Patents by Inventor Wenchao SHUI

Wenchao SHUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11757201
    Abstract: The present disclosure discloses an MXene-based terahertz wave broadband super-strong absorbing foam, and belongs to the technical field of electromagnetic functional materials. The MXene-based terahertz wave broadband super-strong absorbing foam includes a porous polymer foam and a MXene nanosheet attached onto the porous polymer foam, wherein the MXene nanosheet is attached onto the porous polymer foam in a coating form, a film forming form and a suspension form; the average pore diameter of the porous polymer foam ?500 ?m, the thickness of the porous polymer foam ?10 mm, and the filling mass of the MXene nanosheet is less than 50% of the mass of the absorbing foam.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: September 12, 2023
    Assignee: University of Electronic Science and Technology of China
    Inventors: Qiye Wen, Wenchao Shui, Xu Xiao, Yang Xing, Qinghui Yang, Huaiwu Zhang, Jianmin Li
  • Publication number: 20220045434
    Abstract: The present disclosure discloses an MXene-based terahertz wave broadband super-strong absorbing foam, and belongs to the technical field of electromagnetic functional materials. The MXene-based terahertz wave broadband super-strong absorbing foam includes a porous polymer foam and a MXene nanosheet attached onto the porous polymer foam, wherein the MXene nanosheet is attached onto the porous polymer foam in a coating form, a film forming form and a suspension form; the average pore diameter of the porous polymer foam ?500 ?m, the thickness of the porous polymer foam ?10 mm, and the filling mass of the MXene nanosheet is less than 50% of the mass of the absorbing foam.
    Type: Application
    Filed: June 16, 2021
    Publication date: February 10, 2022
    Applicant: University of Electronic Science and Technology of China
    Inventors: Qiye WEN, Wenchao SHUI, Xu XIAO, Yang XING, Qinghui YANG, Huaiwu ZHANG, Jianmin LI