Patents by Inventor Wen-Cheng Li

Wen-Cheng Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKS
    Publication number: 20130015589
    Abstract: A multi-die semiconductor device is disclosed. The device may include one or more first-sized die on a substrate and one or more second-sized die affixed over the one or more first-sized die. The second-sized die may have a larger footprint than the first-sized die. An internal molding compound may be provided on the substrate having a footprint the same size as the second-sized die. The second-sized die may be supported on the internal molding compound. Thereafter, the first and second-sized die and the internal molding compound may be encapsulated in an external molding compound.
    Type: Application
    Filed: July 14, 2011
    Publication date: January 17, 2013
    Inventors: Chih-Chin Liao, Chin-Tien Chiu, Cheeman Yu, Suresh Kumar Upadhyayula, Wen Cheng Li, Zhong Lu
  • Feeding system for plasma melting-furnace
    Patent number: 7644668
    Abstract: The present invention provides a feeding system which operates under an environment of negative pressure on feeding waste materials to prevent contaminant of a plasma furnace from leakage and so can be used in related industries of processing radioactive wastes.
    Type: Grant
    Filed: October 28, 2005
    Date of Patent: January 12, 2010
    Assignee: Atomic Energy Council
    Inventors: Mau-Suei Kuo, Tsung-Min Hung, Wen-Cheng Li
  • Feeding system for plasma melting-furnace
    Publication number: 20070095258
    Abstract: The present invention provides a feeding system which operates under an environment of negative pressure on feeding waste materials to prevent contaminant of a plasma furnace from leakage and so can be used in related industries of processing radioactive wastes.
    Type: Application
    Filed: October 28, 2005
    Publication date: May 3, 2007
    Inventors: Mau-Suei Kuo, Tsung-Min Hung, Wen-Cheng Li