Patents by Inventor Wen-Chi Yu

Wen-Chi Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11973055
    Abstract: In an embodiment, a device includes: a first wafer including a first substrate and a first interconnect structure, a sidewall of the first interconnect structure forming an obtuse angle with a sidewall of the first substrate; and a second wafer bonded to the first wafer, the second wafer including a second substrate and a second interconnect structure, the sidewall of the first substrate being laterally offset from a sidewall of the second substrate and a sidewall of the second interconnect structure.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou, Chen-Hua Yu
  • Publication number: 20240117070
    Abstract: Disclosed herein are recombinant antibodies or the fragment thereof for detecting ganglioside GM2 activator (GM2A) protein in vitro. Also disclosed herein are kits and methods for determining whether a subject has or is at risk of developing lung cancer with the aid of the present recombinant antibodies.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Jen-Chieh YU, Wen-Chi HUANG
  • Publication number: 20240088123
    Abstract: A device package includes a first die directly bonded to a second die at an interface, wherein the interface comprises a conductor-to-conductor bond. The device package further includes an encapsulant surrounding the first die and the second die and a plurality of through vias extending through the encapsulant. The plurality of through vias are disposed adjacent the first die and the second die. The device package further includes a plurality of thermal vias extending through the encapsulant and a redistribution structure electrically connected to the first die, the second die, and the plurality of through vias. The plurality of thermal vias is disposed on a surface of the second die and adjacent the first die.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Chen-Hua Yu, Yung-Chi Lin, Wen-Chih Chiou
  • Patent number: 4779907
    Abstract: A suitcase lock comprises a manually operable actuator mounted in a bowed handle of a suitcase to actuate a guiding means which incorporates a combination lock and which in turn moves a release plate. The release plate has two opposite ends connecting with two locking means which are unlocked upon moving the release plate. The guiding means is provided with a means that prevents the suitcase lock from unlocking when the suitcase is not in a correct position.
    Type: Grant
    Filed: May 4, 1987
    Date of Patent: October 25, 1988
    Assignee: Tatie Industrial Co., Ltd.
    Inventor: Wen-Chi Yu
  • Patent number: 4773123
    Abstract: The automatically extensible and retractable wheel unit for mounting on a corner of a suitcase includes a housing with an aperture at the underside thereof, a bifurcated bracket pivotally supported on the housing, a wheel carried rotatably on the bracket for pivoting along with the bracket between a retracted position and an extended position, and a push-pull member pivotally supported on the housing and connected to a bracket by a C-shaped spring member. When the wheel is in the retracted position, a portion of the push-pull member extends out of the aperture so as to be contacted with the ground to push the wheel automatically out of the aperture as long as the suitcase is brought into a transported state. When the wheel is in the extended position, another portion of the push-pull member extends out of the aperture so as to be contacted with the ground to pull the wheel automatically back into the aperture as long as the suitcase being in a stationary state.
    Type: Grant
    Filed: February 2, 1987
    Date of Patent: September 27, 1988
    Assignee: Tatie Industrial Co., Ltd.
    Inventor: Wen-Chi Yu