layer on the second isolation layer; forming a release hole penetrating through the first protective layer, the backplate electrode, and the second protective layer; forming an acoustic cavity penetrating through the substrate; releasing the diaphragm through the acoustic cavity and the release hole; and forming a groove on a surface of the first isolation layer, wherein the diaphragm conformally covers the surface of the first isolation layer, thereby forming a spring structure at a position of the groove.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: December 28, 2021
    Assignees: HANGZHOU SILAN INTEGRATED CIRCUIT CO., LTD., HANGZHOU SILAN MICROELECTRONICS CO., LTD.
    Inventors: Yongxiang Wen, Fuhe Sun, Chen Liu, Wenchao Jin, Wenliang Sun
  • MEMS MICROPHONE AND MANUFACTURING METHOD THEREOF
    Publication number: 20210168497
    Abstract: A MEMS microphone and a manufacturing method thereof. The method comprises: sequentially forming a first isolation layer, a diaphragm, and a second isolation layer on a substrate; sequentially forming a first protective layer, a backplate electrode, and a second protective layer on the second isolation layer; forming a release hole penetrating through the first protective layer, the backplate electrode, and the second protective layer; forming an acoustic cavity penetrating through the substrate; releasing the diaphragm through the acoustic cavity and the release hole; and forming a groove on a surface of the first isolation layer, wherein the diaphragm conformally covers the surface of the first isolation layer, thereby forming a spring structure at a position of the groove.
    Type: Application
    Filed: January 23, 2020
    Publication date: June 3, 2021
    Inventors: Yongxiang Wen, Fuhe Sun, Chen Liu, Wenchao Jin, Wenliang Sun
  • Computer screen with graphical user interface
    Patent number: D1029036
    Type: Grant
    Filed: September 5, 2022
    Date of Patent: May 28, 2024
    Assignee: Keeson Technology Corporation Limited
    Inventors: Huafeng Shan, Xiaodong Shou, Yifan Ma, Qi Shen, Jijia Liu, Mengjie Su, Lingfeng Yu, Xintao Shen, Wenchao Jin